e8ed7b1d1b
This patch adds a tool called DSENT to the ext/ directory. DSENT is a tool that models power and area for on-chip networks. The next patch adds a script for using the tool.
181 lines
6.4 KiB
Text
181 lines
6.4 KiB
Text
# WARNING: Most commercial fabs will not be happy if you release their exact
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# process information! If you derive these numbers through SPICE models,
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# the process design kit, or any other confidential material, please round-off
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# the values and leave the process name unidentifiable by fab (i.e. call it
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# Bulk90LVT instead of TSMC90LVT) if you release parameters publicly. This
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# rule may not apply for open processes, but you may want to check.
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# All units are in SI, (volts, meters, kelvin, farads, ohms, amps, etc.)
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# This file contains the model for a Tri-Gate (Multi-Gate) 11nm LVT process
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Name = TG11LVT
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# Supply voltage used in the circuit and for characterizations (V)
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Vdd = 0.6
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# Temperature (K)
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Temperature = 340
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# =============================================================================
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# Parameters for transistors
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# =============================================================================
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# Contacted gate pitch (m)
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Gate->PitchContacted = 0.080e-6
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# Min gate width (m)
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Gate->MinWidth = 0.080e-6
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# Gate cap per unit width (F/m)
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Gate->CapPerWidth = 0.61e-9
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# Source/Drain cap per unit width (F/m)
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Drain->CapPerWidth = 0.56e-9
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# Parameters characterization temperature (K)
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Nmos->CharacterizedTemperature = 300.0
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Pmos->CharacterizedTemperature = 300.0
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#------------------------------------------------------------------------------
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# I_Eff definition in Na, IEDM 2002
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# I_EFF = (I(VG = 0.5, VD = 1.0) + I(VG = 1.0, VD = 0.5))/2
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# R_EFF = VDD / I_EFF * 1 / (2 ln(2))
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# This is generally more accurate for when the delay is input transition time
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# limited
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#------------------------------------------------------------------------------
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# Effective resistance (Ohm-m)
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Nmos->EffResWidth = 1.16e-3
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Pmos->EffResWidth = 1.28e-3
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#------------------------------------------------------------------------------
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# The ratio of extra effective resistance with each additional stacked
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# transistor
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# EffResStackRatio = (R_EFF_NAND2 - R_EFF_INV) / R_EFF_INV)
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# For example, inverter has an normalized effective drive resistance of 1.0.
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# A NAND2 (2-stack) will have an effective drive of 1.0 + 0.7, a NAND3 (3-stack)
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# will have an effective drive of 1.0 + 2 * 0.7. Use NORs for Pmos. This fit
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# works relatively well up to 4 stacks. This value will change depending on the
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# VDD used.
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#------------------------------------------------------------------------------
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# Effective resistance stack ratio
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Nmos->EffResStackRatio = 0.89
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Pmos->EffResStackRatio = 0.86
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#------------------------------------------------------------------------------
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# I_OFF defined as |I_DS| for |V_DS| = V_DD and |V_GS| = 0.0
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# Minimum off current is used in technologies where I_OFF stops scaling
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# with transistor width below some threshold
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#------------------------------------------------------------------------------
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# Off current per width (A/m)
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Nmos->OffCurrent = 100.0e-3
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Pmos->OffCurrent = 100.0e-3
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# Minimum off current (A)
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Nmos->MinOffCurrent = 40e-9
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Pmos->MinOffCurrent = 4e-9
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# Subthreshold swing (V/dec)
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Nmos->SubthresholdSwing = 0.080
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Pmos->SubthresholdSwing = 0.080
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# DIBL factor (V/V)
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Nmos->DIBL = 0.125
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Pmos->DIBL = 0.125
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# Subthreshold temperature swing (K/dec)
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Nmos->SubthresholdTempSwing = 100.0
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Pmos->SubthresholdTempSwing = 100.0
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#------------------------------------------------------------------------------
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# =============================================================================
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# Parameters for interconnect
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# =============================================================================
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Wire->AvailableLayers = [Metal1,Local,Intermediate,Semiglobal,Global]
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# Metal 1 Wire (used for std cell routing only)
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# Min width (m)
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Wire->Metal1->MinWidth = 20e-9
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# Min spacing (m)
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Wire->Metal1->MinSpacing = 20e-9
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# Resistivity (Ohm-m)
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Wire->Metal1->Resistivity = 6.8e-8
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# Metal thickness (m)
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Wire->Metal1->MetalThickness = 35.0e-9
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# Dielectric thickness (m)
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Wire->Metal1->DielectricThickness = 35.0e-9
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# Dielectric constant
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Wire->Metal1->DielectricConstant = 3.00
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# Local wire, 1.0X of the M1 pitch
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# Min width (m)
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Wire->Local->MinWidth = 20e-9
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# Min spacing (m)
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Wire->Local->MinSpacing = 20e-9
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# Resistivity (Ohm-m)
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Wire->Local->Resistivity = 6.8e-8
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# Metal thickness (m)
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Wire->Local->MetalThickness = 35.0e-9
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# Dielectric thickness (m)
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Wire->Local->DielectricThickness = 35.0e-9
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# Dielectric constant
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Wire->Local->DielectricConstant = 3.00
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# Intermediate wire, 2.0X the M1 pitch
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# Min width (m)
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Wire->Intermediate->MinWidth = 40e-9
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# Min spacing (m)
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Wire->Intermediate->MinSpacing = 40e-9
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# Resistivity (Ohm-m)
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Wire->Intermediate->Resistivity = 4.50e-8
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# Metal thickness (m)
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Wire->Intermediate->MetalThickness = 70.0e-9
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# Dielectric thickness (m)
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Wire->Intermediate->DielectricThickness = 70.0e-9
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# Dielectric constant
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Wire->Intermediate->DielectricConstant = 2.80
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# Semiglobal wire, 4.0X the M1 pitch
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# Min width (m)
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Wire->Semiglobal->MinWidth = 80e-9
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# Min spacing (m)
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Wire->Semiglobal->MinSpacing = 80e-9
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# Resistivity (Ohm-m)
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Wire->Semiglobal->Resistivity = 2.80e-8
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# Metal thickness (m)
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Wire->Semiglobal->MetalThickness = 150.0e-9
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# Dielectric thickness (m)
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Wire->Semiglobal->DielectricThickness = 150.0e-9
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# Dielectric constant
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Wire->Semiglobal->DielectricConstant = 2.60
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# Global wire, 8.0X the M1 pitch
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# Min width (m)
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Wire->Global->MinWidth = 160e-9
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# Min spacing (m)
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Wire->Global->MinSpacing = 160e-9
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# Resistivity (Ohm-m)
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Wire->Global->Resistivity = 2.30e-8
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# Metal thickness (m)
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Wire->Global->MetalThickness = 280e-9
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# Dielectric thickness (m)
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Wire->Global->DielectricThickness = 250e-9
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# Dielectric constant
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Wire->Global->DielectricConstant = 2.60
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# =============================================================================
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# Parameters for Standard Cells
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# =============================================================================
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# The height of the standard cell is usually a multiple of the vertical
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# M1 pitch (tracks). By definition, an X1 size cell has transistors
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# that fit exactly in the given cell height without folding, or leaving
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# any wasted vertical area
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# Reasonable values for the number of M1 tracks that we have seen are 8-14
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StdCell->Tracks = 11
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# Height overhead due to supply rails, well spacing, etc. Note that this will grow
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# if the height of the standard cell decreases!
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StdCell->HeightOverheadFactor = 1.400
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# Sets the available sizes of each standard cell. Keep in mind that
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# 1.0 is the biggest cell without any transistor folding
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StdCell->AvailableSizes = [1.0, 1.4, 2.0, 3.0, 4.0, 6.0, 8.0, 10.0, 12.0, 16.0]
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