2772 lines
122 KiB
C++
2772 lines
122 KiB
C++
/*****************************************************************************
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* McPAT
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* SOFTWARE LICENSE AGREEMENT
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* Copyright 2012 Hewlett-Packard Development Company, L.P.
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* All Rights Reserved
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*
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* Redistribution and use in source and binary forms, with or without
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* modification, are permitted provided that the following conditions are
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* met: redistributions of source code must retain the above copyright
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* notice, this list of conditions and the following disclaimer;
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* redistributions in binary form must reproduce the above copyright
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* notice, this list of conditions and the following disclaimer in the
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* documentation and/or other materials provided with the distribution;
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* neither the name of the copyright holders nor the names of its
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* contributors may be used to endorse or promote products derived from
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* this software without specific prior written permission.
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* THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS
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* "AS IS" AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT
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* LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR
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* A PARTICULAR PURPOSE ARE DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT
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* OWNER OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL,
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* SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT
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* LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE,
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* DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY
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* THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT
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* (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE
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* OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.”
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*
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***************************************************************************/
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#include "basic_circuit.h"
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#include "parameter.h"
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double wire_resistance(double resistivity, double wire_width, double wire_thickness,
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double barrier_thickness, double dishing_thickness, double alpha_scatter)
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{
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double resistance;
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resistance = alpha_scatter * resistivity /((wire_thickness - barrier_thickness - dishing_thickness)*(wire_width - 2 * barrier_thickness));
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return(resistance);
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}
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double wire_capacitance(double wire_width, double wire_thickness, double wire_spacing,
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double ild_thickness, double miller_value, double horiz_dielectric_constant,
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double vert_dielectric_constant, double fringe_cap)
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{
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double vertical_cap, sidewall_cap, total_cap;
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vertical_cap = 2 * PERMITTIVITY_FREE_SPACE * vert_dielectric_constant * wire_width / ild_thickness;
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sidewall_cap = 2 * PERMITTIVITY_FREE_SPACE * miller_value * horiz_dielectric_constant * wire_thickness / wire_spacing;
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total_cap = vertical_cap + sidewall_cap + fringe_cap;
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return(total_cap);
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}
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void init_tech_params(double technology, bool is_tag)
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{
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int iter, tech, tech_lo, tech_hi;
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double curr_alpha, curr_vpp;
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double wire_width, wire_thickness, wire_spacing,
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fringe_cap, pmos_to_nmos_sizing_r;
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// double aspect_ratio,ild_thickness, miller_value = 1.5, horiz_dielectric_constant, vert_dielectric_constant;
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double barrier_thickness, dishing_thickness, alpha_scatter;
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double curr_vdd_dram_cell, curr_v_th_dram_access_transistor, curr_I_on_dram_cell, curr_c_dram_cell;
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uint32_t ram_cell_tech_type = (is_tag) ? g_ip->tag_arr_ram_cell_tech_type : g_ip->data_arr_ram_cell_tech_type;
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uint32_t peri_global_tech_type = (is_tag) ? g_ip->tag_arr_peri_global_tech_type : g_ip->data_arr_peri_global_tech_type;
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technology = technology * 1000.0; // in the unit of nm
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// initialize parameters
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g_tp.reset();
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double gmp_to_gmn_multiplier_periph_global = 0;
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double curr_Wmemcella_dram, curr_Wmemcellpmos_dram, curr_Wmemcellnmos_dram,
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curr_area_cell_dram, curr_asp_ratio_cell_dram, curr_Wmemcella_sram,
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curr_Wmemcellpmos_sram, curr_Wmemcellnmos_sram, curr_area_cell_sram,
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curr_asp_ratio_cell_sram, curr_I_off_dram_cell_worst_case_length_temp;
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double curr_Wmemcella_cam, curr_Wmemcellpmos_cam, curr_Wmemcellnmos_cam, curr_area_cell_cam,//Sheng: CAM data
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curr_asp_ratio_cell_cam;
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double SENSE_AMP_D, SENSE_AMP_P; // J
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double area_cell_dram = 0;
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double asp_ratio_cell_dram = 0;
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double area_cell_sram = 0;
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double asp_ratio_cell_sram = 0;
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double area_cell_cam = 0;
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double asp_ratio_cell_cam = 0;
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double mobility_eff_periph_global = 0;
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double Vdsat_periph_global = 0;
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double nmos_effective_resistance_multiplier;
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double width_dram_access_transistor;
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double curr_logic_scaling_co_eff = 0;//This is based on the reported numbers of Intel Merom 65nm, Penryn45nm and IBM cell 90/65/45 date
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double curr_core_tx_density = 0;//this is density per um^2; 90, ...22nm based on Intel Penryn
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double curr_chip_layout_overhead = 0;
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double curr_macro_layout_overhead = 0;
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double curr_sckt_co_eff = 0;
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if (technology < 91 && technology > 89)
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{
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tech_lo = 90;
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tech_hi = 90;
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}
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else if (technology < 66 && technology > 64)
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{
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tech_lo = 65;
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tech_hi = 65;
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}
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else if (technology < 46 && technology > 44)
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{
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tech_lo = 45;
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tech_hi = 45;
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}
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else if (technology < 33 && technology > 31)
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{
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tech_lo = 32;
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tech_hi = 32;
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}
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else if (technology < 23 && technology > 21)
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{
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tech_lo = 22;
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tech_hi = 22;
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if (ram_cell_tech_type == 3)
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{
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cout<<"current version does not support eDRAM technologies at 22nm"<<endl;
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exit(0);
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}
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}
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// else if (technology < 17 && technology > 15)
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// {
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// tech_lo = 16;
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// tech_hi = 16;
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// }
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else if (technology < 90 && technology > 65)
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{
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tech_lo = 90;
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tech_hi = 65;
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}
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else if (technology < 65 && technology > 45)
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{
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tech_lo = 65;
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tech_hi = 45;
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}
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else if (technology < 45 && technology > 32)
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{
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tech_lo = 45;
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tech_hi = 32;
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}
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else if (technology < 32 && technology > 22)
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{
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tech_lo = 32;
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tech_hi = 22;
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}
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// else if (technology < 22 && technology > 16)
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// {
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// tech_lo = 22;
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// tech_hi = 16;
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// }
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else
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{
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cout<<"Invalid technology nodes"<<endl;
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exit(0);
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}
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double vdd[NUMBER_TECH_FLAVORS];
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double Lphy[NUMBER_TECH_FLAVORS];
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double Lelec[NUMBER_TECH_FLAVORS];
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double t_ox[NUMBER_TECH_FLAVORS];
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double v_th[NUMBER_TECH_FLAVORS];
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double c_ox[NUMBER_TECH_FLAVORS];
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double mobility_eff[NUMBER_TECH_FLAVORS];
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double Vdsat[NUMBER_TECH_FLAVORS];
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double c_g_ideal[NUMBER_TECH_FLAVORS];
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double c_fringe[NUMBER_TECH_FLAVORS];
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double c_junc[NUMBER_TECH_FLAVORS];
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double I_on_n[NUMBER_TECH_FLAVORS];
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double I_on_p[NUMBER_TECH_FLAVORS];
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double Rnchannelon[NUMBER_TECH_FLAVORS];
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double Rpchannelon[NUMBER_TECH_FLAVORS];
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double n_to_p_eff_curr_drv_ratio[NUMBER_TECH_FLAVORS];
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double I_off_n[NUMBER_TECH_FLAVORS][101];
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double I_g_on_n[NUMBER_TECH_FLAVORS][101];
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//double I_off_p[NUMBER_TECH_FLAVORS][101];
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double gmp_to_gmn_multiplier[NUMBER_TECH_FLAVORS];
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//double curr_sckt_co_eff[NUMBER_TECH_FLAVORS];
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double long_channel_leakage_reduction[NUMBER_TECH_FLAVORS];
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for (iter = 0; iter <= 1; ++iter)
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{
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// linear interpolation
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if (iter == 0)
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{
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tech = tech_lo;
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if (tech_lo == tech_hi)
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{
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curr_alpha = 1;
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}
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else
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{
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curr_alpha = (technology - tech_hi)/(tech_lo - tech_hi);
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}
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}
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else
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{
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tech = tech_hi;
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if (tech_lo == tech_hi)
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{
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break;
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}
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else
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{
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curr_alpha = (tech_lo - technology)/(tech_lo - tech_hi);
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}
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}
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if (tech == 90)
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{
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SENSE_AMP_D = .28e-9; // s
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SENSE_AMP_P = 14.7e-15; // J
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//90nm technology-node. Corresponds to year 2004 in ITRS
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//ITRS HP device type
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vdd[0] = 1.2;
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Lphy[0] = 0.037;//Lphy is the physical gate-length. micron
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Lelec[0] = 0.0266;//Lelec is the electrical gate-length. micron
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t_ox[0] = 1.2e-3;//micron
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v_th[0] = 0.23707;//V
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c_ox[0] = 1.79e-14;//F/micron2
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mobility_eff[0] = 342.16 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
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Vdsat[0] = 0.128; //V
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c_g_ideal[0] = 6.64e-16;//F/micron
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c_fringe[0] = 0.08e-15;//F/micron
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c_junc[0] = 1e-15;//F/micron2
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I_on_n[0] = 1076.9e-6;//A/micron
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I_on_p[0] = 712.6e-6;//A/micron
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//Note that nmos_effective_resistance_multiplier, n_to_p_eff_curr_drv_ratio and gmp_to_gmn_multiplier values are calculated offline
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nmos_effective_resistance_multiplier = 1.54;
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n_to_p_eff_curr_drv_ratio[0] = 2.45;
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gmp_to_gmn_multiplier[0] = 1.22;
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Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
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Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
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long_channel_leakage_reduction[0] = 1;
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I_off_n[0][0] = 3.24e-8;//A/micron
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I_off_n[0][10] = 4.01e-8;
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I_off_n[0][20] = 4.90e-8;
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I_off_n[0][30] = 5.92e-8;
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I_off_n[0][40] = 7.08e-8;
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I_off_n[0][50] = 8.38e-8;
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I_off_n[0][60] = 9.82e-8;
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I_off_n[0][70] = 1.14e-7;
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I_off_n[0][80] = 1.29e-7;
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I_off_n[0][90] = 1.43e-7;
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I_off_n[0][100] = 1.54e-7;
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I_g_on_n[0][0] = 1.65e-8;//A/micron
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I_g_on_n[0][10] = 1.65e-8;
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I_g_on_n[0][20] = 1.65e-8;
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I_g_on_n[0][30] = 1.65e-8;
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I_g_on_n[0][40] = 1.65e-8;
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I_g_on_n[0][50] = 1.65e-8;
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I_g_on_n[0][60] = 1.65e-8;
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I_g_on_n[0][70] = 1.65e-8;
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I_g_on_n[0][80] = 1.65e-8;
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I_g_on_n[0][90] = 1.65e-8;
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I_g_on_n[0][100] = 1.65e-8;
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//ITRS LSTP device type
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vdd[1] = 1.3;
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Lphy[1] = 0.075;
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Lelec[1] = 0.0486;
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t_ox[1] = 2.2e-3;
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v_th[1] = 0.48203;
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c_ox[1] = 1.22e-14;
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mobility_eff[1] = 356.76 * (1e-2 * 1e6 * 1e-2 * 1e6);
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Vdsat[1] = 0.373;
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c_g_ideal[1] = 9.15e-16;
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c_fringe[1] = 0.08e-15;
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c_junc[1] = 1e-15;
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I_on_n[1] = 503.6e-6;
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I_on_p[1] = 235.1e-6;
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nmos_effective_resistance_multiplier = 1.92;
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n_to_p_eff_curr_drv_ratio[1] = 2.44;
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gmp_to_gmn_multiplier[1] =0.88;
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Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
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Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
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long_channel_leakage_reduction[1] = 1;
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I_off_n[1][0] = 2.81e-12;
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I_off_n[1][10] = 4.76e-12;
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I_off_n[1][20] = 7.82e-12;
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I_off_n[1][30] = 1.25e-11;
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I_off_n[1][40] = 1.94e-11;
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I_off_n[1][50] = 2.94e-11;
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I_off_n[1][60] = 4.36e-11;
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I_off_n[1][70] = 6.32e-11;
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I_off_n[1][80] = 8.95e-11;
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I_off_n[1][90] = 1.25e-10;
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I_off_n[1][100] = 1.7e-10;
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I_g_on_n[1][0] = 3.87e-11;//A/micron
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I_g_on_n[1][10] = 3.87e-11;
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I_g_on_n[1][20] = 3.87e-11;
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I_g_on_n[1][30] = 3.87e-11;
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I_g_on_n[1][40] = 3.87e-11;
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I_g_on_n[1][50] = 3.87e-11;
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I_g_on_n[1][60] = 3.87e-11;
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I_g_on_n[1][70] = 3.87e-11;
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I_g_on_n[1][80] = 3.87e-11;
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I_g_on_n[1][90] = 3.87e-11;
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I_g_on_n[1][100] = 3.87e-11;
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//ITRS LOP device type
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vdd[2] = 0.9;
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Lphy[2] = 0.053;
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Lelec[2] = 0.0354;
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t_ox[2] = 1.5e-3;
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v_th[2] = 0.30764;
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c_ox[2] = 1.59e-14;
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mobility_eff[2] = 460.39 * (1e-2 * 1e6 * 1e-2 * 1e6);
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Vdsat[2] = 0.113;
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c_g_ideal[2] = 8.45e-16;
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c_fringe[2] = 0.08e-15;
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c_junc[2] = 1e-15;
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I_on_n[2] = 386.6e-6;
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I_on_p[2] = 209.7e-6;
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nmos_effective_resistance_multiplier = 1.77;
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n_to_p_eff_curr_drv_ratio[2] = 2.54;
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gmp_to_gmn_multiplier[2] = 0.98;
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Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
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Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
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long_channel_leakage_reduction[2] = 1;
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I_off_n[2][0] = 2.14e-9;
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I_off_n[2][10] = 2.9e-9;
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I_off_n[2][20] = 3.87e-9;
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I_off_n[2][30] = 5.07e-9;
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I_off_n[2][40] = 6.54e-9;
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I_off_n[2][50] = 8.27e-8;
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I_off_n[2][60] = 1.02e-7;
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I_off_n[2][70] = 1.20e-7;
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I_off_n[2][80] = 1.36e-8;
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I_off_n[2][90] = 1.52e-8;
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I_off_n[2][100] = 1.73e-8;
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I_g_on_n[2][0] = 4.31e-8;//A/micron
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I_g_on_n[2][10] = 4.31e-8;
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I_g_on_n[2][20] = 4.31e-8;
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I_g_on_n[2][30] = 4.31e-8;
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I_g_on_n[2][40] = 4.31e-8;
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I_g_on_n[2][50] = 4.31e-8;
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I_g_on_n[2][60] = 4.31e-8;
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I_g_on_n[2][70] = 4.31e-8;
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I_g_on_n[2][80] = 4.31e-8;
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I_g_on_n[2][90] = 4.31e-8;
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I_g_on_n[2][100] = 4.31e-8;
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if (ram_cell_tech_type == lp_dram)
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{
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//LP-DRAM cell access transistor technology parameters
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curr_vdd_dram_cell = 1.2;
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Lphy[3] = 0.12;
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Lelec[3] = 0.0756;
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curr_v_th_dram_access_transistor = 0.4545;
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width_dram_access_transistor = 0.14;
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curr_I_on_dram_cell = 45e-6;
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curr_I_off_dram_cell_worst_case_length_temp = 21.1e-12;
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curr_Wmemcella_dram = width_dram_access_transistor;
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curr_Wmemcellpmos_dram = 0;
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curr_Wmemcellnmos_dram = 0;
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curr_area_cell_dram = 0.168;
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curr_asp_ratio_cell_dram = 1.46;
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curr_c_dram_cell = 20e-15;
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//LP-DRAM wordline transistor parameters
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curr_vpp = 1.6;
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t_ox[3] = 2.2e-3;
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v_th[3] = 0.4545;
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c_ox[3] = 1.22e-14;
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mobility_eff[3] = 323.95 * (1e-2 * 1e6 * 1e-2 * 1e6);
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Vdsat[3] = 0.3;
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c_g_ideal[3] = 1.47e-15;
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c_fringe[3] = 0.08e-15;
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c_junc[3] = 1e-15;
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I_on_n[3] = 321.6e-6;
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I_on_p[3] = 203.3e-6;
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nmos_effective_resistance_multiplier = 1.65;
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n_to_p_eff_curr_drv_ratio[3] = 1.95;
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gmp_to_gmn_multiplier[3] = 0.90;
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Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
|
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Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 1.42e-11;
|
|
I_off_n[3][10] = 2.25e-11;
|
|
I_off_n[3][20] = 3.46e-11;
|
|
I_off_n[3][30] = 5.18e-11;
|
|
I_off_n[3][40] = 7.58e-11;
|
|
I_off_n[3][50] = 1.08e-10;
|
|
I_off_n[3][60] = 1.51e-10;
|
|
I_off_n[3][70] = 2.02e-10;
|
|
I_off_n[3][80] = 2.57e-10;
|
|
I_off_n[3][90] = 3.14e-10;
|
|
I_off_n[3][100] = 3.85e-10;
|
|
}
|
|
else if (ram_cell_tech_type == comm_dram)
|
|
{
|
|
//COMM-DRAM cell access transistor technology parameters
|
|
curr_vdd_dram_cell = 1.6;
|
|
Lphy[3] = 0.09;
|
|
Lelec[3] = 0.0576;
|
|
curr_v_th_dram_access_transistor = 1;
|
|
width_dram_access_transistor = 0.09;
|
|
curr_I_on_dram_cell = 20e-6;
|
|
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
|
|
curr_Wmemcella_dram = width_dram_access_transistor;
|
|
curr_Wmemcellpmos_dram = 0;
|
|
curr_Wmemcellnmos_dram = 0;
|
|
curr_area_cell_dram = 6*0.09*0.09;
|
|
curr_asp_ratio_cell_dram = 1.5;
|
|
curr_c_dram_cell = 30e-15;
|
|
|
|
//COMM-DRAM wordline transistor parameters
|
|
curr_vpp = 3.7;
|
|
t_ox[3] = 5.5e-3;
|
|
v_th[3] = 1.0;
|
|
c_ox[3] = 5.65e-15;
|
|
mobility_eff[3] = 302.2 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[3] = 0.32;
|
|
c_g_ideal[3] = 5.08e-16;
|
|
c_fringe[3] = 0.08e-15;
|
|
c_junc[3] = 1e-15;
|
|
I_on_n[3] = 1094.3e-6;
|
|
I_on_p[3] = I_on_n[3] / 2;
|
|
nmos_effective_resistance_multiplier = 1.62;
|
|
n_to_p_eff_curr_drv_ratio[3] = 2.05;
|
|
gmp_to_gmn_multiplier[3] = 0.90;
|
|
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
|
|
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 5.80e-15;
|
|
I_off_n[3][10] = 1.21e-14;
|
|
I_off_n[3][20] = 2.42e-14;
|
|
I_off_n[3][30] = 4.65e-14;
|
|
I_off_n[3][40] = 8.60e-14;
|
|
I_off_n[3][50] = 1.54e-13;
|
|
I_off_n[3][60] = 2.66e-13;
|
|
I_off_n[3][70] = 4.45e-13;
|
|
I_off_n[3][80] = 7.17e-13;
|
|
I_off_n[3][90] = 1.11e-12;
|
|
I_off_n[3][100] = 1.67e-12;
|
|
}
|
|
|
|
//SRAM cell properties
|
|
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_sram = 1.46;
|
|
//CAM cell properties //TODO: data need to be revisited
|
|
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;//360
|
|
curr_asp_ratio_cell_cam = 2.92;//2.5
|
|
//Empirical undifferetiated core/FU coefficient
|
|
curr_logic_scaling_co_eff = 1;
|
|
curr_core_tx_density = 1.25*0.7*0.7;
|
|
curr_sckt_co_eff = 1.1539;
|
|
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
|
|
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
|
|
|
|
|
|
}
|
|
|
|
if (tech == 65)
|
|
{ //65nm technology-node. Corresponds to year 2007 in ITRS
|
|
//ITRS HP device type
|
|
// SENSE_AMP_D = .2e-9; // s
|
|
// SENSE_AMP_P = 5.7e-15; // J
|
|
// vdd[0] = 1.1;
|
|
// Lphy[0] = 0.025;
|
|
// Lelec[0] = 0.019;
|
|
// t_ox[0] = 1.1e-3;
|
|
// v_th[0] = .19491;
|
|
// c_ox[0] = 1.88e-14;
|
|
// mobility_eff[0] = 436.24 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
// Vdsat[0] = 7.71e-2;
|
|
// c_g_ideal[0] = 4.69e-16;
|
|
// c_fringe[0] = 0.077e-15;
|
|
// c_junc[0] = 1e-15;
|
|
// I_on_n[0] = 1197.2e-6;
|
|
// I_on_p[0] = 870.8e-6;
|
|
// nmos_effective_resistance_multiplier = 1.50;
|
|
// n_to_p_eff_curr_drv_ratio[0] = 2.41;
|
|
// gmp_to_gmn_multiplier[0] = 1.38;
|
|
// Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];
|
|
// Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];
|
|
// long_channel_leakage_reduction[0] = 1/3.74;
|
|
// //Using MASTAR, @380K, increase Lgate until Ion reduces to 90% or Lgate increase by 10%, whichever comes first
|
|
// //Ioff(Lgate normal)/Ioff(Lgate long)= 3.74.
|
|
// I_off_n[0][0] = 1.96e-7;
|
|
// I_off_n[0][10] = 2.29e-7;
|
|
// I_off_n[0][20] = 2.66e-7;
|
|
// I_off_n[0][30] = 3.05e-7;
|
|
// I_off_n[0][40] = 3.49e-7;
|
|
// I_off_n[0][50] = 3.95e-7;
|
|
// I_off_n[0][60] = 4.45e-7;
|
|
// I_off_n[0][70] = 4.97e-7;
|
|
// I_off_n[0][80] = 5.48e-7;
|
|
// I_off_n[0][90] = 5.94e-7;
|
|
// I_off_n[0][100] = 6.3e-7;
|
|
// I_g_on_n[0][0] = 4.09e-8;//A/micron
|
|
// I_g_on_n[0][10] = 4.09e-8;
|
|
// I_g_on_n[0][20] = 4.09e-8;
|
|
// I_g_on_n[0][30] = 4.09e-8;
|
|
// I_g_on_n[0][40] = 4.09e-8;
|
|
// I_g_on_n[0][50] = 4.09e-8;
|
|
// I_g_on_n[0][60] = 4.09e-8;
|
|
// I_g_on_n[0][70] = 4.09e-8;
|
|
// I_g_on_n[0][80] = 4.09e-8;
|
|
// I_g_on_n[0][90] = 4.09e-8;
|
|
// I_g_on_n[0][100] = 4.09e-8;
|
|
|
|
SENSE_AMP_D = .2e-9; // s
|
|
SENSE_AMP_P = 5.7e-15; // J
|
|
vdd[0] = 1.25;
|
|
Lphy[0] = 0.025;
|
|
Lelec[0] = 0.019;
|
|
t_ox[0] = 1.1e-3;
|
|
v_th[0] = .12491;
|
|
c_ox[0] = 1.88e-14;
|
|
mobility_eff[0] = 409.31 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[0] = 9.08e-2;
|
|
c_g_ideal[0] = 4.72e-16;
|
|
c_fringe[0] = 0.08e-15;
|
|
c_junc[0] = 1e-15;
|
|
I_on_n[0] = 1486.4e-6;
|
|
I_on_p[0] = 1131.5e-6;
|
|
nmos_effective_resistance_multiplier = 1.57;
|
|
n_to_p_eff_curr_drv_ratio[0] = 2;
|
|
gmp_to_gmn_multiplier[0] = 1.38;
|
|
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];
|
|
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];
|
|
long_channel_leakage_reduction[0] = 1.0/4.97;
|
|
//Using MASTAR, @380K, increase Lgate until Ion reduces to 90% or Lgate increase by 10%, whichever comes first
|
|
//Ioff(Lgate normal)/Ioff(Lgate long)= 4.97@Vdd=1.25; (3.74@Vdd=1.1), however, Intel paper suggest the reduction factor is 3.
|
|
I_off_n[0][0] = 8.62e-7;
|
|
I_off_n[0][10] = 9.08e-7;
|
|
I_off_n[0][20] = 9.55e-7;
|
|
I_off_n[0][30] = 1.00e-6;
|
|
I_off_n[0][40] = 1.05e-6;
|
|
I_off_n[0][50] = 1.09e-6;
|
|
I_off_n[0][60] = 1.14e-6;
|
|
I_off_n[0][70] = 1.18e-6;
|
|
I_off_n[0][80] = 1.23e-6;
|
|
I_off_n[0][90] = 1.27e-6;
|
|
I_off_n[0][100] = 1.31e-6;
|
|
|
|
|
|
I_g_on_n[0][0] = 7.02e-8;//A/micron
|
|
I_g_on_n[0][10] = 7.02e-8;
|
|
I_g_on_n[0][20] = 7.02e-8;
|
|
I_g_on_n[0][30] = 7.02e-8;
|
|
I_g_on_n[0][40] = 7.02e-8;
|
|
I_g_on_n[0][50] = 7.02e-8;
|
|
I_g_on_n[0][60] = 7.02e-8;
|
|
I_g_on_n[0][70] = 7.02e-8;
|
|
I_g_on_n[0][80] = 7.02e-8;
|
|
I_g_on_n[0][90] = 7.02e-8;
|
|
I_g_on_n[0][100] = 7.02e-8;
|
|
|
|
//ITRS LSTP device type
|
|
vdd[1] = 1.2;
|
|
Lphy[1] = 0.045;
|
|
Lelec[1] = 0.0298;
|
|
t_ox[1] = 1.9e-3;
|
|
v_th[1] = 0.52354;
|
|
c_ox[1] = 1.36e-14;
|
|
mobility_eff[1] = 341.21 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[1] = 0.128;
|
|
c_g_ideal[1] = 6.14e-16;
|
|
c_fringe[1] = 0.08e-15;
|
|
c_junc[1] = 1e-15;
|
|
I_on_n[1] = 519.2e-6;
|
|
I_on_p[1] = 266e-6;
|
|
nmos_effective_resistance_multiplier = 1.96;
|
|
n_to_p_eff_curr_drv_ratio[1] = 2.23;
|
|
gmp_to_gmn_multiplier[1] = 0.99;
|
|
Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
|
|
Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
|
|
long_channel_leakage_reduction[1] = 1/2.82;
|
|
I_off_n[1][0] = 9.12e-12;
|
|
I_off_n[1][10] = 1.49e-11;
|
|
I_off_n[1][20] = 2.36e-11;
|
|
I_off_n[1][30] = 3.64e-11;
|
|
I_off_n[1][40] = 5.48e-11;
|
|
I_off_n[1][50] = 8.05e-11;
|
|
I_off_n[1][60] = 1.15e-10;
|
|
I_off_n[1][70] = 1.59e-10;
|
|
I_off_n[1][80] = 2.1e-10;
|
|
I_off_n[1][90] = 2.62e-10;
|
|
I_off_n[1][100] = 3.21e-10;
|
|
|
|
I_g_on_n[1][0] = 1.09e-10;//A/micron
|
|
I_g_on_n[1][10] = 1.09e-10;
|
|
I_g_on_n[1][20] = 1.09e-10;
|
|
I_g_on_n[1][30] = 1.09e-10;
|
|
I_g_on_n[1][40] = 1.09e-10;
|
|
I_g_on_n[1][50] = 1.09e-10;
|
|
I_g_on_n[1][60] = 1.09e-10;
|
|
I_g_on_n[1][70] = 1.09e-10;
|
|
I_g_on_n[1][80] = 1.09e-10;
|
|
I_g_on_n[1][90] = 1.09e-10;
|
|
I_g_on_n[1][100] = 1.09e-10;
|
|
|
|
//ITRS LOP device type
|
|
vdd[2] = 0.8;
|
|
Lphy[2] = 0.032;
|
|
Lelec[2] = 0.0216;
|
|
t_ox[2] = 1.2e-3;
|
|
v_th[2] = 0.28512;
|
|
c_ox[2] = 1.87e-14;
|
|
mobility_eff[2] = 495.19 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[2] = 0.292;
|
|
c_g_ideal[2] = 6e-16;
|
|
c_fringe[2] = 0.08e-15;
|
|
c_junc[2] = 1e-15;
|
|
I_on_n[2] = 573.1e-6;
|
|
I_on_p[2] = 340.6e-6;
|
|
nmos_effective_resistance_multiplier = 1.82;
|
|
n_to_p_eff_curr_drv_ratio[2] = 2.28;
|
|
gmp_to_gmn_multiplier[2] = 1.11;
|
|
Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
|
|
Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
|
|
long_channel_leakage_reduction[2] = 1/2.05;
|
|
I_off_n[2][0] = 4.9e-9;
|
|
I_off_n[2][10] = 6.49e-9;
|
|
I_off_n[2][20] = 8.45e-9;
|
|
I_off_n[2][30] = 1.08e-8;
|
|
I_off_n[2][40] = 1.37e-8;
|
|
I_off_n[2][50] = 1.71e-8;
|
|
I_off_n[2][60] = 2.09e-8;
|
|
I_off_n[2][70] = 2.48e-8;
|
|
I_off_n[2][80] = 2.84e-8;
|
|
I_off_n[2][90] = 3.13e-8;
|
|
I_off_n[2][100] = 3.42e-8;
|
|
|
|
I_g_on_n[2][0] = 9.61e-9;//A/micron
|
|
I_g_on_n[2][10] = 9.61e-9;
|
|
I_g_on_n[2][20] = 9.61e-9;
|
|
I_g_on_n[2][30] = 9.61e-9;
|
|
I_g_on_n[2][40] = 9.61e-9;
|
|
I_g_on_n[2][50] = 9.61e-9;
|
|
I_g_on_n[2][60] = 9.61e-9;
|
|
I_g_on_n[2][70] = 9.61e-9;
|
|
I_g_on_n[2][80] = 9.61e-9;
|
|
I_g_on_n[2][90] = 9.61e-9;
|
|
I_g_on_n[2][100] = 9.61e-9;
|
|
|
|
if (ram_cell_tech_type == lp_dram)
|
|
{
|
|
//LP-DRAM cell access transistor technology parameters
|
|
curr_vdd_dram_cell = 1.2;
|
|
Lphy[3] = 0.12;
|
|
Lelec[3] = 0.0756;
|
|
curr_v_th_dram_access_transistor = 0.43806;
|
|
width_dram_access_transistor = 0.09;
|
|
curr_I_on_dram_cell = 36e-6;
|
|
curr_I_off_dram_cell_worst_case_length_temp = 19.6e-12;
|
|
curr_Wmemcella_dram = width_dram_access_transistor;
|
|
curr_Wmemcellpmos_dram = 0;
|
|
curr_Wmemcellnmos_dram = 0;
|
|
curr_area_cell_dram = 0.11;
|
|
curr_asp_ratio_cell_dram = 1.46;
|
|
curr_c_dram_cell = 20e-15;
|
|
|
|
//LP-DRAM wordline transistor parameters
|
|
curr_vpp = 1.6;
|
|
t_ox[3] = 2.2e-3;
|
|
v_th[3] = 0.43806;
|
|
c_ox[3] = 1.22e-14;
|
|
mobility_eff[3] = 328.32 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[3] = 0.43806;
|
|
c_g_ideal[3] = 1.46e-15;
|
|
c_fringe[3] = 0.08e-15;
|
|
c_junc[3] = 1e-15 ;
|
|
I_on_n[3] = 399.8e-6;
|
|
I_on_p[3] = 243.4e-6;
|
|
nmos_effective_resistance_multiplier = 1.65;
|
|
n_to_p_eff_curr_drv_ratio[3] = 2.05;
|
|
gmp_to_gmn_multiplier[3] = 0.90;
|
|
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
|
|
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 2.23e-11;
|
|
I_off_n[3][10] = 3.46e-11;
|
|
I_off_n[3][20] = 5.24e-11;
|
|
I_off_n[3][30] = 7.75e-11;
|
|
I_off_n[3][40] = 1.12e-10;
|
|
I_off_n[3][50] = 1.58e-10;
|
|
I_off_n[3][60] = 2.18e-10;
|
|
I_off_n[3][70] = 2.88e-10;
|
|
I_off_n[3][80] = 3.63e-10;
|
|
I_off_n[3][90] = 4.41e-10;
|
|
I_off_n[3][100] = 5.36e-10;
|
|
}
|
|
else if (ram_cell_tech_type == comm_dram)
|
|
{
|
|
//COMM-DRAM cell access transistor technology parameters
|
|
curr_vdd_dram_cell = 1.3;
|
|
Lphy[3] = 0.065;
|
|
Lelec[3] = 0.0426;
|
|
curr_v_th_dram_access_transistor = 1;
|
|
width_dram_access_transistor = 0.065;
|
|
curr_I_on_dram_cell = 20e-6;
|
|
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
|
|
curr_Wmemcella_dram = width_dram_access_transistor;
|
|
curr_Wmemcellpmos_dram = 0;
|
|
curr_Wmemcellnmos_dram = 0;
|
|
curr_area_cell_dram = 6*0.065*0.065;
|
|
curr_asp_ratio_cell_dram = 1.5;
|
|
curr_c_dram_cell = 30e-15;
|
|
|
|
//COMM-DRAM wordline transistor parameters
|
|
curr_vpp = 3.3;
|
|
t_ox[3] = 5e-3;
|
|
v_th[3] = 1.0;
|
|
c_ox[3] = 6.16e-15;
|
|
mobility_eff[3] = 303.44 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[3] = 0.385;
|
|
c_g_ideal[3] = 4e-16;
|
|
c_fringe[3] = 0.08e-15;
|
|
c_junc[3] = 1e-15 ;
|
|
I_on_n[3] = 1031e-6;
|
|
I_on_p[3] = I_on_n[3] / 2;
|
|
nmos_effective_resistance_multiplier = 1.69;
|
|
n_to_p_eff_curr_drv_ratio[3] = 2.39;
|
|
gmp_to_gmn_multiplier[3] = 0.90;
|
|
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
|
|
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 1.80e-14;
|
|
I_off_n[3][10] = 3.64e-14;
|
|
I_off_n[3][20] = 7.03e-14;
|
|
I_off_n[3][30] = 1.31e-13;
|
|
I_off_n[3][40] = 2.35e-13;
|
|
I_off_n[3][50] = 4.09e-13;
|
|
I_off_n[3][60] = 6.89e-13;
|
|
I_off_n[3][70] = 1.13e-12;
|
|
I_off_n[3][80] = 1.78e-12;
|
|
I_off_n[3][90] = 2.71e-12;
|
|
I_off_n[3][100] = 3.99e-12;
|
|
}
|
|
|
|
//SRAM cell properties
|
|
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_sram = 1.46;
|
|
//CAM cell properties //TODO: data need to be revisited
|
|
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_cam = 2.92;
|
|
//Empirical undifferetiated core/FU coefficient
|
|
curr_logic_scaling_co_eff = 0.7;
|
|
curr_core_tx_density = 1.25*0.7;
|
|
curr_sckt_co_eff = 1.1359;
|
|
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
|
|
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
|
|
}
|
|
|
|
if (tech == 45)
|
|
{ //45nm technology-node. Corresponds to year 2010 in ITRS
|
|
//ITRS HP device type
|
|
SENSE_AMP_D = .04e-9; // s
|
|
SENSE_AMP_P = 2.7e-15; // J
|
|
vdd[0] = 1.0;
|
|
Lphy[0] = 0.018;
|
|
Lelec[0] = 0.01345;
|
|
t_ox[0] = 0.65e-3;
|
|
v_th[0] = .18035;
|
|
c_ox[0] = 3.77e-14;
|
|
mobility_eff[0] = 266.68 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[0] = 9.38E-2;
|
|
c_g_ideal[0] = 6.78e-16;
|
|
c_fringe[0] = 0.05e-15;
|
|
c_junc[0] = 1e-15;
|
|
I_on_n[0] = 2046.6e-6;
|
|
//There are certain problems with the ITRS PMOS numbers in MASTAR for 45nm. So we are using 65nm values of
|
|
//n_to_p_eff_curr_drv_ratio and gmp_to_gmn_multiplier for 45nm
|
|
I_on_p[0] = I_on_n[0] / 2;//This value is fixed arbitrarily but I_on_p is not being used in CACTI
|
|
nmos_effective_resistance_multiplier = 1.51;
|
|
n_to_p_eff_curr_drv_ratio[0] = 2.41;
|
|
gmp_to_gmn_multiplier[0] = 1.38;
|
|
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];
|
|
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];
|
|
long_channel_leakage_reduction[0] = 1/3.546;//Using MASTAR, @380K, increase Lgate until Ion reduces to 90%, Ioff(Lgate normal)/Ioff(Lgate long)= 3.74
|
|
I_off_n[0][0] = 2.8e-7;
|
|
I_off_n[0][10] = 3.28e-7;
|
|
I_off_n[0][20] = 3.81e-7;
|
|
I_off_n[0][30] = 4.39e-7;
|
|
I_off_n[0][40] = 5.02e-7;
|
|
I_off_n[0][50] = 5.69e-7;
|
|
I_off_n[0][60] = 6.42e-7;
|
|
I_off_n[0][70] = 7.2e-7;
|
|
I_off_n[0][80] = 8.03e-7;
|
|
I_off_n[0][90] = 8.91e-7;
|
|
I_off_n[0][100] = 9.84e-7;
|
|
|
|
I_g_on_n[0][0] = 3.59e-8;//A/micron
|
|
I_g_on_n[0][10] = 3.59e-8;
|
|
I_g_on_n[0][20] = 3.59e-8;
|
|
I_g_on_n[0][30] = 3.59e-8;
|
|
I_g_on_n[0][40] = 3.59e-8;
|
|
I_g_on_n[0][50] = 3.59e-8;
|
|
I_g_on_n[0][60] = 3.59e-8;
|
|
I_g_on_n[0][70] = 3.59e-8;
|
|
I_g_on_n[0][80] = 3.59e-8;
|
|
I_g_on_n[0][90] = 3.59e-8;
|
|
I_g_on_n[0][100] = 3.59e-8;
|
|
|
|
//ITRS LSTP device type
|
|
vdd[1] = 1.1;
|
|
Lphy[1] = 0.028;
|
|
Lelec[1] = 0.0212;
|
|
t_ox[1] = 1.4e-3;
|
|
v_th[1] = 0.50245;
|
|
c_ox[1] = 2.01e-14;
|
|
mobility_eff[1] = 363.96 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[1] = 9.12e-2;
|
|
c_g_ideal[1] = 5.18e-16;
|
|
c_fringe[1] = 0.08e-15;
|
|
c_junc[1] = 1e-15;
|
|
I_on_n[1] = 666.2e-6;
|
|
I_on_p[1] = I_on_n[1] / 2;
|
|
nmos_effective_resistance_multiplier = 1.99;
|
|
n_to_p_eff_curr_drv_ratio[1] = 2.23;
|
|
gmp_to_gmn_multiplier[1] = 0.99;
|
|
Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
|
|
Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
|
|
long_channel_leakage_reduction[1] = 1/2.08;
|
|
I_off_n[1][0] = 1.01e-11;
|
|
I_off_n[1][10] = 1.65e-11;
|
|
I_off_n[1][20] = 2.62e-11;
|
|
I_off_n[1][30] = 4.06e-11;
|
|
I_off_n[1][40] = 6.12e-11;
|
|
I_off_n[1][50] = 9.02e-11;
|
|
I_off_n[1][60] = 1.3e-10;
|
|
I_off_n[1][70] = 1.83e-10;
|
|
I_off_n[1][80] = 2.51e-10;
|
|
I_off_n[1][90] = 3.29e-10;
|
|
I_off_n[1][100] = 4.1e-10;
|
|
|
|
I_g_on_n[1][0] = 9.47e-12;//A/micron
|
|
I_g_on_n[1][10] = 9.47e-12;
|
|
I_g_on_n[1][20] = 9.47e-12;
|
|
I_g_on_n[1][30] = 9.47e-12;
|
|
I_g_on_n[1][40] = 9.47e-12;
|
|
I_g_on_n[1][50] = 9.47e-12;
|
|
I_g_on_n[1][60] = 9.47e-12;
|
|
I_g_on_n[1][70] = 9.47e-12;
|
|
I_g_on_n[1][80] = 9.47e-12;
|
|
I_g_on_n[1][90] = 9.47e-12;
|
|
I_g_on_n[1][100] = 9.47e-12;
|
|
|
|
//ITRS LOP device type
|
|
vdd[2] = 0.7;
|
|
Lphy[2] = 0.022;
|
|
Lelec[2] = 0.016;
|
|
t_ox[2] = 0.9e-3;
|
|
v_th[2] = 0.22599;
|
|
c_ox[2] = 2.82e-14;//F/micron2
|
|
mobility_eff[2] = 508.9 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[2] = 5.71e-2;
|
|
c_g_ideal[2] = 6.2e-16;
|
|
c_fringe[2] = 0.073e-15;
|
|
c_junc[2] = 1e-15;
|
|
I_on_n[2] = 748.9e-6;
|
|
I_on_p[2] = I_on_n[2] / 2;
|
|
nmos_effective_resistance_multiplier = 1.76;
|
|
n_to_p_eff_curr_drv_ratio[2] = 2.28;
|
|
gmp_to_gmn_multiplier[2] = 1.11;
|
|
Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
|
|
Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
|
|
long_channel_leakage_reduction[2] = 1/1.92;
|
|
I_off_n[2][0] = 4.03e-9;
|
|
I_off_n[2][10] = 5.02e-9;
|
|
I_off_n[2][20] = 6.18e-9;
|
|
I_off_n[2][30] = 7.51e-9;
|
|
I_off_n[2][40] = 9.04e-9;
|
|
I_off_n[2][50] = 1.08e-8;
|
|
I_off_n[2][60] = 1.27e-8;
|
|
I_off_n[2][70] = 1.47e-8;
|
|
I_off_n[2][80] = 1.66e-8;
|
|
I_off_n[2][90] = 1.84e-8;
|
|
I_off_n[2][100] = 2.03e-8;
|
|
|
|
I_g_on_n[2][0] = 3.24e-8;//A/micron
|
|
I_g_on_n[2][10] = 4.01e-8;
|
|
I_g_on_n[2][20] = 4.90e-8;
|
|
I_g_on_n[2][30] = 5.92e-8;
|
|
I_g_on_n[2][40] = 7.08e-8;
|
|
I_g_on_n[2][50] = 8.38e-8;
|
|
I_g_on_n[2][60] = 9.82e-8;
|
|
I_g_on_n[2][70] = 1.14e-7;
|
|
I_g_on_n[2][80] = 1.29e-7;
|
|
I_g_on_n[2][90] = 1.43e-7;
|
|
I_g_on_n[2][100] = 1.54e-7;
|
|
|
|
if (ram_cell_tech_type == lp_dram)
|
|
{
|
|
//LP-DRAM cell access transistor technology parameters
|
|
curr_vdd_dram_cell = 1.1;
|
|
Lphy[3] = 0.078;
|
|
Lelec[3] = 0.0504;// Assume Lelec is 30% lesser than Lphy for DRAM access and wordline transistors.
|
|
curr_v_th_dram_access_transistor = 0.44559;
|
|
width_dram_access_transistor = 0.079;
|
|
curr_I_on_dram_cell = 36e-6;//A
|
|
curr_I_off_dram_cell_worst_case_length_temp = 19.5e-12;
|
|
curr_Wmemcella_dram = width_dram_access_transistor;
|
|
curr_Wmemcellpmos_dram = 0;
|
|
curr_Wmemcellnmos_dram = 0;
|
|
curr_area_cell_dram = width_dram_access_transistor * Lphy[3] * 10.0;
|
|
curr_asp_ratio_cell_dram = 1.46;
|
|
curr_c_dram_cell = 20e-15;
|
|
|
|
//LP-DRAM wordline transistor parameters
|
|
curr_vpp = 1.5;
|
|
t_ox[3] = 2.1e-3;
|
|
v_th[3] = 0.44559;
|
|
c_ox[3] = 1.41e-14;
|
|
mobility_eff[3] = 426.30 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[3] = 0.181;
|
|
c_g_ideal[3] = 1.10e-15;
|
|
c_fringe[3] = 0.08e-15;
|
|
c_junc[3] = 1e-15;
|
|
I_on_n[3] = 456e-6;
|
|
I_on_p[3] = I_on_n[3] / 2;
|
|
nmos_effective_resistance_multiplier = 1.65;
|
|
n_to_p_eff_curr_drv_ratio[3] = 2.05;
|
|
gmp_to_gmn_multiplier[3] = 0.90;
|
|
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
|
|
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 2.54e-11;
|
|
I_off_n[3][10] = 3.94e-11;
|
|
I_off_n[3][20] = 5.95e-11;
|
|
I_off_n[3][30] = 8.79e-11;
|
|
I_off_n[3][40] = 1.27e-10;
|
|
I_off_n[3][50] = 1.79e-10;
|
|
I_off_n[3][60] = 2.47e-10;
|
|
I_off_n[3][70] = 3.31e-10;
|
|
I_off_n[3][80] = 4.26e-10;
|
|
I_off_n[3][90] = 5.27e-10;
|
|
I_off_n[3][100] = 6.46e-10;
|
|
}
|
|
else if (ram_cell_tech_type == comm_dram)
|
|
{
|
|
//COMM-DRAM cell access transistor technology parameters
|
|
curr_vdd_dram_cell = 1.1;
|
|
Lphy[3] = 0.045;
|
|
Lelec[3] = 0.0298;
|
|
curr_v_th_dram_access_transistor = 1;
|
|
width_dram_access_transistor = 0.045;
|
|
curr_I_on_dram_cell = 20e-6;//A
|
|
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
|
|
curr_Wmemcella_dram = width_dram_access_transistor;
|
|
curr_Wmemcellpmos_dram = 0;
|
|
curr_Wmemcellnmos_dram = 0;
|
|
curr_area_cell_dram = 6*0.045*0.045;
|
|
curr_asp_ratio_cell_dram = 1.5;
|
|
curr_c_dram_cell = 30e-15;
|
|
|
|
//COMM-DRAM wordline transistor parameters
|
|
curr_vpp = 2.7;
|
|
t_ox[3] = 4e-3;
|
|
v_th[3] = 1.0;
|
|
c_ox[3] = 7.98e-15;
|
|
mobility_eff[3] = 368.58 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[3] = 0.147;
|
|
c_g_ideal[3] = 3.59e-16;
|
|
c_fringe[3] = 0.08e-15;
|
|
c_junc[3] = 1e-15;
|
|
I_on_n[3] = 999.4e-6;
|
|
I_on_p[3] = I_on_n[3] / 2;
|
|
nmos_effective_resistance_multiplier = 1.69;
|
|
n_to_p_eff_curr_drv_ratio[3] = 1.95;
|
|
gmp_to_gmn_multiplier[3] = 0.90;
|
|
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
|
|
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 1.31e-14;
|
|
I_off_n[3][10] = 2.68e-14;
|
|
I_off_n[3][20] = 5.25e-14;
|
|
I_off_n[3][30] = 9.88e-14;
|
|
I_off_n[3][40] = 1.79e-13;
|
|
I_off_n[3][50] = 3.15e-13;
|
|
I_off_n[3][60] = 5.36e-13;
|
|
I_off_n[3][70] = 8.86e-13;
|
|
I_off_n[3][80] = 1.42e-12;
|
|
I_off_n[3][90] = 2.20e-12;
|
|
I_off_n[3][100] = 3.29e-12;
|
|
}
|
|
|
|
|
|
//SRAM cell properties
|
|
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_sram = 1.46;
|
|
//CAM cell properties //TODO: data need to be revisited
|
|
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_cam = 2.92;
|
|
//Empirical undifferetiated core/FU coefficient
|
|
curr_logic_scaling_co_eff = 0.7*0.7;
|
|
curr_core_tx_density = 1.25;
|
|
curr_sckt_co_eff = 1.1387;
|
|
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
|
|
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
|
|
}
|
|
|
|
if (tech == 32)
|
|
{
|
|
SENSE_AMP_D = .03e-9; // s
|
|
SENSE_AMP_P = 2.16e-15; // J
|
|
//For 2013, MPU/ASIC stagger-contacted M1 half-pitch is 32 nm (so this is 32 nm
|
|
//technology i.e. FEATURESIZE = 0.032). Using the SOI process numbers for
|
|
//HP and LSTP.
|
|
vdd[0] = 0.9;
|
|
Lphy[0] = 0.013;
|
|
Lelec[0] = 0.01013;
|
|
t_ox[0] = 0.5e-3;
|
|
v_th[0] = 0.21835;
|
|
c_ox[0] = 4.11e-14;
|
|
mobility_eff[0] = 361.84 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[0] = 5.09E-2;
|
|
c_g_ideal[0] = 5.34e-16;
|
|
c_fringe[0] = 0.04e-15;
|
|
c_junc[0] = 1e-15;
|
|
I_on_n[0] = 2211.7e-6;
|
|
I_on_p[0] = I_on_n[0] / 2;
|
|
nmos_effective_resistance_multiplier = 1.49;
|
|
n_to_p_eff_curr_drv_ratio[0] = 2.41;
|
|
gmp_to_gmn_multiplier[0] = 1.38;
|
|
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
|
|
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
|
|
long_channel_leakage_reduction[0] = 1/3.706;
|
|
//Using MASTAR, @300K (380K does not work in MASTAR), increase Lgate until Ion reduces to 95% or Lgate increase by 5% (DG device can only increase by 5%),
|
|
//whichever comes first
|
|
I_off_n[0][0] = 1.52e-7;
|
|
I_off_n[0][10] = 1.55e-7;
|
|
I_off_n[0][20] = 1.59e-7;
|
|
I_off_n[0][30] = 1.68e-7;
|
|
I_off_n[0][40] = 1.90e-7;
|
|
I_off_n[0][50] = 2.69e-7;
|
|
I_off_n[0][60] = 5.32e-7;
|
|
I_off_n[0][70] = 1.02e-6;
|
|
I_off_n[0][80] = 1.62e-6;
|
|
I_off_n[0][90] = 2.73e-6;
|
|
I_off_n[0][100] = 6.1e-6;
|
|
|
|
I_g_on_n[0][0] = 6.55e-8;//A/micron
|
|
I_g_on_n[0][10] = 6.55e-8;
|
|
I_g_on_n[0][20] = 6.55e-8;
|
|
I_g_on_n[0][30] = 6.55e-8;
|
|
I_g_on_n[0][40] = 6.55e-8;
|
|
I_g_on_n[0][50] = 6.55e-8;
|
|
I_g_on_n[0][60] = 6.55e-8;
|
|
I_g_on_n[0][70] = 6.55e-8;
|
|
I_g_on_n[0][80] = 6.55e-8;
|
|
I_g_on_n[0][90] = 6.55e-8;
|
|
I_g_on_n[0][100] = 6.55e-8;
|
|
|
|
// 32 DG
|
|
// I_g_on_n[0][0] = 2.71e-9;//A/micron
|
|
// I_g_on_n[0][10] = 2.71e-9;
|
|
// I_g_on_n[0][20] = 2.71e-9;
|
|
// I_g_on_n[0][30] = 2.71e-9;
|
|
// I_g_on_n[0][40] = 2.71e-9;
|
|
// I_g_on_n[0][50] = 2.71e-9;
|
|
// I_g_on_n[0][60] = 2.71e-9;
|
|
// I_g_on_n[0][70] = 2.71e-9;
|
|
// I_g_on_n[0][80] = 2.71e-9;
|
|
// I_g_on_n[0][90] = 2.71e-9;
|
|
// I_g_on_n[0][100] = 2.71e-9;
|
|
|
|
//LSTP device type
|
|
vdd[1] = 1;
|
|
Lphy[1] = 0.020;
|
|
Lelec[1] = 0.0173;
|
|
t_ox[1] = 1.2e-3;
|
|
v_th[1] = 0.513;
|
|
c_ox[1] = 2.29e-14;
|
|
mobility_eff[1] = 347.46 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[1] = 8.64e-2;
|
|
c_g_ideal[1] = 4.58e-16;
|
|
c_fringe[1] = 0.053e-15;
|
|
c_junc[1] = 1e-15;
|
|
I_on_n[1] = 683.6e-6;
|
|
I_on_p[1] = I_on_n[1] / 2;
|
|
nmos_effective_resistance_multiplier = 1.99;
|
|
n_to_p_eff_curr_drv_ratio[1] = 2.23;
|
|
gmp_to_gmn_multiplier[1] = 0.99;
|
|
Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
|
|
Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
|
|
long_channel_leakage_reduction[1] = 1/1.93;
|
|
I_off_n[1][0] = 2.06e-11;
|
|
I_off_n[1][10] = 3.30e-11;
|
|
I_off_n[1][20] = 5.15e-11;
|
|
I_off_n[1][30] = 7.83e-11;
|
|
I_off_n[1][40] = 1.16e-10;
|
|
I_off_n[1][50] = 1.69e-10;
|
|
I_off_n[1][60] = 2.40e-10;
|
|
I_off_n[1][70] = 3.34e-10;
|
|
I_off_n[1][80] = 4.54e-10;
|
|
I_off_n[1][90] = 5.96e-10;
|
|
I_off_n[1][100] = 7.44e-10;
|
|
|
|
I_g_on_n[1][0] = 3.73e-11;//A/micron
|
|
I_g_on_n[1][10] = 3.73e-11;
|
|
I_g_on_n[1][20] = 3.73e-11;
|
|
I_g_on_n[1][30] = 3.73e-11;
|
|
I_g_on_n[1][40] = 3.73e-11;
|
|
I_g_on_n[1][50] = 3.73e-11;
|
|
I_g_on_n[1][60] = 3.73e-11;
|
|
I_g_on_n[1][70] = 3.73e-11;
|
|
I_g_on_n[1][80] = 3.73e-11;
|
|
I_g_on_n[1][90] = 3.73e-11;
|
|
I_g_on_n[1][100] = 3.73e-11;
|
|
|
|
|
|
//LOP device type
|
|
vdd[2] = 0.6;
|
|
Lphy[2] = 0.016;
|
|
Lelec[2] = 0.01232;
|
|
t_ox[2] = 0.9e-3;
|
|
v_th[2] = 0.24227;
|
|
c_ox[2] = 2.84e-14;
|
|
mobility_eff[2] = 513.52 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[2] = 4.64e-2;
|
|
c_g_ideal[2] = 4.54e-16;
|
|
c_fringe[2] = 0.057e-15;
|
|
c_junc[2] = 1e-15;
|
|
I_on_n[2] = 827.8e-6;
|
|
I_on_p[2] = I_on_n[2] / 2;
|
|
nmos_effective_resistance_multiplier = 1.73;
|
|
n_to_p_eff_curr_drv_ratio[2] = 2.28;
|
|
gmp_to_gmn_multiplier[2] = 1.11;
|
|
Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
|
|
Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
|
|
long_channel_leakage_reduction[2] = 1/1.89;
|
|
I_off_n[2][0] = 5.94e-8;
|
|
I_off_n[2][10] = 7.23e-8;
|
|
I_off_n[2][20] = 8.7e-8;
|
|
I_off_n[2][30] = 1.04e-7;
|
|
I_off_n[2][40] = 1.22e-7;
|
|
I_off_n[2][50] = 1.43e-7;
|
|
I_off_n[2][60] = 1.65e-7;
|
|
I_off_n[2][70] = 1.90e-7;
|
|
I_off_n[2][80] = 2.15e-7;
|
|
I_off_n[2][90] = 2.39e-7;
|
|
I_off_n[2][100] = 2.63e-7;
|
|
|
|
I_g_on_n[2][0] = 2.93e-9;//A/micron
|
|
I_g_on_n[2][10] = 2.93e-9;
|
|
I_g_on_n[2][20] = 2.93e-9;
|
|
I_g_on_n[2][30] = 2.93e-9;
|
|
I_g_on_n[2][40] = 2.93e-9;
|
|
I_g_on_n[2][50] = 2.93e-9;
|
|
I_g_on_n[2][60] = 2.93e-9;
|
|
I_g_on_n[2][70] = 2.93e-9;
|
|
I_g_on_n[2][80] = 2.93e-9;
|
|
I_g_on_n[2][90] = 2.93e-9;
|
|
I_g_on_n[2][100] = 2.93e-9;
|
|
|
|
if (ram_cell_tech_type == lp_dram)
|
|
{
|
|
//LP-DRAM cell access transistor technology parameters
|
|
curr_vdd_dram_cell = 1.0;
|
|
Lphy[3] = 0.056;
|
|
Lelec[3] = 0.0419;//Assume Lelec is 30% lesser than Lphy for DRAM access and wordline transistors.
|
|
curr_v_th_dram_access_transistor = 0.44129;
|
|
width_dram_access_transistor = 0.056;
|
|
curr_I_on_dram_cell = 36e-6;
|
|
curr_I_off_dram_cell_worst_case_length_temp = 18.9e-12;
|
|
curr_Wmemcella_dram = width_dram_access_transistor;
|
|
curr_Wmemcellpmos_dram = 0;
|
|
curr_Wmemcellnmos_dram = 0;
|
|
curr_area_cell_dram = width_dram_access_transistor * Lphy[3] * 10.0;
|
|
curr_asp_ratio_cell_dram = 1.46;
|
|
curr_c_dram_cell = 20e-15;
|
|
|
|
//LP-DRAM wordline transistor parameters
|
|
curr_vpp = 1.5;
|
|
t_ox[3] = 2e-3;
|
|
v_th[3] = 0.44467;
|
|
c_ox[3] = 1.48e-14;
|
|
mobility_eff[3] = 408.12 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[3] = 0.174;
|
|
c_g_ideal[3] = 7.45e-16;
|
|
c_fringe[3] = 0.053e-15;
|
|
c_junc[3] = 1e-15;
|
|
I_on_n[3] = 1055.4e-6;
|
|
I_on_p[3] = I_on_n[3] / 2;
|
|
nmos_effective_resistance_multiplier = 1.65;
|
|
n_to_p_eff_curr_drv_ratio[3] = 2.05;
|
|
gmp_to_gmn_multiplier[3] = 0.90;
|
|
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
|
|
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 3.57e-11;
|
|
I_off_n[3][10] = 5.51e-11;
|
|
I_off_n[3][20] = 8.27e-11;
|
|
I_off_n[3][30] = 1.21e-10;
|
|
I_off_n[3][40] = 1.74e-10;
|
|
I_off_n[3][50] = 2.45e-10;
|
|
I_off_n[3][60] = 3.38e-10;
|
|
I_off_n[3][70] = 4.53e-10;
|
|
I_off_n[3][80] = 5.87e-10;
|
|
I_off_n[3][90] = 7.29e-10;
|
|
I_off_n[3][100] = 8.87e-10;
|
|
}
|
|
else if (ram_cell_tech_type == comm_dram)
|
|
{
|
|
//COMM-DRAM cell access transistor technology parameters
|
|
curr_vdd_dram_cell = 1.0;
|
|
Lphy[3] = 0.032;
|
|
Lelec[3] = 0.0205;//Assume Lelec is 30% lesser than Lphy for DRAM access and wordline transistors.
|
|
curr_v_th_dram_access_transistor = 1;
|
|
width_dram_access_transistor = 0.032;
|
|
curr_I_on_dram_cell = 20e-6;
|
|
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
|
|
curr_Wmemcella_dram = width_dram_access_transistor;
|
|
curr_Wmemcellpmos_dram = 0;
|
|
curr_Wmemcellnmos_dram = 0;
|
|
curr_area_cell_dram = 6*0.032*0.032;
|
|
curr_asp_ratio_cell_dram = 1.5;
|
|
curr_c_dram_cell = 30e-15;
|
|
|
|
//COMM-DRAM wordline transistor parameters
|
|
curr_vpp = 2.6;
|
|
t_ox[3] = 4e-3;
|
|
v_th[3] = 1.0;
|
|
c_ox[3] = 7.99e-15;
|
|
mobility_eff[3] = 380.76 * (1e-2 * 1e6 * 1e-2 * 1e6);
|
|
Vdsat[3] = 0.129;
|
|
c_g_ideal[3] = 2.56e-16;
|
|
c_fringe[3] = 0.053e-15;
|
|
c_junc[3] = 1e-15;
|
|
I_on_n[3] = 1024.5e-6;
|
|
I_on_p[3] = I_on_n[3] / 2;
|
|
nmos_effective_resistance_multiplier = 1.69;
|
|
n_to_p_eff_curr_drv_ratio[3] = 1.95;
|
|
gmp_to_gmn_multiplier[3] = 0.90;
|
|
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
|
|
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 3.63e-14;
|
|
I_off_n[3][10] = 7.18e-14;
|
|
I_off_n[3][20] = 1.36e-13;
|
|
I_off_n[3][30] = 2.49e-13;
|
|
I_off_n[3][40] = 4.41e-13;
|
|
I_off_n[3][50] = 7.55e-13;
|
|
I_off_n[3][60] = 1.26e-12;
|
|
I_off_n[3][70] = 2.03e-12;
|
|
I_off_n[3][80] = 3.19e-12;
|
|
I_off_n[3][90] = 4.87e-12;
|
|
I_off_n[3][100] = 7.16e-12;
|
|
}
|
|
|
|
//SRAM cell properties
|
|
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_sram = 1.46;
|
|
//CAM cell properties //TODO: data need to be revisited
|
|
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_cam = 2.92;
|
|
//Empirical undifferetiated core/FU coefficient
|
|
curr_logic_scaling_co_eff = 0.7*0.7*0.7;
|
|
curr_core_tx_density = 1.25/0.7;
|
|
curr_sckt_co_eff = 1.1111;
|
|
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
|
|
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
|
|
}
|
|
|
|
if(tech == 22){
|
|
//For 2016, MPU/ASIC stagger-contacted M1 half-pitch is 22 nm (so this is 22 nm
|
|
//technology i.e. FEATURESIZE = 0.022). Using the DG process numbers for HP.
|
|
//22 nm HP
|
|
vdd[0] = 0.8;
|
|
Lphy[0] = 0.009;//Lphy is the physical gate-length.
|
|
Lelec[0] = 0.00468;//Lelec is the electrical gate-length.
|
|
t_ox[0] = 0.55e-3;//micron
|
|
v_th[0] = 0.1395;//V
|
|
c_ox[0] = 3.63e-14;//F/micron2
|
|
mobility_eff[0] = 426.07 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
|
|
Vdsat[0] = 2.33e-2; //V/micron
|
|
c_g_ideal[0] = 3.27e-16;//F/micron
|
|
c_fringe[0] = 0.06e-15;//F/micron
|
|
c_junc[0] = 0;//F/micron2
|
|
I_on_n[0] = 2626.4e-6;//A/micron
|
|
I_on_p[0] = I_on_n[0] / 2;//A/micron //This value for I_on_p is not really used.
|
|
nmos_effective_resistance_multiplier = 1.45;
|
|
n_to_p_eff_curr_drv_ratio[0] = 2; //Wpmos/Wnmos = 2 in 2007 MASTAR. Look in
|
|
//"Dynamic" tab of Device workspace.
|
|
gmp_to_gmn_multiplier[0] = 1.38; //Just using the 32nm SOI value.
|
|
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
|
|
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
|
|
long_channel_leakage_reduction[0] = 1/3.274;
|
|
I_off_n[0][0] = 1.52e-7/1.5*1.2;//From 22nm, leakage current are directly from ITRS report rather than MASTAR, since MASTAR has serious bugs there.
|
|
I_off_n[0][10] = 1.55e-7/1.5*1.2;
|
|
I_off_n[0][20] = 1.59e-7/1.5*1.2;
|
|
I_off_n[0][30] = 1.68e-7/1.5*1.2;
|
|
I_off_n[0][40] = 1.90e-7/1.5*1.2;
|
|
I_off_n[0][50] = 2.69e-7/1.5*1.2;
|
|
I_off_n[0][60] = 5.32e-7/1.5*1.2;
|
|
I_off_n[0][70] = 1.02e-6/1.5*1.2;
|
|
I_off_n[0][80] = 1.62e-6/1.5*1.2;
|
|
I_off_n[0][90] = 2.73e-6/1.5*1.2;
|
|
I_off_n[0][100] = 6.1e-6/1.5*1.2;
|
|
//for 22nm DG HP
|
|
I_g_on_n[0][0] = 1.81e-9;//A/micron
|
|
I_g_on_n[0][10] = 1.81e-9;
|
|
I_g_on_n[0][20] = 1.81e-9;
|
|
I_g_on_n[0][30] = 1.81e-9;
|
|
I_g_on_n[0][40] = 1.81e-9;
|
|
I_g_on_n[0][50] = 1.81e-9;
|
|
I_g_on_n[0][60] = 1.81e-9;
|
|
I_g_on_n[0][70] = 1.81e-9;
|
|
I_g_on_n[0][80] = 1.81e-9;
|
|
I_g_on_n[0][90] = 1.81e-9;
|
|
I_g_on_n[0][100] = 1.81e-9;
|
|
|
|
//22 nm LSTP DG
|
|
vdd[1] = 0.8;
|
|
Lphy[1] = 0.014;
|
|
Lelec[1] = 0.008;//Lelec is the electrical gate-length.
|
|
t_ox[1] = 1.1e-3;//micron
|
|
v_th[1] = 0.40126;//V
|
|
c_ox[1] = 2.30e-14;//F/micron2
|
|
mobility_eff[1] = 738.09 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
|
|
Vdsat[1] = 6.64e-2; //V/micron
|
|
c_g_ideal[1] = 3.22e-16;//F/micron
|
|
c_fringe[1] = 0.08e-15;
|
|
c_junc[1] = 0;//F/micron2
|
|
I_on_n[1] = 727.6e-6;//A/micron
|
|
I_on_p[1] = I_on_n[1] / 2;
|
|
nmos_effective_resistance_multiplier = 1.99;
|
|
n_to_p_eff_curr_drv_ratio[1] = 2;
|
|
gmp_to_gmn_multiplier[1] = 0.99;
|
|
Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];//ohm-micron
|
|
Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];//ohm-micron
|
|
long_channel_leakage_reduction[1] = 1/1.89;
|
|
I_off_n[1][0] = 2.43e-11;
|
|
I_off_n[1][10] = 4.85e-11;
|
|
I_off_n[1][20] = 9.68e-11;
|
|
I_off_n[1][30] = 1.94e-10;
|
|
I_off_n[1][40] = 3.87e-10;
|
|
I_off_n[1][50] = 7.73e-10;
|
|
I_off_n[1][60] = 3.55e-10;
|
|
I_off_n[1][70] = 3.09e-9;
|
|
I_off_n[1][80] = 6.19e-9;
|
|
I_off_n[1][90] = 1.24e-8;
|
|
I_off_n[1][100]= 2.48e-8;
|
|
|
|
I_g_on_n[1][0] = 4.51e-10;//A/micron
|
|
I_g_on_n[1][10] = 4.51e-10;
|
|
I_g_on_n[1][20] = 4.51e-10;
|
|
I_g_on_n[1][30] = 4.51e-10;
|
|
I_g_on_n[1][40] = 4.51e-10;
|
|
I_g_on_n[1][50] = 4.51e-10;
|
|
I_g_on_n[1][60] = 4.51e-10;
|
|
I_g_on_n[1][70] = 4.51e-10;
|
|
I_g_on_n[1][80] = 4.51e-10;
|
|
I_g_on_n[1][90] = 4.51e-10;
|
|
I_g_on_n[1][100] = 4.51e-10;
|
|
|
|
//22 nm LOP
|
|
vdd[2] = 0.6;
|
|
Lphy[2] = 0.011;
|
|
Lelec[2] = 0.00604;//Lelec is the electrical gate-length.
|
|
t_ox[2] = 0.8e-3;//micron
|
|
v_th[2] = 0.2315;//V
|
|
c_ox[2] = 2.87e-14;//F/micron2
|
|
mobility_eff[2] = 698.37 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
|
|
Vdsat[2] = 1.81e-2; //V/micron
|
|
c_g_ideal[2] = 3.16e-16;//F/micron
|
|
c_fringe[2] = 0.08e-15;
|
|
c_junc[2] = 0;//F/micron2 This is Cj0 not Cjunc in MASTAR results->Dynamic Tab
|
|
I_on_n[2] = 916.1e-6;//A/micron
|
|
I_on_p[2] = I_on_n[2] / 2;
|
|
nmos_effective_resistance_multiplier = 1.73;
|
|
n_to_p_eff_curr_drv_ratio[2] = 2;
|
|
gmp_to_gmn_multiplier[2] = 1.11;
|
|
Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];//ohm-micron
|
|
Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];//ohm-micron
|
|
long_channel_leakage_reduction[2] = 1/2.38;
|
|
|
|
I_off_n[2][0] = 1.31e-8;
|
|
I_off_n[2][10] = 2.60e-8;
|
|
I_off_n[2][20] = 5.14e-8;
|
|
I_off_n[2][30] = 1.02e-7;
|
|
I_off_n[2][40] = 2.02e-7;
|
|
I_off_n[2][50] = 3.99e-7;
|
|
I_off_n[2][60] = 7.91e-7;
|
|
I_off_n[2][70] = 1.09e-6;
|
|
I_off_n[2][80] = 2.09e-6;
|
|
I_off_n[2][90] = 4.04e-6;
|
|
I_off_n[2][100]= 4.48e-6;
|
|
|
|
I_g_on_n[2][0] = 2.74e-9;//A/micron
|
|
I_g_on_n[2][10] = 2.74e-9;
|
|
I_g_on_n[2][20] = 2.74e-9;
|
|
I_g_on_n[2][30] = 2.74e-9;
|
|
I_g_on_n[2][40] = 2.74e-9;
|
|
I_g_on_n[2][50] = 2.74e-9;
|
|
I_g_on_n[2][60] = 2.74e-9;
|
|
I_g_on_n[2][70] = 2.74e-9;
|
|
I_g_on_n[2][80] = 2.74e-9;
|
|
I_g_on_n[2][90] = 2.74e-9;
|
|
I_g_on_n[2][100] = 2.74e-9;
|
|
|
|
|
|
|
|
if (ram_cell_tech_type == 3)
|
|
{}
|
|
else if (ram_cell_tech_type == 4)
|
|
{
|
|
//22 nm commodity DRAM cell access transistor technology parameters.
|
|
//parameters
|
|
curr_vdd_dram_cell = 0.9;//0.45;//This value has reduced greatly in 2007 ITRS for all technology nodes. In
|
|
//2005 ITRS, the value was about twice the value in 2007 ITRS
|
|
Lphy[3] = 0.022;//micron
|
|
Lelec[3] = 0.0181;//micron.
|
|
curr_v_th_dram_access_transistor = 1;//V
|
|
width_dram_access_transistor = 0.022;//micron
|
|
curr_I_on_dram_cell = 20e-6; //This is a typical value that I have always
|
|
//kept constant. In reality this could perhaps be lower
|
|
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;//A
|
|
curr_Wmemcella_dram = width_dram_access_transistor;
|
|
curr_Wmemcellpmos_dram = 0;
|
|
curr_Wmemcellnmos_dram = 0;
|
|
curr_area_cell_dram = 6*0.022*0.022;//micron2.
|
|
curr_asp_ratio_cell_dram = 0.667;
|
|
curr_c_dram_cell = 30e-15;//This is a typical value that I have alwaus
|
|
//kept constant.
|
|
|
|
//22 nm commodity DRAM wordline transistor parameters obtained using MASTAR.
|
|
curr_vpp = 2.3;//vpp. V
|
|
t_ox[3] = 3.5e-3;//micron
|
|
v_th[3] = 1.0;//V
|
|
c_ox[3] = 9.06e-15;//F/micron2
|
|
mobility_eff[3] = 367.29 * (1e-2 * 1e6 * 1e-2 * 1e6);//micron2 / Vs
|
|
Vdsat[3] = 0.0972; //V/micron
|
|
c_g_ideal[3] = 1.99e-16;//F/micron
|
|
c_fringe[3] = 0.053e-15;//F/micron
|
|
c_junc[3] = 1e-15;//F/micron2
|
|
I_on_n[3] = 910.5e-6;//A/micron
|
|
I_on_p[3] = I_on_n[3] / 2;//This value for I_on_p is not really used.
|
|
nmos_effective_resistance_multiplier = 1.69;//Using the value from 32nm.
|
|
//
|
|
n_to_p_eff_curr_drv_ratio[3] = 1.95;//Using the value from 32nm
|
|
gmp_to_gmn_multiplier[3] = 0.90;
|
|
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];//ohm-micron
|
|
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];//ohm-micron
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 1.1e-13; //A/micron
|
|
I_off_n[3][10] = 2.11e-13;
|
|
I_off_n[3][20] = 3.88e-13;
|
|
I_off_n[3][30] = 6.9e-13;
|
|
I_off_n[3][40] = 1.19e-12;
|
|
I_off_n[3][50] = 1.98e-12;
|
|
I_off_n[3][60] = 3.22e-12;
|
|
I_off_n[3][70] = 5.09e-12;
|
|
I_off_n[3][80] = 7.85e-12;
|
|
I_off_n[3][90] = 1.18e-11;
|
|
I_off_n[3][100] = 1.72e-11;
|
|
|
|
}
|
|
else
|
|
{
|
|
//some error handler
|
|
}
|
|
|
|
//SRAM cell properties
|
|
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_sram = 1.46;
|
|
//CAM cell properties //TODO: data need to be revisited
|
|
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_cam = 2.92;
|
|
//Empirical undifferetiated core/FU coefficient
|
|
curr_logic_scaling_co_eff = 0.7*0.7*0.7*0.7;
|
|
curr_core_tx_density = 1.25/0.7/0.7;
|
|
curr_sckt_co_eff = 1.1296;
|
|
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
|
|
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
|
|
}
|
|
|
|
if(tech == 16){
|
|
//For 2019, MPU/ASIC stagger-contacted M1 half-pitch is 16 nm (so this is 16 nm
|
|
//technology i.e. FEATURESIZE = 0.016). Using the DG process numbers for HP.
|
|
//16 nm HP
|
|
vdd[0] = 0.7;
|
|
Lphy[0] = 0.006;//Lphy is the physical gate-length.
|
|
Lelec[0] = 0.00315;//Lelec is the electrical gate-length.
|
|
t_ox[0] = 0.5e-3;//micron
|
|
v_th[0] = 0.1489;//V
|
|
c_ox[0] = 3.83e-14;//F/micron2 Cox_elec in MASTAR
|
|
mobility_eff[0] = 476.15 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
|
|
Vdsat[0] = 1.42e-2; //V/micron calculated in spreadsheet
|
|
c_g_ideal[0] = 2.30e-16;//F/micron
|
|
c_fringe[0] = 0.06e-15;//F/micron MASTAR inputdynamic/3
|
|
c_junc[0] = 0;//F/micron2 MASTAR result dynamic
|
|
I_on_n[0] = 2768.4e-6;//A/micron
|
|
I_on_p[0] = I_on_n[0] / 2;//A/micron //This value for I_on_p is not really used.
|
|
nmos_effective_resistance_multiplier = 1.48;//nmos_effective_resistance_multiplier is the ratio of Ieff to Idsat where Ieff is the effective NMOS current and Idsat is the saturation current.
|
|
n_to_p_eff_curr_drv_ratio[0] = 2; //Wpmos/Wnmos = 2 in 2007 MASTAR. Look in
|
|
//"Dynamic" tab of Device workspace.
|
|
gmp_to_gmn_multiplier[0] = 1.38; //Just using the 32nm SOI value.
|
|
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
|
|
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
|
|
long_channel_leakage_reduction[0] = 1/2.655;
|
|
I_off_n[0][0] = 1.52e-7/1.5*1.2*1.07;
|
|
I_off_n[0][10] = 1.55e-7/1.5*1.2*1.07;
|
|
I_off_n[0][20] = 1.59e-7/1.5*1.2*1.07;
|
|
I_off_n[0][30] = 1.68e-7/1.5*1.2*1.07;
|
|
I_off_n[0][40] = 1.90e-7/1.5*1.2*1.07;
|
|
I_off_n[0][50] = 2.69e-7/1.5*1.2*1.07;
|
|
I_off_n[0][60] = 5.32e-7/1.5*1.2*1.07;
|
|
I_off_n[0][70] = 1.02e-6/1.5*1.2*1.07;
|
|
I_off_n[0][80] = 1.62e-6/1.5*1.2*1.07;
|
|
I_off_n[0][90] = 2.73e-6/1.5*1.2*1.07;
|
|
I_off_n[0][100] = 6.1e-6/1.5*1.2*1.07;
|
|
//for 16nm DG HP
|
|
I_g_on_n[0][0] = 1.07e-9;//A/micron
|
|
I_g_on_n[0][10] = 1.07e-9;
|
|
I_g_on_n[0][20] = 1.07e-9;
|
|
I_g_on_n[0][30] = 1.07e-9;
|
|
I_g_on_n[0][40] = 1.07e-9;
|
|
I_g_on_n[0][50] = 1.07e-9;
|
|
I_g_on_n[0][60] = 1.07e-9;
|
|
I_g_on_n[0][70] = 1.07e-9;
|
|
I_g_on_n[0][80] = 1.07e-9;
|
|
I_g_on_n[0][90] = 1.07e-9;
|
|
I_g_on_n[0][100] = 1.07e-9;
|
|
|
|
// //16 nm LSTP DG
|
|
// vdd[1] = 0.8;
|
|
// Lphy[1] = 0.014;
|
|
// Lelec[1] = 0.008;//Lelec is the electrical gate-length.
|
|
// t_ox[1] = 1.1e-3;//micron
|
|
// v_th[1] = 0.40126;//V
|
|
// c_ox[1] = 2.30e-14;//F/micron2
|
|
// mobility_eff[1] = 738.09 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
|
|
// Vdsat[1] = 6.64e-2; //V/micron
|
|
// c_g_ideal[1] = 3.22e-16;//F/micron
|
|
// c_fringe[1] = 0.008e-15;
|
|
// c_junc[1] = 0;//F/micron2
|
|
// I_on_n[1] = 727.6e-6;//A/micron
|
|
// I_on_p[1] = I_on_n[1] / 2;
|
|
// nmos_effective_resistance_multiplier = 1.99;
|
|
// n_to_p_eff_curr_drv_ratio[1] = 2;
|
|
// gmp_to_gmn_multiplier[1] = 0.99;
|
|
// Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];//ohm-micron
|
|
// Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];//ohm-micron
|
|
// I_off_n[1][0] = 2.43e-11;
|
|
// I_off_n[1][10] = 4.85e-11;
|
|
// I_off_n[1][20] = 9.68e-11;
|
|
// I_off_n[1][30] = 1.94e-10;
|
|
// I_off_n[1][40] = 3.87e-10;
|
|
// I_off_n[1][50] = 7.73e-10;
|
|
// I_off_n[1][60] = 3.55e-10;
|
|
// I_off_n[1][70] = 3.09e-9;
|
|
// I_off_n[1][80] = 6.19e-9;
|
|
// I_off_n[1][90] = 1.24e-8;
|
|
// I_off_n[1][100]= 2.48e-8;
|
|
//
|
|
// // for 22nm LSTP HP
|
|
// I_g_on_n[1][0] = 4.51e-10;//A/micron
|
|
// I_g_on_n[1][10] = 4.51e-10;
|
|
// I_g_on_n[1][20] = 4.51e-10;
|
|
// I_g_on_n[1][30] = 4.51e-10;
|
|
// I_g_on_n[1][40] = 4.51e-10;
|
|
// I_g_on_n[1][50] = 4.51e-10;
|
|
// I_g_on_n[1][60] = 4.51e-10;
|
|
// I_g_on_n[1][70] = 4.51e-10;
|
|
// I_g_on_n[1][80] = 4.51e-10;
|
|
// I_g_on_n[1][90] = 4.51e-10;
|
|
// I_g_on_n[1][100] = 4.51e-10;
|
|
|
|
|
|
if (ram_cell_tech_type == 3)
|
|
{}
|
|
else if (ram_cell_tech_type == 4)
|
|
{
|
|
//22 nm commodity DRAM cell access transistor technology parameters.
|
|
//parameters
|
|
curr_vdd_dram_cell = 0.9;//0.45;//This value has reduced greatly in 2007 ITRS for all technology nodes. In
|
|
//2005 ITRS, the value was about twice the value in 2007 ITRS
|
|
Lphy[3] = 0.022;//micron
|
|
Lelec[3] = 0.0181;//micron.
|
|
curr_v_th_dram_access_transistor = 1;//V
|
|
width_dram_access_transistor = 0.022;//micron
|
|
curr_I_on_dram_cell = 20e-6; //This is a typical value that I have always
|
|
//kept constant. In reality this could perhaps be lower
|
|
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;//A
|
|
curr_Wmemcella_dram = width_dram_access_transistor;
|
|
curr_Wmemcellpmos_dram = 0;
|
|
curr_Wmemcellnmos_dram = 0;
|
|
curr_area_cell_dram = 6*0.022*0.022;//micron2.
|
|
curr_asp_ratio_cell_dram = 0.667;
|
|
curr_c_dram_cell = 30e-15;//This is a typical value that I have alwaus
|
|
//kept constant.
|
|
|
|
//22 nm commodity DRAM wordline transistor parameters obtained using MASTAR.
|
|
curr_vpp = 2.3;//vpp. V
|
|
t_ox[3] = 3.5e-3;//micron
|
|
v_th[3] = 1.0;//V
|
|
c_ox[3] = 9.06e-15;//F/micron2
|
|
mobility_eff[3] = 367.29 * (1e-2 * 1e6 * 1e-2 * 1e6);//micron2 / Vs
|
|
Vdsat[3] = 0.0972; //V/micron
|
|
c_g_ideal[3] = 1.99e-16;//F/micron
|
|
c_fringe[3] = 0.053e-15;//F/micron
|
|
c_junc[3] = 1e-15;//F/micron2
|
|
I_on_n[3] = 910.5e-6;//A/micron
|
|
I_on_p[3] = I_on_n[3] / 2;//This value for I_on_p is not really used.
|
|
nmos_effective_resistance_multiplier = 1.69;//Using the value from 32nm.
|
|
//
|
|
n_to_p_eff_curr_drv_ratio[3] = 1.95;//Using the value from 32nm
|
|
gmp_to_gmn_multiplier[3] = 0.90;
|
|
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];//ohm-micron
|
|
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];//ohm-micron
|
|
long_channel_leakage_reduction[3] = 1;
|
|
I_off_n[3][0] = 1.1e-13; //A/micron
|
|
I_off_n[3][10] = 2.11e-13;
|
|
I_off_n[3][20] = 3.88e-13;
|
|
I_off_n[3][30] = 6.9e-13;
|
|
I_off_n[3][40] = 1.19e-12;
|
|
I_off_n[3][50] = 1.98e-12;
|
|
I_off_n[3][60] = 3.22e-12;
|
|
I_off_n[3][70] = 5.09e-12;
|
|
I_off_n[3][80] = 7.85e-12;
|
|
I_off_n[3][90] = 1.18e-11;
|
|
I_off_n[3][100] = 1.72e-11;
|
|
|
|
}
|
|
else
|
|
{
|
|
//some error handler
|
|
}
|
|
|
|
//SRAM cell properties
|
|
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_sram = 1.46;
|
|
//CAM cell properties //TODO: data need to be revisited
|
|
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
|
|
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
|
|
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
|
|
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
|
|
curr_asp_ratio_cell_cam = 2.92;
|
|
//Empirical undifferetiated core/FU coefficient
|
|
curr_logic_scaling_co_eff = 0.7*0.7*0.7*0.7*0.7;
|
|
curr_core_tx_density = 1.25/0.7/0.7/0.7;
|
|
curr_sckt_co_eff = 1.1296;
|
|
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
|
|
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
|
|
}
|
|
|
|
|
|
g_tp.peri_global.Vdd += curr_alpha * vdd[peri_global_tech_type];
|
|
g_tp.peri_global.t_ox += curr_alpha * t_ox[peri_global_tech_type];
|
|
g_tp.peri_global.Vth += curr_alpha * v_th[peri_global_tech_type];
|
|
g_tp.peri_global.C_ox += curr_alpha * c_ox[peri_global_tech_type];
|
|
g_tp.peri_global.C_g_ideal += curr_alpha * c_g_ideal[peri_global_tech_type];
|
|
g_tp.peri_global.C_fringe += curr_alpha * c_fringe[peri_global_tech_type];
|
|
g_tp.peri_global.C_junc += curr_alpha * c_junc[peri_global_tech_type];
|
|
g_tp.peri_global.C_junc_sidewall = 0.25e-15; // F/micron
|
|
g_tp.peri_global.l_phy += curr_alpha * Lphy[peri_global_tech_type];
|
|
g_tp.peri_global.l_elec += curr_alpha * Lelec[peri_global_tech_type];
|
|
g_tp.peri_global.I_on_n += curr_alpha * I_on_n[peri_global_tech_type];
|
|
g_tp.peri_global.R_nch_on += curr_alpha * Rnchannelon[peri_global_tech_type];
|
|
g_tp.peri_global.R_pch_on += curr_alpha * Rpchannelon[peri_global_tech_type];
|
|
g_tp.peri_global.n_to_p_eff_curr_drv_ratio
|
|
+= curr_alpha * n_to_p_eff_curr_drv_ratio[peri_global_tech_type];
|
|
g_tp.peri_global.long_channel_leakage_reduction
|
|
+= curr_alpha * long_channel_leakage_reduction[peri_global_tech_type];
|
|
g_tp.peri_global.I_off_n += curr_alpha * I_off_n[peri_global_tech_type][g_ip->temp - 300];
|
|
g_tp.peri_global.I_off_p += curr_alpha * I_off_n[peri_global_tech_type][g_ip->temp - 300];
|
|
g_tp.peri_global.I_g_on_n += curr_alpha * I_g_on_n[peri_global_tech_type][g_ip->temp - 300];
|
|
g_tp.peri_global.I_g_on_p += curr_alpha * I_g_on_n[peri_global_tech_type][g_ip->temp - 300];
|
|
gmp_to_gmn_multiplier_periph_global += curr_alpha * gmp_to_gmn_multiplier[peri_global_tech_type];
|
|
|
|
g_tp.sram_cell.Vdd += curr_alpha * vdd[ram_cell_tech_type];
|
|
g_tp.sram_cell.l_phy += curr_alpha * Lphy[ram_cell_tech_type];
|
|
g_tp.sram_cell.l_elec += curr_alpha * Lelec[ram_cell_tech_type];
|
|
g_tp.sram_cell.t_ox += curr_alpha * t_ox[ram_cell_tech_type];
|
|
g_tp.sram_cell.Vth += curr_alpha * v_th[ram_cell_tech_type];
|
|
g_tp.sram_cell.C_g_ideal += curr_alpha * c_g_ideal[ram_cell_tech_type];
|
|
g_tp.sram_cell.C_fringe += curr_alpha * c_fringe[ram_cell_tech_type];
|
|
g_tp.sram_cell.C_junc += curr_alpha * c_junc[ram_cell_tech_type];
|
|
g_tp.sram_cell.C_junc_sidewall = 0.25e-15; // F/micron
|
|
g_tp.sram_cell.I_on_n += curr_alpha * I_on_n[ram_cell_tech_type];
|
|
g_tp.sram_cell.R_nch_on += curr_alpha * Rnchannelon[ram_cell_tech_type];
|
|
g_tp.sram_cell.R_pch_on += curr_alpha * Rpchannelon[ram_cell_tech_type];
|
|
g_tp.sram_cell.n_to_p_eff_curr_drv_ratio += curr_alpha * n_to_p_eff_curr_drv_ratio[ram_cell_tech_type];
|
|
g_tp.sram_cell.long_channel_leakage_reduction += curr_alpha * long_channel_leakage_reduction[ram_cell_tech_type];
|
|
g_tp.sram_cell.I_off_n += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
|
|
g_tp.sram_cell.I_off_p += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
|
|
g_tp.sram_cell.I_g_on_n += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
|
|
g_tp.sram_cell.I_g_on_p += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
|
|
|
|
g_tp.dram_cell_Vdd += curr_alpha * curr_vdd_dram_cell;
|
|
g_tp.dram_acc.Vth += curr_alpha * curr_v_th_dram_access_transistor;
|
|
g_tp.dram_acc.l_phy += curr_alpha * Lphy[dram_cell_tech_flavor];
|
|
g_tp.dram_acc.l_elec += curr_alpha * Lelec[dram_cell_tech_flavor];
|
|
g_tp.dram_acc.C_g_ideal += curr_alpha * c_g_ideal[dram_cell_tech_flavor];
|
|
g_tp.dram_acc.C_fringe += curr_alpha * c_fringe[dram_cell_tech_flavor];
|
|
g_tp.dram_acc.C_junc += curr_alpha * c_junc[dram_cell_tech_flavor];
|
|
g_tp.dram_acc.C_junc_sidewall = 0.25e-15; // F/micron
|
|
g_tp.dram_cell_I_on += curr_alpha * curr_I_on_dram_cell;
|
|
g_tp.dram_cell_I_off_worst_case_len_temp += curr_alpha * curr_I_off_dram_cell_worst_case_length_temp;
|
|
g_tp.dram_acc.I_on_n += curr_alpha * I_on_n[dram_cell_tech_flavor];
|
|
g_tp.dram_cell_C += curr_alpha * curr_c_dram_cell;
|
|
g_tp.vpp += curr_alpha * curr_vpp;
|
|
g_tp.dram_wl.l_phy += curr_alpha * Lphy[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.l_elec += curr_alpha * Lelec[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.C_g_ideal += curr_alpha * c_g_ideal[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.C_fringe += curr_alpha * c_fringe[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.C_junc += curr_alpha * c_junc[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.C_junc_sidewall = 0.25e-15; // F/micron
|
|
g_tp.dram_wl.I_on_n += curr_alpha * I_on_n[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.R_nch_on += curr_alpha * Rnchannelon[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.R_pch_on += curr_alpha * Rpchannelon[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.n_to_p_eff_curr_drv_ratio += curr_alpha * n_to_p_eff_curr_drv_ratio[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.long_channel_leakage_reduction += curr_alpha * long_channel_leakage_reduction[dram_cell_tech_flavor];
|
|
g_tp.dram_wl.I_off_n += curr_alpha * I_off_n[dram_cell_tech_flavor][g_ip->temp - 300];
|
|
g_tp.dram_wl.I_off_p += curr_alpha * I_off_n[dram_cell_tech_flavor][g_ip->temp - 300];
|
|
|
|
g_tp.cam_cell.Vdd += curr_alpha * vdd[ram_cell_tech_type];
|
|
g_tp.cam_cell.l_phy += curr_alpha * Lphy[ram_cell_tech_type];
|
|
g_tp.cam_cell.l_elec += curr_alpha * Lelec[ram_cell_tech_type];
|
|
g_tp.cam_cell.t_ox += curr_alpha * t_ox[ram_cell_tech_type];
|
|
g_tp.cam_cell.Vth += curr_alpha * v_th[ram_cell_tech_type];
|
|
g_tp.cam_cell.C_g_ideal += curr_alpha * c_g_ideal[ram_cell_tech_type];
|
|
g_tp.cam_cell.C_fringe += curr_alpha * c_fringe[ram_cell_tech_type];
|
|
g_tp.cam_cell.C_junc += curr_alpha * c_junc[ram_cell_tech_type];
|
|
g_tp.cam_cell.C_junc_sidewall = 0.25e-15; // F/micron
|
|
g_tp.cam_cell.I_on_n += curr_alpha * I_on_n[ram_cell_tech_type];
|
|
g_tp.cam_cell.R_nch_on += curr_alpha * Rnchannelon[ram_cell_tech_type];
|
|
g_tp.cam_cell.R_pch_on += curr_alpha * Rpchannelon[ram_cell_tech_type];
|
|
g_tp.cam_cell.n_to_p_eff_curr_drv_ratio += curr_alpha * n_to_p_eff_curr_drv_ratio[ram_cell_tech_type];
|
|
g_tp.cam_cell.long_channel_leakage_reduction += curr_alpha * long_channel_leakage_reduction[ram_cell_tech_type];
|
|
g_tp.cam_cell.I_off_n += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
|
|
g_tp.cam_cell.I_off_p += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
|
|
g_tp.cam_cell.I_g_on_n += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
|
|
g_tp.cam_cell.I_g_on_p += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
|
|
|
|
g_tp.dram.cell_a_w += curr_alpha * curr_Wmemcella_dram;
|
|
g_tp.dram.cell_pmos_w += curr_alpha * curr_Wmemcellpmos_dram;
|
|
g_tp.dram.cell_nmos_w += curr_alpha * curr_Wmemcellnmos_dram;
|
|
area_cell_dram += curr_alpha * curr_area_cell_dram;
|
|
asp_ratio_cell_dram += curr_alpha * curr_asp_ratio_cell_dram;
|
|
|
|
g_tp.sram.cell_a_w += curr_alpha * curr_Wmemcella_sram;
|
|
g_tp.sram.cell_pmos_w += curr_alpha * curr_Wmemcellpmos_sram;
|
|
g_tp.sram.cell_nmos_w += curr_alpha * curr_Wmemcellnmos_sram;
|
|
area_cell_sram += curr_alpha * curr_area_cell_sram;
|
|
asp_ratio_cell_sram += curr_alpha * curr_asp_ratio_cell_sram;
|
|
|
|
g_tp.cam.cell_a_w += curr_alpha * curr_Wmemcella_cam;//sheng
|
|
g_tp.cam.cell_pmos_w += curr_alpha * curr_Wmemcellpmos_cam;
|
|
g_tp.cam.cell_nmos_w += curr_alpha * curr_Wmemcellnmos_cam;
|
|
area_cell_cam += curr_alpha * curr_area_cell_cam;
|
|
asp_ratio_cell_cam += curr_alpha * curr_asp_ratio_cell_cam;
|
|
|
|
//Sense amplifier latch Gm calculation
|
|
mobility_eff_periph_global += curr_alpha * mobility_eff[peri_global_tech_type];
|
|
Vdsat_periph_global += curr_alpha * Vdsat[peri_global_tech_type];
|
|
|
|
//Empirical undifferetiated core/FU coefficient
|
|
g_tp.scaling_factor.logic_scaling_co_eff += curr_alpha * curr_logic_scaling_co_eff;
|
|
g_tp.scaling_factor.core_tx_density += curr_alpha * curr_core_tx_density;
|
|
g_tp.chip_layout_overhead += curr_alpha * curr_chip_layout_overhead;
|
|
g_tp.macro_layout_overhead += curr_alpha * curr_macro_layout_overhead;
|
|
g_tp.sckt_co_eff += curr_alpha * curr_sckt_co_eff;
|
|
}
|
|
|
|
|
|
//Currently we are not modeling the resistance/capacitance of poly anywhere.
|
|
//Continuous function (or date have been processed) does not need linear interpolation
|
|
g_tp.w_comp_inv_p1 = 12.5 * g_ip->F_sz_um;//this was 10 micron for the 0.8 micron process
|
|
g_tp.w_comp_inv_n1 = 7.5 * g_ip->F_sz_um;//this was 6 micron for the 0.8 micron process
|
|
g_tp.w_comp_inv_p2 = 25 * g_ip->F_sz_um;//this was 20 micron for the 0.8 micron process
|
|
g_tp.w_comp_inv_n2 = 15 * g_ip->F_sz_um;//this was 12 micron for the 0.8 micron process
|
|
g_tp.w_comp_inv_p3 = 50 * g_ip->F_sz_um;//this was 40 micron for the 0.8 micron process
|
|
g_tp.w_comp_inv_n3 = 30 * g_ip->F_sz_um;//this was 24 micron for the 0.8 micron process
|
|
g_tp.w_eval_inv_p = 100 * g_ip->F_sz_um;//this was 80 micron for the 0.8 micron process
|
|
g_tp.w_eval_inv_n = 50 * g_ip->F_sz_um;//this was 40 micron for the 0.8 micron process
|
|
g_tp.w_comp_n = 12.5 * g_ip->F_sz_um;//this was 10 micron for the 0.8 micron process
|
|
g_tp.w_comp_p = 37.5 * g_ip->F_sz_um;//this was 30 micron for the 0.8 micron process
|
|
|
|
g_tp.MIN_GAP_BET_P_AND_N_DIFFS = 5 * g_ip->F_sz_um;
|
|
g_tp.MIN_GAP_BET_SAME_TYPE_DIFFS = 1.5 * g_ip->F_sz_um;
|
|
g_tp.HPOWERRAIL = 2 * g_ip->F_sz_um;
|
|
g_tp.cell_h_def = 50 * g_ip->F_sz_um;
|
|
g_tp.w_poly_contact = g_ip->F_sz_um;
|
|
g_tp.spacing_poly_to_contact = g_ip->F_sz_um;
|
|
g_tp.spacing_poly_to_poly = 1.5 * g_ip->F_sz_um;
|
|
g_tp.ram_wl_stitching_overhead_ = 7.5 * g_ip->F_sz_um;
|
|
|
|
g_tp.min_w_nmos_ = 3 * g_ip->F_sz_um / 2;
|
|
g_tp.max_w_nmos_ = 100 * g_ip->F_sz_um;
|
|
g_tp.w_iso = 12.5*g_ip->F_sz_um;//was 10 micron for the 0.8 micron process
|
|
g_tp.w_sense_n = 3.75*g_ip->F_sz_um; // sense amplifier N-trans; was 3 micron for the 0.8 micron process
|
|
g_tp.w_sense_p = 7.5*g_ip->F_sz_um; // sense amplifier P-trans; was 6 micron for the 0.8 micron process
|
|
g_tp.w_sense_en = 5*g_ip->F_sz_um; // Sense enable transistor of the sense amplifier; was 4 micron for the 0.8 micron process
|
|
g_tp.w_nmos_b_mux = 6 * g_tp.min_w_nmos_;
|
|
g_tp.w_nmos_sa_mux = 6 * g_tp.min_w_nmos_;
|
|
|
|
if (ram_cell_tech_type == comm_dram)
|
|
{
|
|
g_tp.max_w_nmos_dec = 8 * g_ip->F_sz_um;
|
|
g_tp.h_dec = 8; // in the unit of memory cell height
|
|
}
|
|
else
|
|
{
|
|
g_tp.max_w_nmos_dec = g_tp.max_w_nmos_;
|
|
g_tp.h_dec = 4; // in the unit of memory cell height
|
|
}
|
|
|
|
g_tp.peri_global.C_overlap = 0.2 * g_tp.peri_global.C_g_ideal;
|
|
g_tp.sram_cell.C_overlap = 0.2 * g_tp.sram_cell.C_g_ideal;
|
|
g_tp.cam_cell.C_overlap = 0.2 * g_tp.cam_cell.C_g_ideal;
|
|
|
|
g_tp.dram_acc.C_overlap = 0.2 * g_tp.dram_acc.C_g_ideal;
|
|
g_tp.dram_acc.R_nch_on = g_tp.dram_cell_Vdd / g_tp.dram_acc.I_on_n;
|
|
//g_tp.dram_acc.R_pch_on = g_tp.dram_cell_Vdd / g_tp.dram_acc.I_on_p;
|
|
|
|
g_tp.dram_wl.C_overlap = 0.2 * g_tp.dram_wl.C_g_ideal;
|
|
|
|
double gmn_sense_amp_latch = (mobility_eff_periph_global / 2) * g_tp.peri_global.C_ox * (g_tp.w_sense_n / g_tp.peri_global.l_elec) * Vdsat_periph_global;
|
|
double gmp_sense_amp_latch = gmp_to_gmn_multiplier_periph_global * gmn_sense_amp_latch;
|
|
g_tp.gm_sense_amp_latch = gmn_sense_amp_latch + gmp_sense_amp_latch;
|
|
|
|
g_tp.dram.b_w = sqrt(area_cell_dram / (asp_ratio_cell_dram));
|
|
g_tp.dram.b_h = asp_ratio_cell_dram * g_tp.dram.b_w;
|
|
g_tp.sram.b_w = sqrt(area_cell_sram / (asp_ratio_cell_sram));
|
|
g_tp.sram.b_h = asp_ratio_cell_sram * g_tp.sram.b_w;
|
|
g_tp.cam.b_w = sqrt(area_cell_cam / (asp_ratio_cell_cam));//Sheng
|
|
g_tp.cam.b_h = asp_ratio_cell_cam * g_tp.cam.b_w;
|
|
|
|
g_tp.dram.Vbitpre = g_tp.dram_cell_Vdd;
|
|
g_tp.sram.Vbitpre = vdd[ram_cell_tech_type];
|
|
g_tp.cam.Vbitpre = vdd[ram_cell_tech_type];//Sheng
|
|
pmos_to_nmos_sizing_r = pmos_to_nmos_sz_ratio();
|
|
g_tp.w_pmos_bl_precharge = 6 * pmos_to_nmos_sizing_r * g_tp.min_w_nmos_;
|
|
g_tp.w_pmos_bl_eq = pmos_to_nmos_sizing_r * g_tp.min_w_nmos_;
|
|
|
|
|
|
double wire_pitch [NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
|
|
wire_r_per_micron[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
|
|
wire_c_per_micron[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
|
|
horiz_dielectric_constant[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
|
|
vert_dielectric_constant[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
|
|
aspect_ratio[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
|
|
miller_value[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
|
|
ild_thickness[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES];
|
|
|
|
for (iter=0; iter<=1; ++iter)
|
|
{
|
|
// linear interpolation
|
|
if (iter == 0)
|
|
{
|
|
tech = tech_lo;
|
|
if (tech_lo == tech_hi)
|
|
{
|
|
curr_alpha = 1;
|
|
}
|
|
else
|
|
{
|
|
curr_alpha = (technology - tech_hi)/(tech_lo - tech_hi);
|
|
}
|
|
}
|
|
else
|
|
{
|
|
tech = tech_hi;
|
|
if (tech_lo == tech_hi)
|
|
{
|
|
break;
|
|
}
|
|
else
|
|
{
|
|
curr_alpha = (tech_lo - technology)/(tech_lo - tech_hi);
|
|
}
|
|
}
|
|
|
|
if (tech == 90)
|
|
{
|
|
//Aggressive projections
|
|
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//micron
|
|
aspect_ratio[0][0] = 2.4;
|
|
wire_width = wire_pitch[0][0] / 2; //micron
|
|
wire_thickness = aspect_ratio[0][0] * wire_width;//micron
|
|
wire_spacing = wire_pitch[0][0] - wire_width;//micron
|
|
barrier_thickness = 0.01;//micron
|
|
dishing_thickness = 0;//micron
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[0][0] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);//ohm/micron
|
|
ild_thickness[0][0] = 0.48;//micron
|
|
miller_value[0][0] = 1.5;
|
|
horiz_dielectric_constant[0][0] = 2.709;
|
|
vert_dielectric_constant[0][0] = 3.9;
|
|
fringe_cap = 0.115e-15; //F/micron
|
|
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0],
|
|
vert_dielectric_constant[0][0],
|
|
fringe_cap);//F/micron.
|
|
|
|
wire_pitch[0][1] = 4 * g_ip->F_sz_um;
|
|
wire_width = wire_pitch[0][1] / 2;
|
|
aspect_ratio[0][1] = 2.4;
|
|
wire_thickness = aspect_ratio[0][1] * wire_width;
|
|
wire_spacing = wire_pitch[0][1] - wire_width;
|
|
wire_r_per_micron[0][1] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][1] = 0.48;//micron
|
|
miller_value[0][1] = 1.5;
|
|
horiz_dielectric_constant[0][1] = 2.709;
|
|
vert_dielectric_constant[0][1] = 3.9;
|
|
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1],
|
|
vert_dielectric_constant[0][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[0][2] = 2.7;
|
|
wire_width = wire_pitch[0][2] / 2;
|
|
wire_thickness = aspect_ratio[0][2] * wire_width;
|
|
wire_spacing = wire_pitch[0][2] - wire_width;
|
|
wire_r_per_micron[0][2] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][2] = 0.96;
|
|
miller_value[0][2] = 1.5;
|
|
horiz_dielectric_constant[0][2] = 2.709;
|
|
vert_dielectric_constant[0][2] = 3.9;
|
|
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
|
|
fringe_cap);
|
|
|
|
//Conservative projections
|
|
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
|
|
aspect_ratio[1][0] = 2.0;
|
|
wire_width = wire_pitch[1][0] / 2;
|
|
wire_thickness = aspect_ratio[1][0] * wire_width;
|
|
wire_spacing = wire_pitch[1][0] - wire_width;
|
|
barrier_thickness = 0.008;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][0] = 0.48;
|
|
miller_value[1][0] = 1.5;
|
|
horiz_dielectric_constant[1][0] = 3.038;
|
|
vert_dielectric_constant[1][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0],
|
|
vert_dielectric_constant[1][0],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
|
|
wire_width = wire_pitch[1][1] / 2;
|
|
aspect_ratio[1][1] = 2.0;
|
|
wire_thickness = aspect_ratio[1][1] * wire_width;
|
|
wire_spacing = wire_pitch[1][1] - wire_width;
|
|
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][1] = 0.48;
|
|
miller_value[1][1] = 1.5;
|
|
horiz_dielectric_constant[1][1] = 3.038;
|
|
vert_dielectric_constant[1][1] = 3.9;
|
|
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1],
|
|
vert_dielectric_constant[1][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[1][2] = 2.2;
|
|
wire_width = wire_pitch[1][2] / 2;
|
|
wire_thickness = aspect_ratio[1][2] * wire_width;
|
|
wire_spacing = wire_pitch[1][2] - wire_width;
|
|
dishing_thickness = 0.1 * wire_thickness;
|
|
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][2] = 1.1;
|
|
miller_value[1][2] = 1.5;
|
|
horiz_dielectric_constant[1][2] = 3.038;
|
|
vert_dielectric_constant[1][2] = 3.9;
|
|
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][2] , miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
|
|
fringe_cap);
|
|
//Nominal projections for commodity DRAM wordline/bitline
|
|
wire_pitch[1][3] = 2 * 0.09;
|
|
wire_c_per_micron[1][3] = 60e-15 / (256 * 2 * 0.09);
|
|
wire_r_per_micron[1][3] = 12 / 0.09;
|
|
}
|
|
else if (tech == 65)
|
|
{
|
|
//Aggressive projections
|
|
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;
|
|
aspect_ratio[0][0] = 2.7;
|
|
wire_width = wire_pitch[0][0] / 2;
|
|
wire_thickness = aspect_ratio[0][0] * wire_width;
|
|
wire_spacing = wire_pitch[0][0] - wire_width;
|
|
barrier_thickness = 0;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][0] = 0.405;
|
|
miller_value[0][0] = 1.5;
|
|
horiz_dielectric_constant[0][0] = 2.303;
|
|
vert_dielectric_constant[0][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][0] , miller_value[0][0] , horiz_dielectric_constant[0][0] , vert_dielectric_constant[0][0] ,
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][1] = 4 * g_ip->F_sz_um;
|
|
wire_width = wire_pitch[0][1] / 2;
|
|
aspect_ratio[0][1] = 2.7;
|
|
wire_thickness = aspect_ratio[0][1] * wire_width;
|
|
wire_spacing = wire_pitch[0][1] - wire_width;
|
|
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][1] = 0.405;
|
|
miller_value[0][1] = 1.5;
|
|
horiz_dielectric_constant[0][1] = 2.303;
|
|
vert_dielectric_constant[0][1] = 3.9;
|
|
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1],
|
|
vert_dielectric_constant[0][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[0][2] = 2.8;
|
|
wire_width = wire_pitch[0][2] / 2;
|
|
wire_thickness = aspect_ratio[0][2] * wire_width;
|
|
wire_spacing = wire_pitch[0][2] - wire_width;
|
|
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][2] = 0.81;
|
|
miller_value[0][2] = 1.5;
|
|
horiz_dielectric_constant[0][2] = 2.303;
|
|
vert_dielectric_constant[0][2] = 3.9;
|
|
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
|
|
fringe_cap);
|
|
|
|
//Conservative projections
|
|
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
|
|
aspect_ratio[1][0] = 2.0;
|
|
wire_width = wire_pitch[1][0] / 2;
|
|
wire_thickness = aspect_ratio[1][0] * wire_width;
|
|
wire_spacing = wire_pitch[1][0] - wire_width;
|
|
barrier_thickness = 0.006;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][0] = 0.405;
|
|
miller_value[1][0] = 1.5;
|
|
horiz_dielectric_constant[1][0] = 2.734;
|
|
vert_dielectric_constant[1][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
|
|
wire_width = wire_pitch[1][1] / 2;
|
|
aspect_ratio[1][1] = 2.0;
|
|
wire_thickness = aspect_ratio[1][1] * wire_width;
|
|
wire_spacing = wire_pitch[1][1] - wire_width;
|
|
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][1] = 0.405;
|
|
miller_value[1][1] = 1.5;
|
|
horiz_dielectric_constant[1][1] = 2.734;
|
|
vert_dielectric_constant[1][1] = 3.9;
|
|
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[1][2] = 2.2;
|
|
wire_width = wire_pitch[1][2] / 2;
|
|
wire_thickness = aspect_ratio[1][2] * wire_width;
|
|
wire_spacing = wire_pitch[1][2] - wire_width;
|
|
dishing_thickness = 0.1 * wire_thickness;
|
|
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][2] = 0.77;
|
|
miller_value[1][2] = 1.5;
|
|
horiz_dielectric_constant[1][2] = 2.734;
|
|
vert_dielectric_constant[1][2] = 3.9;
|
|
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
|
|
fringe_cap);
|
|
//Nominal projections for commodity DRAM wordline/bitline
|
|
wire_pitch[1][3] = 2 * 0.065;
|
|
wire_c_per_micron[1][3] = 52.5e-15 / (256 * 2 * 0.065);
|
|
wire_r_per_micron[1][3] = 12 / 0.065;
|
|
}
|
|
else if (tech == 45)
|
|
{
|
|
//Aggressive projections.
|
|
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;
|
|
aspect_ratio[0][0] = 3.0;
|
|
wire_width = wire_pitch[0][0] / 2;
|
|
wire_thickness = aspect_ratio[0][0] * wire_width;
|
|
wire_spacing = wire_pitch[0][0] - wire_width;
|
|
barrier_thickness = 0;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][0] = 0.315;
|
|
miller_value[0][0] = 1.5;
|
|
horiz_dielectric_constant[0][0] = 1.958;
|
|
vert_dielectric_constant[0][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][0] , miller_value[0][0] , horiz_dielectric_constant[0][0] , vert_dielectric_constant[0][0] ,
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][1] = 4 * g_ip->F_sz_um;
|
|
wire_width = wire_pitch[0][1] / 2;
|
|
aspect_ratio[0][1] = 3.0;
|
|
wire_thickness = aspect_ratio[0][1] * wire_width;
|
|
wire_spacing = wire_pitch[0][1] - wire_width;
|
|
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][1] = 0.315;
|
|
miller_value[0][1] = 1.5;
|
|
horiz_dielectric_constant[0][1] = 1.958;
|
|
vert_dielectric_constant[0][1] = 3.9;
|
|
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[0][2] = 3.0;
|
|
wire_width = wire_pitch[0][2] / 2;
|
|
wire_thickness = aspect_ratio[0][2] * wire_width;
|
|
wire_spacing = wire_pitch[0][2] - wire_width;
|
|
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][2] = 0.63;
|
|
miller_value[0][2] = 1.5;
|
|
horiz_dielectric_constant[0][2] = 1.958;
|
|
vert_dielectric_constant[0][2] = 3.9;
|
|
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
|
|
fringe_cap);
|
|
|
|
//Conservative projections
|
|
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
|
|
aspect_ratio[1][0] = 2.0;
|
|
wire_width = wire_pitch[1][0] / 2;
|
|
wire_thickness = aspect_ratio[1][0] * wire_width;
|
|
wire_spacing = wire_pitch[1][0] - wire_width;
|
|
barrier_thickness = 0.004;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][0] = 0.315;
|
|
miller_value[1][0] = 1.5;
|
|
horiz_dielectric_constant[1][0] = 2.46;
|
|
vert_dielectric_constant[1][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
|
|
wire_width = wire_pitch[1][1] / 2;
|
|
aspect_ratio[1][1] = 2.0;
|
|
wire_thickness = aspect_ratio[1][1] * wire_width;
|
|
wire_spacing = wire_pitch[1][1] - wire_width;
|
|
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][1] = 0.315;
|
|
miller_value[1][1] = 1.5;
|
|
horiz_dielectric_constant[1][1] = 2.46;
|
|
vert_dielectric_constant[1][1] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[1][2] = 2.2;
|
|
wire_width = wire_pitch[1][2] / 2;
|
|
wire_thickness = aspect_ratio[1][2] * wire_width;
|
|
wire_spacing = wire_pitch[1][2] - wire_width;
|
|
dishing_thickness = 0.1 * wire_thickness;
|
|
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][2] = 0.55;
|
|
miller_value[1][2] = 1.5;
|
|
horiz_dielectric_constant[1][2] = 2.46;
|
|
vert_dielectric_constant[1][2] = 3.9;
|
|
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
|
|
fringe_cap);
|
|
//Nominal projections for commodity DRAM wordline/bitline
|
|
wire_pitch[1][3] = 2 * 0.045;
|
|
wire_c_per_micron[1][3] = 37.5e-15 / (256 * 2 * 0.045);
|
|
wire_r_per_micron[1][3] = 12 / 0.045;
|
|
}
|
|
else if (tech == 32)
|
|
{
|
|
//Aggressive projections.
|
|
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;
|
|
aspect_ratio[0][0] = 3.0;
|
|
wire_width = wire_pitch[0][0] / 2;
|
|
wire_thickness = aspect_ratio[0][0] * wire_width;
|
|
wire_spacing = wire_pitch[0][0] - wire_width;
|
|
barrier_thickness = 0;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][0] = 0.21;
|
|
miller_value[0][0] = 1.5;
|
|
horiz_dielectric_constant[0][0] = 1.664;
|
|
vert_dielectric_constant[0][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0], vert_dielectric_constant[0][0],
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][1] = 4 * g_ip->F_sz_um;
|
|
wire_width = wire_pitch[0][1] / 2;
|
|
aspect_ratio[0][1] = 3.0;
|
|
wire_thickness = aspect_ratio[0][1] * wire_width;
|
|
wire_spacing = wire_pitch[0][1] - wire_width;
|
|
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][1] = 0.21;
|
|
miller_value[0][1] = 1.5;
|
|
horiz_dielectric_constant[0][1] = 1.664;
|
|
vert_dielectric_constant[0][1] = 3.9;
|
|
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[0][2] = 3.0;
|
|
wire_width = wire_pitch[0][2] / 2;
|
|
wire_thickness = aspect_ratio[0][2] * wire_width;
|
|
wire_spacing = wire_pitch[0][2] - wire_width;
|
|
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][2] = 0.42;
|
|
miller_value[0][2] = 1.5;
|
|
horiz_dielectric_constant[0][2] = 1.664;
|
|
vert_dielectric_constant[0][2] = 3.9;
|
|
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
|
|
fringe_cap);
|
|
|
|
//Conservative projections
|
|
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
|
|
aspect_ratio[1][0] = 2.0;
|
|
wire_width = wire_pitch[1][0] / 2;
|
|
wire_thickness = aspect_ratio[1][0] * wire_width;
|
|
wire_spacing = wire_pitch[1][0] - wire_width;
|
|
barrier_thickness = 0.003;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][0] = 0.21;
|
|
miller_value[1][0] = 1.5;
|
|
horiz_dielectric_constant[1][0] = 2.214;
|
|
vert_dielectric_constant[1][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
|
|
aspect_ratio[1][1] = 2.0;
|
|
wire_width = wire_pitch[1][1] / 2;
|
|
wire_thickness = aspect_ratio[1][1] * wire_width;
|
|
wire_spacing = wire_pitch[1][1] - wire_width;
|
|
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][1] = 0.21;
|
|
miller_value[1][1] = 1.5;
|
|
horiz_dielectric_constant[1][1] = 2.214;
|
|
vert_dielectric_constant[1][1] = 3.9;
|
|
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[1][2] = 2.2;
|
|
wire_width = wire_pitch[1][2] / 2;
|
|
wire_thickness = aspect_ratio[1][2] * wire_width;
|
|
wire_spacing = wire_pitch[1][2] - wire_width;
|
|
dishing_thickness = 0.1 * wire_thickness;
|
|
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][2] = 0.385;
|
|
miller_value[1][2] = 1.5;
|
|
horiz_dielectric_constant[1][2] = 2.214;
|
|
vert_dielectric_constant[1][2] = 3.9;
|
|
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
|
|
fringe_cap);
|
|
//Nominal projections for commodity DRAM wordline/bitline
|
|
wire_pitch[1][3] = 2 * 0.032;//micron
|
|
wire_c_per_micron[1][3] = 31e-15 / (256 * 2 * 0.032);//F/micron
|
|
wire_r_per_micron[1][3] = 12 / 0.032;//ohm/micron
|
|
}
|
|
else if (tech == 22)
|
|
{
|
|
//Aggressive projections.
|
|
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//local
|
|
aspect_ratio[0][0] = 3.0;
|
|
wire_width = wire_pitch[0][0] / 2;
|
|
wire_thickness = aspect_ratio[0][0] * wire_width;
|
|
wire_spacing = wire_pitch[0][0] - wire_width;
|
|
barrier_thickness = 0;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][0] = 0.15;
|
|
miller_value[0][0] = 1.5;
|
|
horiz_dielectric_constant[0][0] = 1.414;
|
|
vert_dielectric_constant[0][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0], vert_dielectric_constant[0][0],
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][1] = 4 * g_ip->F_sz_um;//semi-global
|
|
wire_width = wire_pitch[0][1] / 2;
|
|
aspect_ratio[0][1] = 3.0;
|
|
wire_thickness = aspect_ratio[0][1] * wire_width;
|
|
wire_spacing = wire_pitch[0][1] - wire_width;
|
|
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][1] = 0.15;
|
|
miller_value[0][1] = 1.5;
|
|
horiz_dielectric_constant[0][1] = 1.414;
|
|
vert_dielectric_constant[0][1] = 3.9;
|
|
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][2] = 8 * g_ip->F_sz_um;//global
|
|
aspect_ratio[0][2] = 3.0;
|
|
wire_width = wire_pitch[0][2] / 2;
|
|
wire_thickness = aspect_ratio[0][2] * wire_width;
|
|
wire_spacing = wire_pitch[0][2] - wire_width;
|
|
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][2] = 0.3;
|
|
miller_value[0][2] = 1.5;
|
|
horiz_dielectric_constant[0][2] = 1.414;
|
|
vert_dielectric_constant[0][2] = 3.9;
|
|
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
|
|
fringe_cap);
|
|
|
|
// //*************************
|
|
// wire_pitch[0][4] = 16 * g_ip.F_sz_um;//global
|
|
// aspect_ratio = 3.0;
|
|
// wire_width = wire_pitch[0][4] / 2;
|
|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[0][4] - wire_width;
|
|
// wire_r_per_micron[0][4] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.3;
|
|
// wire_c_per_micron[0][4] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
//
|
|
// wire_pitch[0][5] = 24 * g_ip.F_sz_um;//global
|
|
// aspect_ratio = 3.0;
|
|
// wire_width = wire_pitch[0][5] / 2;
|
|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[0][5] - wire_width;
|
|
// wire_r_per_micron[0][5] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.3;
|
|
// wire_c_per_micron[0][5] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
//
|
|
// wire_pitch[0][6] = 32 * g_ip.F_sz_um;//global
|
|
// aspect_ratio = 3.0;
|
|
// wire_width = wire_pitch[0][6] / 2;
|
|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[0][6] - wire_width;
|
|
// wire_r_per_micron[0][6] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.3;
|
|
// wire_c_per_micron[0][6] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
//*************************
|
|
|
|
//Conservative projections
|
|
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
|
|
aspect_ratio[1][0] = 2.0;
|
|
wire_width = wire_pitch[1][0] / 2;
|
|
wire_thickness = aspect_ratio[1][0] * wire_width;
|
|
wire_spacing = wire_pitch[1][0] - wire_width;
|
|
barrier_thickness = 0.003;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1.05;
|
|
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][0] = 0.15;
|
|
miller_value[1][0] = 1.5;
|
|
horiz_dielectric_constant[1][0] = 2.104;
|
|
vert_dielectric_constant[1][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
|
|
wire_width = wire_pitch[1][1] / 2;
|
|
aspect_ratio[1][1] = 2.0;
|
|
wire_thickness = aspect_ratio[1][1] * wire_width;
|
|
wire_spacing = wire_pitch[1][1] - wire_width;
|
|
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][1] = 0.15;
|
|
miller_value[1][1] = 1.5;
|
|
horiz_dielectric_constant[1][1] = 2.104;
|
|
vert_dielectric_constant[1][1] = 3.9;
|
|
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[1][2] = 2.2;
|
|
wire_width = wire_pitch[1][2] / 2;
|
|
wire_thickness = aspect_ratio[1][2] * wire_width;
|
|
wire_spacing = wire_pitch[1][2] - wire_width;
|
|
dishing_thickness = 0.1 * wire_thickness;
|
|
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][2] = 0.275;
|
|
miller_value[1][2] = 1.5;
|
|
horiz_dielectric_constant[1][2] = 2.104;
|
|
vert_dielectric_constant[1][2] = 3.9;
|
|
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
|
|
fringe_cap);
|
|
//Nominal projections for commodity DRAM wordline/bitline
|
|
wire_pitch[1][3] = 2 * 0.022;//micron
|
|
wire_c_per_micron[1][3] = 31e-15 / (256 * 2 * 0.022);//F/micron
|
|
wire_r_per_micron[1][3] = 12 / 0.022;//ohm/micron
|
|
|
|
//******************
|
|
// wire_pitch[1][4] = 16 * g_ip.F_sz_um;
|
|
// aspect_ratio = 2.2;
|
|
// wire_width = wire_pitch[1][4] / 2;
|
|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[1][4] - wire_width;
|
|
// dishing_thickness = 0.1 * wire_thickness;
|
|
// wire_r_per_micron[1][4] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.275;
|
|
// wire_c_per_micron[1][4] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
//
|
|
// wire_pitch[1][5] = 24 * g_ip.F_sz_um;
|
|
// aspect_ratio = 2.2;
|
|
// wire_width = wire_pitch[1][5] / 2;
|
|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[1][5] - wire_width;
|
|
// dishing_thickness = 0.1 * wire_thickness;
|
|
// wire_r_per_micron[1][5] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.275;
|
|
// wire_c_per_micron[1][5] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
//
|
|
// wire_pitch[1][6] = 32 * g_ip.F_sz_um;
|
|
// aspect_ratio = 2.2;
|
|
// wire_width = wire_pitch[1][6] / 2;
|
|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[1][6] - wire_width;
|
|
// dishing_thickness = 0.1 * wire_thickness;
|
|
// wire_r_per_micron[1][6] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.275;
|
|
// wire_c_per_micron[1][6] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
}
|
|
|
|
else if (tech == 16)
|
|
{
|
|
//Aggressive projections.
|
|
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//local
|
|
aspect_ratio[0][0] = 3.0;
|
|
wire_width = wire_pitch[0][0] / 2;
|
|
wire_thickness = aspect_ratio[0][0] * wire_width;
|
|
wire_spacing = wire_pitch[0][0] - wire_width;
|
|
barrier_thickness = 0;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1;
|
|
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][0] = 0.108;
|
|
miller_value[0][0] = 1.5;
|
|
horiz_dielectric_constant[0][0] = 1.202;
|
|
vert_dielectric_constant[0][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0], vert_dielectric_constant[0][0],
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][1] = 4 * g_ip->F_sz_um;//semi-global
|
|
aspect_ratio[0][1] = 3.0;
|
|
wire_width = wire_pitch[0][1] / 2;
|
|
wire_thickness = aspect_ratio[0][1] * wire_width;
|
|
wire_spacing = wire_pitch[0][1] - wire_width;
|
|
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][1] = 0.108;
|
|
miller_value[0][1] = 1.5;
|
|
horiz_dielectric_constant[0][1] = 1.202;
|
|
vert_dielectric_constant[0][1] = 3.9;
|
|
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[0][2] = 8 * g_ip->F_sz_um;//global
|
|
aspect_ratio[0][2] = 3.0;
|
|
wire_width = wire_pitch[0][2] / 2;
|
|
wire_thickness = aspect_ratio[0][2] * wire_width;
|
|
wire_spacing = wire_pitch[0][2] - wire_width;
|
|
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[0][2] = 0.216;
|
|
miller_value[0][2] = 1.5;
|
|
horiz_dielectric_constant[0][2] = 1.202;
|
|
vert_dielectric_constant[0][2] = 3.9;
|
|
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
|
|
fringe_cap);
|
|
|
|
// //*************************
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// wire_pitch[0][4] = 16 * g_ip.F_sz_um;//global
|
|
// aspect_ratio = 3.0;
|
|
// wire_width = wire_pitch[0][4] / 2;
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|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[0][4] - wire_width;
|
|
// wire_r_per_micron[0][4] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.3;
|
|
// wire_c_per_micron[0][4] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
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|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
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|
//
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|
// wire_pitch[0][5] = 24 * g_ip.F_sz_um;//global
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// aspect_ratio = 3.0;
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// wire_width = wire_pitch[0][5] / 2;
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// wire_thickness = aspect_ratio * wire_width;
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|
// wire_spacing = wire_pitch[0][5] - wire_width;
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|
// wire_r_per_micron[0][5] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
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// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
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// ild_thickness = 0.3;
|
|
// wire_c_per_micron[0][5] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
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|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
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|
//
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|
// wire_pitch[0][6] = 32 * g_ip.F_sz_um;//global
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// aspect_ratio = 3.0;
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|
// wire_width = wire_pitch[0][6] / 2;
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// wire_thickness = aspect_ratio * wire_width;
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|
// wire_spacing = wire_pitch[0][6] - wire_width;
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// wire_r_per_micron[0][6] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.3;
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|
// wire_c_per_micron[0][6] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
//*************************
|
|
|
|
//Conservative projections
|
|
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
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aspect_ratio[1][0] = 2.0;
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|
wire_width = wire_pitch[1][0] / 2;
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|
wire_thickness = aspect_ratio[1][0] * wire_width;
|
|
wire_spacing = wire_pitch[1][0] - wire_width;
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|
barrier_thickness = 0.002;
|
|
dishing_thickness = 0;
|
|
alpha_scatter = 1.05;
|
|
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][0] = 0.108;
|
|
miller_value[1][0] = 1.5;
|
|
horiz_dielectric_constant[1][0] = 1.998;
|
|
vert_dielectric_constant[1][0] = 3.9;
|
|
fringe_cap = 0.115e-15;
|
|
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
|
|
wire_width = wire_pitch[1][1] / 2;
|
|
aspect_ratio[1][1] = 2.0;
|
|
wire_thickness = aspect_ratio[1][1] * wire_width;
|
|
wire_spacing = wire_pitch[1][1] - wire_width;
|
|
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][1] = 0.108;
|
|
miller_value[1][1] = 1.5;
|
|
horiz_dielectric_constant[1][1] = 1.998;
|
|
vert_dielectric_constant[1][1] = 3.9;
|
|
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
|
|
fringe_cap);
|
|
|
|
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
|
|
aspect_ratio[1][2] = 2.2;
|
|
wire_width = wire_pitch[1][2] / 2;
|
|
wire_thickness = aspect_ratio[1][2] * wire_width;
|
|
wire_spacing = wire_pitch[1][2] - wire_width;
|
|
dishing_thickness = 0.1 * wire_thickness;
|
|
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
ild_thickness[1][2] = 0.198;
|
|
miller_value[1][2] = 1.5;
|
|
horiz_dielectric_constant[1][2] = 1.998;
|
|
vert_dielectric_constant[1][2] = 3.9;
|
|
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
|
|
fringe_cap);
|
|
//Nominal projections for commodity DRAM wordline/bitline
|
|
wire_pitch[1][3] = 2 * 0.016;//micron
|
|
wire_c_per_micron[1][3] = 31e-15 / (256 * 2 * 0.016);//F/micron
|
|
wire_r_per_micron[1][3] = 12 / 0.016;//ohm/micron
|
|
|
|
//******************
|
|
// wire_pitch[1][4] = 16 * g_ip.F_sz_um;
|
|
// aspect_ratio = 2.2;
|
|
// wire_width = wire_pitch[1][4] / 2;
|
|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[1][4] - wire_width;
|
|
// dishing_thickness = 0.1 * wire_thickness;
|
|
// wire_r_per_micron[1][4] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.275;
|
|
// wire_c_per_micron[1][4] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
//
|
|
// wire_pitch[1][5] = 24 * g_ip.F_sz_um;
|
|
// aspect_ratio = 2.2;
|
|
// wire_width = wire_pitch[1][5] / 2;
|
|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[1][5] - wire_width;
|
|
// dishing_thickness = 0.1 * wire_thickness;
|
|
// wire_r_per_micron[1][5] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.275;
|
|
// wire_c_per_micron[1][5] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
//
|
|
// wire_pitch[1][6] = 32 * g_ip.F_sz_um;
|
|
// aspect_ratio = 2.2;
|
|
// wire_width = wire_pitch[1][6] / 2;
|
|
// wire_thickness = aspect_ratio * wire_width;
|
|
// wire_spacing = wire_pitch[1][6] - wire_width;
|
|
// dishing_thickness = 0.1 * wire_thickness;
|
|
// wire_r_per_micron[1][6] = wire_resistance(CU_RESISTIVITY, wire_width,
|
|
// wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
|
|
// ild_thickness = 0.275;
|
|
// wire_c_per_micron[1][6] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
|
|
// ild_thickness, miller_value, horiz_dielectric_constant, vert_dielectric_constant,
|
|
// fringe_cap);
|
|
}
|
|
g_tp.wire_local.pitch += curr_alpha * wire_pitch[g_ip->ic_proj_type][(ram_cell_tech_type == comm_dram)?3:0];
|
|
g_tp.wire_local.R_per_um += curr_alpha * wire_r_per_micron[g_ip->ic_proj_type][(ram_cell_tech_type == comm_dram)?3:0];
|
|
g_tp.wire_local.C_per_um += curr_alpha * wire_c_per_micron[g_ip->ic_proj_type][(ram_cell_tech_type == comm_dram)?3:0];
|
|
g_tp.wire_local.aspect_ratio += curr_alpha * aspect_ratio[g_ip->ic_proj_type][(ram_cell_tech_type == comm_dram)?3:0];
|
|
g_tp.wire_local.ild_thickness += curr_alpha * ild_thickness[g_ip->ic_proj_type][(ram_cell_tech_type == comm_dram)?3:0];
|
|
g_tp.wire_local.miller_value += curr_alpha * miller_value[g_ip->ic_proj_type][(ram_cell_tech_type == comm_dram)?3:0];
|
|
g_tp.wire_local.horiz_dielectric_constant += curr_alpha* horiz_dielectric_constant[g_ip->ic_proj_type][(ram_cell_tech_type == comm_dram)?3:0];
|
|
g_tp.wire_local.vert_dielectric_constant += curr_alpha* vert_dielectric_constant [g_ip->ic_proj_type][(ram_cell_tech_type == comm_dram)?3:0];
|
|
|
|
g_tp.wire_inside_mat.pitch += curr_alpha * wire_pitch[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
|
|
g_tp.wire_inside_mat.R_per_um += curr_alpha* wire_r_per_micron[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
|
|
g_tp.wire_inside_mat.C_per_um += curr_alpha* wire_c_per_micron[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
|
|
g_tp.wire_inside_mat.aspect_ratio += curr_alpha * aspect_ratio[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
|
|
g_tp.wire_inside_mat.ild_thickness += curr_alpha * ild_thickness[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
|
|
g_tp.wire_inside_mat.miller_value += curr_alpha * miller_value[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
|
|
g_tp.wire_inside_mat.horiz_dielectric_constant += curr_alpha* horiz_dielectric_constant[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
|
|
g_tp.wire_inside_mat.vert_dielectric_constant += curr_alpha* vert_dielectric_constant [g_ip->ic_proj_type][g_ip->wire_is_mat_type];
|
|
|
|
g_tp.wire_outside_mat.pitch += curr_alpha * wire_pitch[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
|
|
g_tp.wire_outside_mat.R_per_um += curr_alpha*wire_r_per_micron[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
|
|
g_tp.wire_outside_mat.C_per_um += curr_alpha*wire_c_per_micron[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
|
|
g_tp.wire_outside_mat.aspect_ratio += curr_alpha * aspect_ratio[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
|
|
g_tp.wire_outside_mat.ild_thickness += curr_alpha * ild_thickness[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
|
|
g_tp.wire_outside_mat.miller_value += curr_alpha * miller_value[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
|
|
g_tp.wire_outside_mat.horiz_dielectric_constant += curr_alpha* horiz_dielectric_constant[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
|
|
g_tp.wire_outside_mat.vert_dielectric_constant += curr_alpha* vert_dielectric_constant [g_ip->ic_proj_type][g_ip->wire_os_mat_type];
|
|
|
|
g_tp.unit_len_wire_del = g_tp.wire_inside_mat.R_per_um * g_tp.wire_inside_mat.C_per_um / 2;
|
|
|
|
g_tp.sense_delay += curr_alpha *SENSE_AMP_D;
|
|
g_tp.sense_dy_power += curr_alpha *SENSE_AMP_P;
|
|
// g_tp.horiz_dielectric_constant += horiz_dielectric_constant;
|
|
// g_tp.vert_dielectric_constant += vert_dielectric_constant;
|
|
// g_tp.aspect_ratio += aspect_ratio;
|
|
// g_tp.miller_value += miller_value;
|
|
// g_tp.ild_thickness += ild_thickness;
|
|
|
|
}
|
|
g_tp.fringe_cap = fringe_cap;
|
|
|
|
double rd = tr_R_on(g_tp.min_w_nmos_, NCH, 1);
|
|
double p_to_n_sizing_r = pmos_to_nmos_sz_ratio();
|
|
double c_load = gate_C(g_tp.min_w_nmos_ * (1 + p_to_n_sizing_r), 0.0);
|
|
double tf = rd * c_load;
|
|
g_tp.kinv = horowitz(0, tf, 0.5, 0.5, RISE);
|
|
double KLOAD = 1;
|
|
c_load = KLOAD * (drain_C_(g_tp.min_w_nmos_, NCH, 1, 1, g_tp.cell_h_def) +
|
|
drain_C_(g_tp.min_w_nmos_ * p_to_n_sizing_r, PCH, 1, 1, g_tp.cell_h_def) +
|
|
gate_C(g_tp.min_w_nmos_ * 4 * (1 + p_to_n_sizing_r), 0.0));
|
|
tf = rd * c_load;
|
|
g_tp.FO4 = horowitz(0, tf, 0.5, 0.5, RISE);
|
|
}
|
|
|