gem5/ext/mcpat/cacti/technology.cc
Yasuko Eckert 0deef376d9 ext: McPAT interface changes and fixes
This patch includes software engineering changes and some generic bug fixes
Joel Hestness and Yasuko Eckert made to McPAT 0.8. There are still known
issues/concernts we did not have a chance to address in this patch.

High-level changes in this patch include:
 1) Making XML parsing modular and hierarchical:
   - Shift parsing responsibility into the components
   - Read XML in a (mostly) context-free recursive manner so that McPAT input
     files can contain arbitrary component hierarchies
 2) Making power, energy, and area calculations a hierarchical and recursive
    process
   - Components track their subcomponents and recursively call compute
     functions in stages
   - Make C++ object hierarchy reflect inheritance of classes of components
     with similar structures
   - Simplify computeArea() and computeEnergy() functions to eliminate
     successive calls to calculate separate TDP vs. runtime energy
   - Remove Processor component (now unnecessary) and introduce a more abstract
     System component
 3) Standardizing McPAT output across all components
   - Use a single, common data structure for storing and printing McPAT output
   - Recursively call print functions through component hierarchy
 4) For caches, allow splitting data array and tag array reads and writes for
    better accuracy
 5) Improving the usability of CACTI by printing more helpful warning and error
    messages
 6) Minor: Impose more rigorous code style for clarity (more work still to be
    done)
Overall, these changes greatly reduce the amount of replicated code, and they
improve McPAT runtime and decrease memory footprint.
2014-06-03 13:32:59 -07:00

2663 lines
133 KiB
C++

/*****************************************************************************
* McPAT/CACTI
* SOFTWARE LICENSE AGREEMENT
* Copyright 2012 Hewlett-Packard Development Company, L.P.
* Copyright (c) 2010-2013 Advanced Micro Devices, Inc.
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* notice, this list of conditions and the following disclaimer in the
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* neither the name of the copyright holders nor the names of its
* contributors may be used to endorse or promote products derived from
* this software without specific prior written permission.
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* LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE,
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***************************************************************************/
#include "basic_circuit.h"
#include "parameter.h"
double wire_resistance(double resistivity, double wire_width,
double wire_thickness,
double barrier_thickness, double dishing_thickness,
double alpha_scatter) {
double resistance;
resistance = alpha_scatter * resistivity /
((wire_thickness - barrier_thickness - dishing_thickness) *
(wire_width - 2 * barrier_thickness));
return(resistance);
}
double wire_capacitance(double wire_width, double wire_thickness,
double wire_spacing,
double ild_thickness, double miller_value,
double horiz_dielectric_constant,
double vert_dielectric_constant, double fringe_cap) {
double vertical_cap, sidewall_cap, total_cap;
vertical_cap = 2 * PERMITTIVITY_FREE_SPACE * vert_dielectric_constant * wire_width / ild_thickness;
sidewall_cap = 2 * PERMITTIVITY_FREE_SPACE * miller_value * horiz_dielectric_constant * wire_thickness / wire_spacing;
total_cap = vertical_cap + sidewall_cap + fringe_cap;
return(total_cap);
}
void init_tech_params(double technology, bool is_tag) {
int iter, tech, tech_lo, tech_hi;
double curr_alpha, curr_vpp;
double wire_width, wire_thickness, wire_spacing,
fringe_cap, pmos_to_nmos_sizing_r;
// double aspect_ratio,ild_thickness, miller_value = 1.5, horiz_dielectric_constant, vert_dielectric_constant;
double barrier_thickness, dishing_thickness, alpha_scatter;
double curr_vdd_dram_cell, curr_v_th_dram_access_transistor, curr_I_on_dram_cell, curr_c_dram_cell;
uint32_t ram_cell_tech_type = (is_tag) ? g_ip->tag_arr_ram_cell_tech_type : g_ip->data_arr_ram_cell_tech_type;
uint32_t peri_global_tech_type = (is_tag) ? g_ip->tag_arr_peri_global_tech_type : g_ip->data_arr_peri_global_tech_type;
technology = technology * 1000.0; // in the unit of nm
// initialize parameters
g_tp.reset();
double gmp_to_gmn_multiplier_periph_global = 0;
double curr_Wmemcella_dram, curr_Wmemcellpmos_dram, curr_Wmemcellnmos_dram,
curr_area_cell_dram, curr_asp_ratio_cell_dram, curr_Wmemcella_sram,
curr_Wmemcellpmos_sram, curr_Wmemcellnmos_sram, curr_area_cell_sram,
curr_asp_ratio_cell_sram, curr_I_off_dram_cell_worst_case_length_temp;
double curr_Wmemcella_cam, curr_Wmemcellpmos_cam, curr_Wmemcellnmos_cam, curr_area_cell_cam,//Sheng: CAM data
curr_asp_ratio_cell_cam;
double SENSE_AMP_D, SENSE_AMP_P; // J
double area_cell_dram = 0;
double asp_ratio_cell_dram = 0;
double area_cell_sram = 0;
double asp_ratio_cell_sram = 0;
double area_cell_cam = 0;
double asp_ratio_cell_cam = 0;
double mobility_eff_periph_global = 0;
double Vdsat_periph_global = 0;
double nmos_effective_resistance_multiplier;
double width_dram_access_transistor;
double curr_logic_scaling_co_eff = 0;//This is based on the reported numbers of Intel Merom 65nm, Penryn45nm and IBM cell 90/65/45 date
double curr_core_tx_density = 0;//this is density per um^2; 90, ...22nm based on Intel Penryn
double curr_chip_layout_overhead = 0;
double curr_macro_layout_overhead = 0;
double curr_sckt_co_eff = 0;
if (technology < 181 && technology > 179) {
tech_lo = 180;
tech_hi = 180;
} else if (technology < 91 && technology > 89) {
tech_lo = 90;
tech_hi = 90;
} else if (technology < 66 && technology > 64) {
tech_lo = 65;
tech_hi = 65;
} else if (technology < 46 && technology > 44) {
tech_lo = 45;
tech_hi = 45;
} else if (technology < 33 && technology > 31) {
tech_lo = 32;
tech_hi = 32;
} else if (technology < 23 && technology > 21) {
tech_lo = 22;
tech_hi = 22;
if (ram_cell_tech_type == 3 ) {
cout << "current version does not support eDRAM technologies at "
<< "22nm" << endl;
exit(0);
}
} else if (technology < 180 && technology > 90) {
tech_lo = 180;
tech_hi = 90;
} else if (technology < 90 && technology > 65) {
tech_lo = 90;
tech_hi = 65;
} else if (technology < 65 && technology > 45) {
tech_lo = 65;
tech_hi = 45;
} else if (technology < 45 && technology > 32) {
tech_lo = 45;
tech_hi = 32;
} else if (technology < 32 && technology > 22) {
tech_lo = 32;
tech_hi = 22;
}
// else if (technology < 22 && technology > 16)
// {
// tech_lo = 22;
// tech_hi = 16;
// }
else {
cout << "Invalid technology nodes" << endl;
exit(0);
}
double vdd[NUMBER_TECH_FLAVORS];
double Lphy[NUMBER_TECH_FLAVORS];
double Lelec[NUMBER_TECH_FLAVORS];
double t_ox[NUMBER_TECH_FLAVORS];
double v_th[NUMBER_TECH_FLAVORS];
double c_ox[NUMBER_TECH_FLAVORS];
double mobility_eff[NUMBER_TECH_FLAVORS];
double Vdsat[NUMBER_TECH_FLAVORS];
double c_g_ideal[NUMBER_TECH_FLAVORS];
double c_fringe[NUMBER_TECH_FLAVORS];
double c_junc[NUMBER_TECH_FLAVORS];
double I_on_n[NUMBER_TECH_FLAVORS];
double I_on_p[NUMBER_TECH_FLAVORS];
double Rnchannelon[NUMBER_TECH_FLAVORS];
double Rpchannelon[NUMBER_TECH_FLAVORS];
double n_to_p_eff_curr_drv_ratio[NUMBER_TECH_FLAVORS];
double I_off_n[NUMBER_TECH_FLAVORS][101];
double I_g_on_n[NUMBER_TECH_FLAVORS][101];
double gmp_to_gmn_multiplier[NUMBER_TECH_FLAVORS];
double long_channel_leakage_reduction[NUMBER_TECH_FLAVORS];
for (iter = 0; iter <= 1; ++iter) {
// linear interpolation
if (iter == 0) {
tech = tech_lo;
if (tech_lo == tech_hi) {
curr_alpha = 1;
} else {
curr_alpha = (technology - tech_hi) / (tech_lo - tech_hi);
}
} else {
tech = tech_hi;
if (tech_lo == tech_hi) {
break;
} else {
curr_alpha = (tech_lo - technology) / (tech_lo - tech_hi);
}
}
if (tech == 180) {
//180nm technology-node. Corresponds to year 1999 in ITRS
//Only HP transistor was of interest that 180nm since leakage power was not a big issue. Performance was the king
//MASTAR does not contain data for 0.18um process. The following parameters are projected based on ITRS 2000 update and IBM 0.18 Cu Spice input
bool Aggre_proj = false;
SENSE_AMP_D = .28e-9; // s
SENSE_AMP_P = 14.7e-15; // J
vdd[0] = 1.5;
Lphy[0] = 0.12;//Lphy is the physical gate-length. micron
Lelec[0] = 0.10;//Lelec is the electrical gate-length. micron
t_ox[0] = 1.2e-3 * (Aggre_proj ? 1.9 / 1.2 : 2);//micron
v_th[0] = Aggre_proj ? 0.36 : 0.4407;//V
c_ox[0] = 1.79e-14 * (Aggre_proj ? 1.9 / 1.2 : 2);//F/micron2
mobility_eff[0] = 302.16 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
Vdsat[0] = 0.128 * 2; //V
c_g_ideal[0] = (Aggre_proj ? 1.9 / 1.2 : 2) * 6.64e-16;//F/micron
c_fringe[0] = (Aggre_proj ? 1.9 / 1.2 : 2) * 0.08e-15;//F/micron
c_junc[0] = (Aggre_proj ? 1.9 / 1.2 : 2) * 1e-15;//F/micron2
I_on_n[0] = 750e-6;//A/micron
I_on_p[0] = 350e-6;//A/micron
//Note that nmos_effective_resistance_multiplier, n_to_p_eff_curr_drv_ratio and gmp_to_gmn_multiplier values are calculated offline
nmos_effective_resistance_multiplier = 1.54;
n_to_p_eff_curr_drv_ratio[0] = 2.45;
gmp_to_gmn_multiplier[0] = 1.22;
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
long_channel_leakage_reduction[0] = 1;
I_off_n[0][0] = 7e-10;//A/micron
I_off_n[0][10] = 8.26e-10;
I_off_n[0][20] = 9.74e-10;
I_off_n[0][30] = 1.15e-9;
I_off_n[0][40] = 1.35e-9;
I_off_n[0][50] = 1.60e-9;
I_off_n[0][60] = 1.88e-9;
I_off_n[0][70] = 2.29e-9;
I_off_n[0][80] = 2.70e-9;
I_off_n[0][90] = 3.19e-9;
I_off_n[0][100] = 3.76e-9;
I_g_on_n[0][0] = 1.65e-10;//A/micron
I_g_on_n[0][10] = 1.65e-10;
I_g_on_n[0][20] = 1.65e-10;
I_g_on_n[0][30] = 1.65e-10;
I_g_on_n[0][40] = 1.65e-10;
I_g_on_n[0][50] = 1.65e-10;
I_g_on_n[0][60] = 1.65e-10;
I_g_on_n[0][70] = 1.65e-10;
I_g_on_n[0][80] = 1.65e-10;
I_g_on_n[0][90] = 1.65e-10;
I_g_on_n[0][100] = 1.65e-10;
//SRAM cell properties
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_sram = 1.46;
//CAM cell properties //TODO: data need to be revisited
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;//360
curr_asp_ratio_cell_cam = 2.92;//2.5
//Empirical undifferetiated core/FU coefficient
curr_logic_scaling_co_eff = 1.5;//linear scaling from 90nm
curr_core_tx_density = 1.25 * 0.7 * 0.7 * 0.4;
curr_sckt_co_eff = 1.11;
curr_chip_layout_overhead = 1.0;//die measurement results based on Niagara 1 and 2
curr_macro_layout_overhead = 1.0;//EDA placement and routing tool rule of thumb
}
if (tech == 90) {
SENSE_AMP_D = .28e-9; // s
SENSE_AMP_P = 14.7e-15; // J
//90nm technology-node. Corresponds to year 2004 in ITRS
//ITRS HP device type
vdd[0] = 1.2;
Lphy[0] = 0.037;//Lphy is the physical gate-length. micron
Lelec[0] = 0.0266;//Lelec is the electrical gate-length. micron
t_ox[0] = 1.2e-3;//micron
v_th[0] = 0.23707;//V
c_ox[0] = 1.79e-14;//F/micron2
mobility_eff[0] = 342.16 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
Vdsat[0] = 0.128; //V
c_g_ideal[0] = 6.64e-16;//F/micron
c_fringe[0] = 0.08e-15;//F/micron
c_junc[0] = 1e-15;//F/micron2
I_on_n[0] = 1076.9e-6;//A/micron
I_on_p[0] = 712.6e-6;//A/micron
//Note that nmos_effective_resistance_multiplier, n_to_p_eff_curr_drv_ratio and gmp_to_gmn_multiplier values are calculated offline
nmos_effective_resistance_multiplier = 1.54;
n_to_p_eff_curr_drv_ratio[0] = 2.45;
gmp_to_gmn_multiplier[0] = 1.22;
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
long_channel_leakage_reduction[0] = 1;
I_off_n[0][0] = 3.24e-8;//A/micron
I_off_n[0][10] = 4.01e-8;
I_off_n[0][20] = 4.90e-8;
I_off_n[0][30] = 5.92e-8;
I_off_n[0][40] = 7.08e-8;
I_off_n[0][50] = 8.38e-8;
I_off_n[0][60] = 9.82e-8;
I_off_n[0][70] = 1.14e-7;
I_off_n[0][80] = 1.29e-7;
I_off_n[0][90] = 1.43e-7;
I_off_n[0][100] = 1.54e-7;
I_g_on_n[0][0] = 1.65e-8;//A/micron
I_g_on_n[0][10] = 1.65e-8;
I_g_on_n[0][20] = 1.65e-8;
I_g_on_n[0][30] = 1.65e-8;
I_g_on_n[0][40] = 1.65e-8;
I_g_on_n[0][50] = 1.65e-8;
I_g_on_n[0][60] = 1.65e-8;
I_g_on_n[0][70] = 1.65e-8;
I_g_on_n[0][80] = 1.65e-8;
I_g_on_n[0][90] = 1.65e-8;
I_g_on_n[0][100] = 1.65e-8;
//ITRS LSTP device type
vdd[1] = 1.3;
Lphy[1] = 0.075;
Lelec[1] = 0.0486;
t_ox[1] = 2.2e-3;
v_th[1] = 0.48203;
c_ox[1] = 1.22e-14;
mobility_eff[1] = 356.76 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[1] = 0.373;
c_g_ideal[1] = 9.15e-16;
c_fringe[1] = 0.08e-15;
c_junc[1] = 1e-15;
I_on_n[1] = 503.6e-6;
I_on_p[1] = 235.1e-6;
nmos_effective_resistance_multiplier = 1.92;
n_to_p_eff_curr_drv_ratio[1] = 2.44;
gmp_to_gmn_multiplier[1] = 0.88;
Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
long_channel_leakage_reduction[1] = 1;
I_off_n[1][0] = 2.81e-12;
I_off_n[1][10] = 4.76e-12;
I_off_n[1][20] = 7.82e-12;
I_off_n[1][30] = 1.25e-11;
I_off_n[1][40] = 1.94e-11;
I_off_n[1][50] = 2.94e-11;
I_off_n[1][60] = 4.36e-11;
I_off_n[1][70] = 6.32e-11;
I_off_n[1][80] = 8.95e-11;
I_off_n[1][90] = 1.25e-10;
I_off_n[1][100] = 1.7e-10;
I_g_on_n[1][0] = 3.87e-11;//A/micron
I_g_on_n[1][10] = 3.87e-11;
I_g_on_n[1][20] = 3.87e-11;
I_g_on_n[1][30] = 3.87e-11;
I_g_on_n[1][40] = 3.87e-11;
I_g_on_n[1][50] = 3.87e-11;
I_g_on_n[1][60] = 3.87e-11;
I_g_on_n[1][70] = 3.87e-11;
I_g_on_n[1][80] = 3.87e-11;
I_g_on_n[1][90] = 3.87e-11;
I_g_on_n[1][100] = 3.87e-11;
//ITRS LOP device type
vdd[2] = 0.9;
Lphy[2] = 0.053;
Lelec[2] = 0.0354;
t_ox[2] = 1.5e-3;
v_th[2] = 0.30764;
c_ox[2] = 1.59e-14;
mobility_eff[2] = 460.39 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[2] = 0.113;
c_g_ideal[2] = 8.45e-16;
c_fringe[2] = 0.08e-15;
c_junc[2] = 1e-15;
I_on_n[2] = 386.6e-6;
I_on_p[2] = 209.7e-6;
nmos_effective_resistance_multiplier = 1.77;
n_to_p_eff_curr_drv_ratio[2] = 2.54;
gmp_to_gmn_multiplier[2] = 0.98;
Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
long_channel_leakage_reduction[2] = 1;
I_off_n[2][0] = 2.14e-9;
I_off_n[2][10] = 2.9e-9;
I_off_n[2][20] = 3.87e-9;
I_off_n[2][30] = 5.07e-9;
I_off_n[2][40] = 6.54e-9;
I_off_n[2][50] = 8.27e-8;
I_off_n[2][60] = 1.02e-7;
I_off_n[2][70] = 1.20e-7;
I_off_n[2][80] = 1.36e-8;
I_off_n[2][90] = 1.52e-8;
I_off_n[2][100] = 1.73e-8;
I_g_on_n[2][0] = 4.31e-8;//A/micron
I_g_on_n[2][10] = 4.31e-8;
I_g_on_n[2][20] = 4.31e-8;
I_g_on_n[2][30] = 4.31e-8;
I_g_on_n[2][40] = 4.31e-8;
I_g_on_n[2][50] = 4.31e-8;
I_g_on_n[2][60] = 4.31e-8;
I_g_on_n[2][70] = 4.31e-8;
I_g_on_n[2][80] = 4.31e-8;
I_g_on_n[2][90] = 4.31e-8;
I_g_on_n[2][100] = 4.31e-8;
if (ram_cell_tech_type == lp_dram) {
//LP-DRAM cell access transistor technology parameters
curr_vdd_dram_cell = 1.2;
Lphy[3] = 0.12;
Lelec[3] = 0.0756;
curr_v_th_dram_access_transistor = 0.4545;
width_dram_access_transistor = 0.14;
curr_I_on_dram_cell = 45e-6;
curr_I_off_dram_cell_worst_case_length_temp = 21.1e-12;
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = 0.168;
curr_asp_ratio_cell_dram = 1.46;
curr_c_dram_cell = 20e-15;
//LP-DRAM wordline transistor parameters
curr_vpp = 1.6;
t_ox[3] = 2.2e-3;
v_th[3] = 0.4545;
c_ox[3] = 1.22e-14;
mobility_eff[3] = 323.95 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[3] = 0.3;
c_g_ideal[3] = 1.47e-15;
c_fringe[3] = 0.08e-15;
c_junc[3] = 1e-15;
I_on_n[3] = 321.6e-6;
I_on_p[3] = 203.3e-6;
nmos_effective_resistance_multiplier = 1.65;
n_to_p_eff_curr_drv_ratio[3] = 1.95;
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 1.42e-11;
I_off_n[3][10] = 2.25e-11;
I_off_n[3][20] = 3.46e-11;
I_off_n[3][30] = 5.18e-11;
I_off_n[3][40] = 7.58e-11;
I_off_n[3][50] = 1.08e-10;
I_off_n[3][60] = 1.51e-10;
I_off_n[3][70] = 2.02e-10;
I_off_n[3][80] = 2.57e-10;
I_off_n[3][90] = 3.14e-10;
I_off_n[3][100] = 3.85e-10;
} else if (ram_cell_tech_type == comm_dram) {
//COMM-DRAM cell access transistor technology parameters
curr_vdd_dram_cell = 1.6;
Lphy[3] = 0.09;
Lelec[3] = 0.0576;
curr_v_th_dram_access_transistor = 1;
width_dram_access_transistor = 0.09;
curr_I_on_dram_cell = 20e-6;
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = 6 * 0.09 * 0.09;
curr_asp_ratio_cell_dram = 1.5;
curr_c_dram_cell = 30e-15;
//COMM-DRAM wordline transistor parameters
curr_vpp = 3.7;
t_ox[3] = 5.5e-3;
v_th[3] = 1.0;
c_ox[3] = 5.65e-15;
mobility_eff[3] = 302.2 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[3] = 0.32;
c_g_ideal[3] = 5.08e-16;
c_fringe[3] = 0.08e-15;
c_junc[3] = 1e-15;
I_on_n[3] = 1094.3e-6;
I_on_p[3] = I_on_n[3] / 2;
nmos_effective_resistance_multiplier = 1.62;
n_to_p_eff_curr_drv_ratio[3] = 2.05;
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 5.80e-15;
I_off_n[3][10] = 1.21e-14;
I_off_n[3][20] = 2.42e-14;
I_off_n[3][30] = 4.65e-14;
I_off_n[3][40] = 8.60e-14;
I_off_n[3][50] = 1.54e-13;
I_off_n[3][60] = 2.66e-13;
I_off_n[3][70] = 4.45e-13;
I_off_n[3][80] = 7.17e-13;
I_off_n[3][90] = 1.11e-12;
I_off_n[3][100] = 1.67e-12;
}
//SRAM cell properties
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_sram = 1.46;
//CAM cell properties //TODO: data need to be revisited
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;//360
curr_asp_ratio_cell_cam = 2.92;//2.5
//Empirical undifferetiated core/FU coefficient
curr_logic_scaling_co_eff = 1;
curr_core_tx_density = 1.25 * 0.7 * 0.7;
curr_sckt_co_eff = 1.1539;
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
}
if (tech == 65) {
//65nm technology-node. Corresponds to year 2007 in ITRS
//ITRS HP device type
SENSE_AMP_D = .2e-9; // s
SENSE_AMP_P = 5.7e-15; // J
vdd[0] = 1.1;
Lphy[0] = 0.025;
Lelec[0] = 0.019;
t_ox[0] = 1.1e-3;
v_th[0] = .19491;
c_ox[0] = 1.88e-14;
mobility_eff[0] = 436.24 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[0] = 7.71e-2;
c_g_ideal[0] = 4.69e-16;
c_fringe[0] = 0.077e-15;
c_junc[0] = 1e-15;
I_on_n[0] = 1197.2e-6;
I_on_p[0] = 870.8e-6;
nmos_effective_resistance_multiplier = 1.50;
n_to_p_eff_curr_drv_ratio[0] = 2.41;
gmp_to_gmn_multiplier[0] = 1.38;
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];
long_channel_leakage_reduction[0] = 1 / 3.74;
//Using MASTAR, @380K, increase Lgate until Ion reduces to 90% or Lgate increase by 10%, whichever comes first
//Ioff(Lgate normal)/Ioff(Lgate long)= 3.74.
I_off_n[0][0] = 1.96e-7;
I_off_n[0][10] = 2.29e-7;
I_off_n[0][20] = 2.66e-7;
I_off_n[0][30] = 3.05e-7;
I_off_n[0][40] = 3.49e-7;
I_off_n[0][50] = 3.95e-7;
I_off_n[0][60] = 4.45e-7;
I_off_n[0][70] = 4.97e-7;
I_off_n[0][80] = 5.48e-7;
I_off_n[0][90] = 5.94e-7;
I_off_n[0][100] = 6.3e-7;
I_g_on_n[0][0] = 4.09e-8;//A/micron
I_g_on_n[0][10] = 4.09e-8;
I_g_on_n[0][20] = 4.09e-8;
I_g_on_n[0][30] = 4.09e-8;
I_g_on_n[0][40] = 4.09e-8;
I_g_on_n[0][50] = 4.09e-8;
I_g_on_n[0][60] = 4.09e-8;
I_g_on_n[0][70] = 4.09e-8;
I_g_on_n[0][80] = 4.09e-8;
I_g_on_n[0][90] = 4.09e-8;
I_g_on_n[0][100] = 4.09e-8;
//ITRS LSTP device type
vdd[1] = 1.2;
Lphy[1] = 0.045;
Lelec[1] = 0.0298;
t_ox[1] = 1.9e-3;
v_th[1] = 0.52354;
c_ox[1] = 1.36e-14;
mobility_eff[1] = 341.21 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[1] = 0.128;
c_g_ideal[1] = 6.14e-16;
c_fringe[1] = 0.08e-15;
c_junc[1] = 1e-15;
I_on_n[1] = 519.2e-6;
I_on_p[1] = 266e-6;
nmos_effective_resistance_multiplier = 1.96;
n_to_p_eff_curr_drv_ratio[1] = 2.23;
gmp_to_gmn_multiplier[1] = 0.99;
Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
long_channel_leakage_reduction[1] = 1 / 2.82;
I_off_n[1][0] = 9.12e-12;
I_off_n[1][10] = 1.49e-11;
I_off_n[1][20] = 2.36e-11;
I_off_n[1][30] = 3.64e-11;
I_off_n[1][40] = 5.48e-11;
I_off_n[1][50] = 8.05e-11;
I_off_n[1][60] = 1.15e-10;
I_off_n[1][70] = 1.59e-10;
I_off_n[1][80] = 2.1e-10;
I_off_n[1][90] = 2.62e-10;
I_off_n[1][100] = 3.21e-10;
I_g_on_n[1][0] = 1.09e-10;//A/micron
I_g_on_n[1][10] = 1.09e-10;
I_g_on_n[1][20] = 1.09e-10;
I_g_on_n[1][30] = 1.09e-10;
I_g_on_n[1][40] = 1.09e-10;
I_g_on_n[1][50] = 1.09e-10;
I_g_on_n[1][60] = 1.09e-10;
I_g_on_n[1][70] = 1.09e-10;
I_g_on_n[1][80] = 1.09e-10;
I_g_on_n[1][90] = 1.09e-10;
I_g_on_n[1][100] = 1.09e-10;
//ITRS LOP device type
vdd[2] = 0.8;
Lphy[2] = 0.032;
Lelec[2] = 0.0216;
t_ox[2] = 1.2e-3;
v_th[2] = 0.28512;
c_ox[2] = 1.87e-14;
mobility_eff[2] = 495.19 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[2] = 0.292;
c_g_ideal[2] = 6e-16;
c_fringe[2] = 0.08e-15;
c_junc[2] = 1e-15;
I_on_n[2] = 573.1e-6;
I_on_p[2] = 340.6e-6;
nmos_effective_resistance_multiplier = 1.82;
n_to_p_eff_curr_drv_ratio[2] = 2.28;
gmp_to_gmn_multiplier[2] = 1.11;
Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
long_channel_leakage_reduction[2] = 1 / 2.05;
I_off_n[2][0] = 4.9e-9;
I_off_n[2][10] = 6.49e-9;
I_off_n[2][20] = 8.45e-9;
I_off_n[2][30] = 1.08e-8;
I_off_n[2][40] = 1.37e-8;
I_off_n[2][50] = 1.71e-8;
I_off_n[2][60] = 2.09e-8;
I_off_n[2][70] = 2.48e-8;
I_off_n[2][80] = 2.84e-8;
I_off_n[2][90] = 3.13e-8;
I_off_n[2][100] = 3.42e-8;
I_g_on_n[2][0] = 9.61e-9;//A/micron
I_g_on_n[2][10] = 9.61e-9;
I_g_on_n[2][20] = 9.61e-9;
I_g_on_n[2][30] = 9.61e-9;
I_g_on_n[2][40] = 9.61e-9;
I_g_on_n[2][50] = 9.61e-9;
I_g_on_n[2][60] = 9.61e-9;
I_g_on_n[2][70] = 9.61e-9;
I_g_on_n[2][80] = 9.61e-9;
I_g_on_n[2][90] = 9.61e-9;
I_g_on_n[2][100] = 9.61e-9;
if (ram_cell_tech_type == lp_dram) {
//LP-DRAM cell access transistor technology parameters
curr_vdd_dram_cell = 1.2;
Lphy[3] = 0.12;
Lelec[3] = 0.0756;
curr_v_th_dram_access_transistor = 0.43806;
width_dram_access_transistor = 0.09;
curr_I_on_dram_cell = 36e-6;
curr_I_off_dram_cell_worst_case_length_temp = 19.6e-12;
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = 0.11;
curr_asp_ratio_cell_dram = 1.46;
curr_c_dram_cell = 20e-15;
//LP-DRAM wordline transistor parameters
curr_vpp = 1.6;
t_ox[3] = 2.2e-3;
v_th[3] = 0.43806;
c_ox[3] = 1.22e-14;
mobility_eff[3] = 328.32 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[3] = 0.43806;
c_g_ideal[3] = 1.46e-15;
c_fringe[3] = 0.08e-15;
c_junc[3] = 1e-15 ;
I_on_n[3] = 399.8e-6;
I_on_p[3] = 243.4e-6;
nmos_effective_resistance_multiplier = 1.65;
n_to_p_eff_curr_drv_ratio[3] = 2.05;
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 2.23e-11;
I_off_n[3][10] = 3.46e-11;
I_off_n[3][20] = 5.24e-11;
I_off_n[3][30] = 7.75e-11;
I_off_n[3][40] = 1.12e-10;
I_off_n[3][50] = 1.58e-10;
I_off_n[3][60] = 2.18e-10;
I_off_n[3][70] = 2.88e-10;
I_off_n[3][80] = 3.63e-10;
I_off_n[3][90] = 4.41e-10;
I_off_n[3][100] = 5.36e-10;
} else if (ram_cell_tech_type == comm_dram) {
//COMM-DRAM cell access transistor technology parameters
curr_vdd_dram_cell = 1.3;
Lphy[3] = 0.065;
Lelec[3] = 0.0426;
curr_v_th_dram_access_transistor = 1;
width_dram_access_transistor = 0.065;
curr_I_on_dram_cell = 20e-6;
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = 6 * 0.065 * 0.065;
curr_asp_ratio_cell_dram = 1.5;
curr_c_dram_cell = 30e-15;
//COMM-DRAM wordline transistor parameters
curr_vpp = 3.3;
t_ox[3] = 5e-3;
v_th[3] = 1.0;
c_ox[3] = 6.16e-15;
mobility_eff[3] = 303.44 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[3] = 0.385;
c_g_ideal[3] = 4e-16;
c_fringe[3] = 0.08e-15;
c_junc[3] = 1e-15 ;
I_on_n[3] = 1031e-6;
I_on_p[3] = I_on_n[3] / 2;
nmos_effective_resistance_multiplier = 1.69;
n_to_p_eff_curr_drv_ratio[3] = 2.39;
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 1.80e-14;
I_off_n[3][10] = 3.64e-14;
I_off_n[3][20] = 7.03e-14;
I_off_n[3][30] = 1.31e-13;
I_off_n[3][40] = 2.35e-13;
I_off_n[3][50] = 4.09e-13;
I_off_n[3][60] = 6.89e-13;
I_off_n[3][70] = 1.13e-12;
I_off_n[3][80] = 1.78e-12;
I_off_n[3][90] = 2.71e-12;
I_off_n[3][100] = 3.99e-12;
}
//SRAM cell properties
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_sram = 1.46;
//CAM cell properties //TODO: data need to be revisited
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_cam = 2.92;
//Empirical undifferetiated core/FU coefficient
curr_logic_scaling_co_eff = 0.7; //Rather than scale proportionally to square of feature size, only scale linearly according to IBM cell processor
curr_core_tx_density = 1.25 * 0.7;
curr_sckt_co_eff = 1.1359;
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
}
if (tech == 45) {
//45nm technology-node. Corresponds to year 2010 in ITRS
//ITRS HP device type
SENSE_AMP_D = .04e-9; // s
SENSE_AMP_P = 2.7e-15; // J
vdd[0] = 1.0;
Lphy[0] = 0.018;
Lelec[0] = 0.01345;
t_ox[0] = 0.65e-3;
v_th[0] = .18035;
c_ox[0] = 3.77e-14;
mobility_eff[0] = 266.68 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[0] = 9.38E-2;
c_g_ideal[0] = 6.78e-16;
c_fringe[0] = 0.05e-15;
c_junc[0] = 1e-15;
I_on_n[0] = 2046.6e-6;
//There are certain problems with the ITRS PMOS numbers in MASTAR for 45nm. So we are using 65nm values of
//n_to_p_eff_curr_drv_ratio and gmp_to_gmn_multiplier for 45nm
I_on_p[0] = I_on_n[0] / 2;//This value is fixed arbitrarily but I_on_p is not being used in CACTI
nmos_effective_resistance_multiplier = 1.51;
n_to_p_eff_curr_drv_ratio[0] = 2.41;
gmp_to_gmn_multiplier[0] = 1.38;
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];
//Using MASTAR, @380K, increase Lgate until Ion reduces to 90%,
//Ioff(Lgate normal)/Ioff(Lgate long)= 3.74
long_channel_leakage_reduction[0] = 1 / 3.546;
I_off_n[0][0] = 2.8e-7;
I_off_n[0][10] = 3.28e-7;
I_off_n[0][20] = 3.81e-7;
I_off_n[0][30] = 4.39e-7;
I_off_n[0][40] = 5.02e-7;
I_off_n[0][50] = 5.69e-7;
I_off_n[0][60] = 6.42e-7;
I_off_n[0][70] = 7.2e-7;
I_off_n[0][80] = 8.03e-7;
I_off_n[0][90] = 8.91e-7;
I_off_n[0][100] = 9.84e-7;
I_g_on_n[0][0] = 3.59e-8;//A/micron
I_g_on_n[0][10] = 3.59e-8;
I_g_on_n[0][20] = 3.59e-8;
I_g_on_n[0][30] = 3.59e-8;
I_g_on_n[0][40] = 3.59e-8;
I_g_on_n[0][50] = 3.59e-8;
I_g_on_n[0][60] = 3.59e-8;
I_g_on_n[0][70] = 3.59e-8;
I_g_on_n[0][80] = 3.59e-8;
I_g_on_n[0][90] = 3.59e-8;
I_g_on_n[0][100] = 3.59e-8;
//ITRS LSTP device type
vdd[1] = 1.1;
Lphy[1] = 0.028;
Lelec[1] = 0.0212;
t_ox[1] = 1.4e-3;
v_th[1] = 0.50245;
c_ox[1] = 2.01e-14;
mobility_eff[1] = 363.96 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[1] = 9.12e-2;
c_g_ideal[1] = 5.18e-16;
c_fringe[1] = 0.08e-15;
c_junc[1] = 1e-15;
I_on_n[1] = 666.2e-6;
I_on_p[1] = I_on_n[1] / 2;
nmos_effective_resistance_multiplier = 1.99;
n_to_p_eff_curr_drv_ratio[1] = 2.23;
gmp_to_gmn_multiplier[1] = 0.99;
Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
long_channel_leakage_reduction[1] = 1 / 2.08;
I_off_n[1][0] = 1.01e-11;
I_off_n[1][10] = 1.65e-11;
I_off_n[1][20] = 2.62e-11;
I_off_n[1][30] = 4.06e-11;
I_off_n[1][40] = 6.12e-11;
I_off_n[1][50] = 9.02e-11;
I_off_n[1][60] = 1.3e-10;
I_off_n[1][70] = 1.83e-10;
I_off_n[1][80] = 2.51e-10;
I_off_n[1][90] = 3.29e-10;
I_off_n[1][100] = 4.1e-10;
I_g_on_n[1][0] = 9.47e-12;//A/micron
I_g_on_n[1][10] = 9.47e-12;
I_g_on_n[1][20] = 9.47e-12;
I_g_on_n[1][30] = 9.47e-12;
I_g_on_n[1][40] = 9.47e-12;
I_g_on_n[1][50] = 9.47e-12;
I_g_on_n[1][60] = 9.47e-12;
I_g_on_n[1][70] = 9.47e-12;
I_g_on_n[1][80] = 9.47e-12;
I_g_on_n[1][90] = 9.47e-12;
I_g_on_n[1][100] = 9.47e-12;
//ITRS LOP device type
vdd[2] = 0.7;
Lphy[2] = 0.022;
Lelec[2] = 0.016;
t_ox[2] = 0.9e-3;
v_th[2] = 0.22599;
c_ox[2] = 2.82e-14;//F/micron2
mobility_eff[2] = 508.9 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[2] = 5.71e-2;
c_g_ideal[2] = 6.2e-16;
c_fringe[2] = 0.073e-15;
c_junc[2] = 1e-15;
I_on_n[2] = 748.9e-6;
I_on_p[2] = I_on_n[2] / 2;
nmos_effective_resistance_multiplier = 1.76;
n_to_p_eff_curr_drv_ratio[2] = 2.28;
gmp_to_gmn_multiplier[2] = 1.11;
Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
long_channel_leakage_reduction[2] = 1 / 1.92;
I_off_n[2][0] = 4.03e-9;
I_off_n[2][10] = 5.02e-9;
I_off_n[2][20] = 6.18e-9;
I_off_n[2][30] = 7.51e-9;
I_off_n[2][40] = 9.04e-9;
I_off_n[2][50] = 1.08e-8;
I_off_n[2][60] = 1.27e-8;
I_off_n[2][70] = 1.47e-8;
I_off_n[2][80] = 1.66e-8;
I_off_n[2][90] = 1.84e-8;
I_off_n[2][100] = 2.03e-8;
I_g_on_n[2][0] = 3.24e-8;//A/micron
I_g_on_n[2][10] = 4.01e-8;
I_g_on_n[2][20] = 4.90e-8;
I_g_on_n[2][30] = 5.92e-8;
I_g_on_n[2][40] = 7.08e-8;
I_g_on_n[2][50] = 8.38e-8;
I_g_on_n[2][60] = 9.82e-8;
I_g_on_n[2][70] = 1.14e-7;
I_g_on_n[2][80] = 1.29e-7;
I_g_on_n[2][90] = 1.43e-7;
I_g_on_n[2][100] = 1.54e-7;
if (ram_cell_tech_type == lp_dram) {
//LP-DRAM cell access transistor technology parameters
curr_vdd_dram_cell = 1.1;
Lphy[3] = 0.078;
Lelec[3] = 0.0504;// Assume Lelec is 30% lesser than Lphy for DRAM access and wordline transistors.
curr_v_th_dram_access_transistor = 0.44559;
width_dram_access_transistor = 0.079;
curr_I_on_dram_cell = 36e-6;//A
curr_I_off_dram_cell_worst_case_length_temp = 19.5e-12;
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = width_dram_access_transistor * Lphy[3] * 10.0;
curr_asp_ratio_cell_dram = 1.46;
curr_c_dram_cell = 20e-15;
//LP-DRAM wordline transistor parameters
curr_vpp = 1.5;
t_ox[3] = 2.1e-3;
v_th[3] = 0.44559;
c_ox[3] = 1.41e-14;
mobility_eff[3] = 426.30 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[3] = 0.181;
c_g_ideal[3] = 1.10e-15;
c_fringe[3] = 0.08e-15;
c_junc[3] = 1e-15;
I_on_n[3] = 456e-6;
I_on_p[3] = I_on_n[3] / 2;
nmos_effective_resistance_multiplier = 1.65;
n_to_p_eff_curr_drv_ratio[3] = 2.05;
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 2.54e-11;
I_off_n[3][10] = 3.94e-11;
I_off_n[3][20] = 5.95e-11;
I_off_n[3][30] = 8.79e-11;
I_off_n[3][40] = 1.27e-10;
I_off_n[3][50] = 1.79e-10;
I_off_n[3][60] = 2.47e-10;
I_off_n[3][70] = 3.31e-10;
I_off_n[3][80] = 4.26e-10;
I_off_n[3][90] = 5.27e-10;
I_off_n[3][100] = 6.46e-10;
} else if (ram_cell_tech_type == comm_dram) {
//COMM-DRAM cell access transistor technology parameters
curr_vdd_dram_cell = 1.1;
Lphy[3] = 0.045;
Lelec[3] = 0.0298;
curr_v_th_dram_access_transistor = 1;
width_dram_access_transistor = 0.045;
curr_I_on_dram_cell = 20e-6;//A
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = 6 * 0.045 * 0.045;
curr_asp_ratio_cell_dram = 1.5;
curr_c_dram_cell = 30e-15;
//COMM-DRAM wordline transistor parameters
curr_vpp = 2.7;
t_ox[3] = 4e-3;
v_th[3] = 1.0;
c_ox[3] = 7.98e-15;
mobility_eff[3] = 368.58 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[3] = 0.147;
c_g_ideal[3] = 3.59e-16;
c_fringe[3] = 0.08e-15;
c_junc[3] = 1e-15;
I_on_n[3] = 999.4e-6;
I_on_p[3] = I_on_n[3] / 2;
nmos_effective_resistance_multiplier = 1.69;
n_to_p_eff_curr_drv_ratio[3] = 1.95;
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 1.31e-14;
I_off_n[3][10] = 2.68e-14;
I_off_n[3][20] = 5.25e-14;
I_off_n[3][30] = 9.88e-14;
I_off_n[3][40] = 1.79e-13;
I_off_n[3][50] = 3.15e-13;
I_off_n[3][60] = 5.36e-13;
I_off_n[3][70] = 8.86e-13;
I_off_n[3][80] = 1.42e-12;
I_off_n[3][90] = 2.20e-12;
I_off_n[3][100] = 3.29e-12;
}
//SRAM cell properties
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_sram = 1.46;
//CAM cell properties //TODO: data need to be revisited
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_cam = 2.92;
//Empirical undifferetiated core/FU coefficient
curr_logic_scaling_co_eff = 0.7 * 0.7;
curr_core_tx_density = 1.25;
curr_sckt_co_eff = 1.1387;
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
}
if (tech == 32) {
SENSE_AMP_D = .03e-9; // s
SENSE_AMP_P = 2.16e-15; // J
//For 2013, MPU/ASIC stagger-contacted M1 half-pitch is 32 nm (so this is 32 nm
//technology i.e. FEATURESIZE = 0.032). Using the SOI process numbers for
//HP and LSTP.
vdd[0] = 0.9;
Lphy[0] = 0.013;
Lelec[0] = 0.01013;
t_ox[0] = 0.5e-3;
v_th[0] = 0.21835;
c_ox[0] = 4.11e-14;
mobility_eff[0] = 361.84 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[0] = 5.09E-2;
c_g_ideal[0] = 5.34e-16;
c_fringe[0] = 0.04e-15;
c_junc[0] = 1e-15;
I_on_n[0] = 2211.7e-6;
I_on_p[0] = I_on_n[0] / 2;
nmos_effective_resistance_multiplier = 1.49;
n_to_p_eff_curr_drv_ratio[0] = 2.41;
gmp_to_gmn_multiplier[0] = 1.38;
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
long_channel_leakage_reduction[0] = 1 / 3.706;
//Using MASTAR, @300K (380K does not work in MASTAR), increase Lgate until Ion reduces to 95% or Lgate increase by 5% (DG device can only increase by 5%),
//whichever comes first
I_off_n[0][0] = 1.52e-7;
I_off_n[0][10] = 1.55e-7;
I_off_n[0][20] = 1.59e-7;
I_off_n[0][30] = 1.68e-7;
I_off_n[0][40] = 1.90e-7;
I_off_n[0][50] = 2.69e-7;
I_off_n[0][60] = 5.32e-7;
I_off_n[0][70] = 1.02e-6;
I_off_n[0][80] = 1.62e-6;
I_off_n[0][90] = 2.73e-6;
I_off_n[0][100] = 6.1e-6;
I_g_on_n[0][0] = 6.55e-8;//A/micron
I_g_on_n[0][10] = 6.55e-8;
I_g_on_n[0][20] = 6.55e-8;
I_g_on_n[0][30] = 6.55e-8;
I_g_on_n[0][40] = 6.55e-8;
I_g_on_n[0][50] = 6.55e-8;
I_g_on_n[0][60] = 6.55e-8;
I_g_on_n[0][70] = 6.55e-8;
I_g_on_n[0][80] = 6.55e-8;
I_g_on_n[0][90] = 6.55e-8;
I_g_on_n[0][100] = 6.55e-8;
//LSTP device type
vdd[1] = 1;
Lphy[1] = 0.020;
Lelec[1] = 0.0173;
t_ox[1] = 1.2e-3;
v_th[1] = 0.513;
c_ox[1] = 2.29e-14;
mobility_eff[1] = 347.46 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[1] = 8.64e-2;
c_g_ideal[1] = 4.58e-16;
c_fringe[1] = 0.053e-15;
c_junc[1] = 1e-15;
I_on_n[1] = 683.6e-6;
I_on_p[1] = I_on_n[1] / 2;
nmos_effective_resistance_multiplier = 1.99;
n_to_p_eff_curr_drv_ratio[1] = 2.23;
gmp_to_gmn_multiplier[1] = 0.99;
Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
long_channel_leakage_reduction[1] = 1 / 1.93;
I_off_n[1][0] = 2.06e-11;
I_off_n[1][10] = 3.30e-11;
I_off_n[1][20] = 5.15e-11;
I_off_n[1][30] = 7.83e-11;
I_off_n[1][40] = 1.16e-10;
I_off_n[1][50] = 1.69e-10;
I_off_n[1][60] = 2.40e-10;
I_off_n[1][70] = 3.34e-10;
I_off_n[1][80] = 4.54e-10;
I_off_n[1][90] = 5.96e-10;
I_off_n[1][100] = 7.44e-10;
I_g_on_n[1][0] = 3.73e-11;//A/micron
I_g_on_n[1][10] = 3.73e-11;
I_g_on_n[1][20] = 3.73e-11;
I_g_on_n[1][30] = 3.73e-11;
I_g_on_n[1][40] = 3.73e-11;
I_g_on_n[1][50] = 3.73e-11;
I_g_on_n[1][60] = 3.73e-11;
I_g_on_n[1][70] = 3.73e-11;
I_g_on_n[1][80] = 3.73e-11;
I_g_on_n[1][90] = 3.73e-11;
I_g_on_n[1][100] = 3.73e-11;
//LOP device type
vdd[2] = 0.6;
Lphy[2] = 0.016;
Lelec[2] = 0.01232;
t_ox[2] = 0.9e-3;
v_th[2] = 0.24227;
c_ox[2] = 2.84e-14;
mobility_eff[2] = 513.52 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[2] = 4.64e-2;
c_g_ideal[2] = 4.54e-16;
c_fringe[2] = 0.057e-15;
c_junc[2] = 1e-15;
I_on_n[2] = 827.8e-6;
I_on_p[2] = I_on_n[2] / 2;
nmos_effective_resistance_multiplier = 1.73;
n_to_p_eff_curr_drv_ratio[2] = 2.28;
gmp_to_gmn_multiplier[2] = 1.11;
Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
long_channel_leakage_reduction[2] = 1 / 1.89;
I_off_n[2][0] = 5.94e-8;
I_off_n[2][10] = 7.23e-8;
I_off_n[2][20] = 8.7e-8;
I_off_n[2][30] = 1.04e-7;
I_off_n[2][40] = 1.22e-7;
I_off_n[2][50] = 1.43e-7;
I_off_n[2][60] = 1.65e-7;
I_off_n[2][70] = 1.90e-7;
I_off_n[2][80] = 2.15e-7;
I_off_n[2][90] = 2.39e-7;
I_off_n[2][100] = 2.63e-7;
I_g_on_n[2][0] = 2.93e-9;//A/micron
I_g_on_n[2][10] = 2.93e-9;
I_g_on_n[2][20] = 2.93e-9;
I_g_on_n[2][30] = 2.93e-9;
I_g_on_n[2][40] = 2.93e-9;
I_g_on_n[2][50] = 2.93e-9;
I_g_on_n[2][60] = 2.93e-9;
I_g_on_n[2][70] = 2.93e-9;
I_g_on_n[2][80] = 2.93e-9;
I_g_on_n[2][90] = 2.93e-9;
I_g_on_n[2][100] = 2.93e-9;
if (ram_cell_tech_type == lp_dram) {
//LP-DRAM cell access transistor technology parameters
curr_vdd_dram_cell = 1.0;
Lphy[3] = 0.056;
Lelec[3] = 0.0419;//Assume Lelec is 30% lesser than Lphy for DRAM access and wordline transistors.
curr_v_th_dram_access_transistor = 0.44129;
width_dram_access_transistor = 0.056;
curr_I_on_dram_cell = 36e-6;
curr_I_off_dram_cell_worst_case_length_temp = 18.9e-12;
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = width_dram_access_transistor * Lphy[3] * 10.0;
curr_asp_ratio_cell_dram = 1.46;
curr_c_dram_cell = 20e-15;
//LP-DRAM wordline transistor parameters
curr_vpp = 1.5;
t_ox[3] = 2e-3;
v_th[3] = 0.44467;
c_ox[3] = 1.48e-14;
mobility_eff[3] = 408.12 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[3] = 0.174;
c_g_ideal[3] = 7.45e-16;
c_fringe[3] = 0.053e-15;
c_junc[3] = 1e-15;
I_on_n[3] = 1055.4e-6;
I_on_p[3] = I_on_n[3] / 2;
nmos_effective_resistance_multiplier = 1.65;
n_to_p_eff_curr_drv_ratio[3] = 2.05;
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 3.57e-11;
I_off_n[3][10] = 5.51e-11;
I_off_n[3][20] = 8.27e-11;
I_off_n[3][30] = 1.21e-10;
I_off_n[3][40] = 1.74e-10;
I_off_n[3][50] = 2.45e-10;
I_off_n[3][60] = 3.38e-10;
I_off_n[3][70] = 4.53e-10;
I_off_n[3][80] = 5.87e-10;
I_off_n[3][90] = 7.29e-10;
I_off_n[3][100] = 8.87e-10;
} else if (ram_cell_tech_type == comm_dram) {
//COMM-DRAM cell access transistor technology parameters
curr_vdd_dram_cell = 1.0;
Lphy[3] = 0.032;
Lelec[3] = 0.0205;//Assume Lelec is 30% lesser than Lphy for DRAM access and wordline transistors.
curr_v_th_dram_access_transistor = 1;
width_dram_access_transistor = 0.032;
curr_I_on_dram_cell = 20e-6;
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = 6 * 0.032 * 0.032;
curr_asp_ratio_cell_dram = 1.5;
curr_c_dram_cell = 30e-15;
//COMM-DRAM wordline transistor parameters
curr_vpp = 2.6;
t_ox[3] = 4e-3;
v_th[3] = 1.0;
c_ox[3] = 7.99e-15;
mobility_eff[3] = 380.76 * (1e-2 * 1e6 * 1e-2 * 1e6);
Vdsat[3] = 0.129;
c_g_ideal[3] = 2.56e-16;
c_fringe[3] = 0.053e-15;
c_junc[3] = 1e-15;
I_on_n[3] = 1024.5e-6;
I_on_p[3] = I_on_n[3] / 2;
nmos_effective_resistance_multiplier = 1.69;
n_to_p_eff_curr_drv_ratio[3] = 1.95;
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 3.63e-14;
I_off_n[3][10] = 7.18e-14;
I_off_n[3][20] = 1.36e-13;
I_off_n[3][30] = 2.49e-13;
I_off_n[3][40] = 4.41e-13;
I_off_n[3][50] = 7.55e-13;
I_off_n[3][60] = 1.26e-12;
I_off_n[3][70] = 2.03e-12;
I_off_n[3][80] = 3.19e-12;
I_off_n[3][90] = 4.87e-12;
I_off_n[3][100] = 7.16e-12;
}
//SRAM cell properties
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_sram = 1.46;
//CAM cell properties //TODO: data need to be revisited
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_cam = 2.92;
//Empirical undifferetiated core/FU coefficient
curr_logic_scaling_co_eff = 0.7 * 0.7 * 0.7;
curr_core_tx_density = 1.25 / 0.7;
curr_sckt_co_eff = 1.1111;
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
}
if (tech == 22) {
SENSE_AMP_D = .03e-9; // s
SENSE_AMP_P = 2.16e-15; // J
//For 2016, MPU/ASIC stagger-contacted M1 half-pitch is 22 nm (so this is 22 nm
//technology i.e. FEATURESIZE = 0.022). Using the DG process numbers for HP.
//22 nm HP
vdd[0] = 0.8;
Lphy[0] = 0.009;//Lphy is the physical gate-length.
Lelec[0] = 0.00468;//Lelec is the electrical gate-length.
t_ox[0] = 0.55e-3;//micron
v_th[0] = 0.1395;//V
c_ox[0] = 3.63e-14;//F/micron2
mobility_eff[0] = 426.07 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
Vdsat[0] = 2.33e-2; //V/micron
c_g_ideal[0] = 3.27e-16;//F/micron
c_fringe[0] = 0.06e-15;//F/micron
c_junc[0] = 0;//F/micron2
I_on_n[0] = 2626.4e-6;//A/micron
I_on_p[0] = I_on_n[0] / 2;//A/micron //This value for I_on_p is not really used.
nmos_effective_resistance_multiplier = 1.45;
n_to_p_eff_curr_drv_ratio[0] = 2; //Wpmos/Wnmos = 2 in 2007 MASTAR. Look in
//"Dynamic" tab of Device workspace.
gmp_to_gmn_multiplier[0] = 1.38; //Just using the 32nm SOI value.
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
long_channel_leakage_reduction[0] = 1 / 3.274;
//From 22nm, leakage current are directly from ITRS report rather
//than MASTAR, since MASTAR has serious bugs there.
I_off_n[0][0] = 1.52e-7 / 1.5 * 1.2;
I_off_n[0][10] = 1.55e-7 / 1.5 * 1.2;
I_off_n[0][20] = 1.59e-7 / 1.5 * 1.2;
I_off_n[0][30] = 1.68e-7 / 1.5 * 1.2;
I_off_n[0][40] = 1.90e-7 / 1.5 * 1.2;
I_off_n[0][50] = 2.69e-7 / 1.5 * 1.2;
I_off_n[0][60] = 5.32e-7 / 1.5 * 1.2;
I_off_n[0][70] = 1.02e-6 / 1.5 * 1.2;
I_off_n[0][80] = 1.62e-6 / 1.5 * 1.2;
I_off_n[0][90] = 2.73e-6 / 1.5 * 1.2;
I_off_n[0][100] = 6.1e-6 / 1.5 * 1.2;
//for 22nm DG HP
I_g_on_n[0][0] = 1.81e-9;//A/micron
I_g_on_n[0][10] = 1.81e-9;
I_g_on_n[0][20] = 1.81e-9;
I_g_on_n[0][30] = 1.81e-9;
I_g_on_n[0][40] = 1.81e-9;
I_g_on_n[0][50] = 1.81e-9;
I_g_on_n[0][60] = 1.81e-9;
I_g_on_n[0][70] = 1.81e-9;
I_g_on_n[0][80] = 1.81e-9;
I_g_on_n[0][90] = 1.81e-9;
I_g_on_n[0][100] = 1.81e-9;
//22 nm LSTP DG
vdd[1] = 0.8;
Lphy[1] = 0.014;
Lelec[1] = 0.008;//Lelec is the electrical gate-length.
t_ox[1] = 1.1e-3;//micron
v_th[1] = 0.40126;//V
c_ox[1] = 2.30e-14;//F/micron2
mobility_eff[1] = 738.09 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
Vdsat[1] = 6.64e-2; //V/micron
c_g_ideal[1] = 3.22e-16;//F/micron
c_fringe[1] = 0.08e-15;
c_junc[1] = 0;//F/micron2
I_on_n[1] = 727.6e-6;//A/micron
I_on_p[1] = I_on_n[1] / 2;
nmos_effective_resistance_multiplier = 1.99;
n_to_p_eff_curr_drv_ratio[1] = 2;
gmp_to_gmn_multiplier[1] = 0.99;
Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];//ohm-micron
Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];//ohm-micron
long_channel_leakage_reduction[1] = 1 / 1.89;
I_off_n[1][0] = 2.43e-11;
I_off_n[1][10] = 4.85e-11;
I_off_n[1][20] = 9.68e-11;
I_off_n[1][30] = 1.94e-10;
I_off_n[1][40] = 3.87e-10;
I_off_n[1][50] = 7.73e-10;
I_off_n[1][60] = 3.55e-10;
I_off_n[1][70] = 3.09e-9;
I_off_n[1][80] = 6.19e-9;
I_off_n[1][90] = 1.24e-8;
I_off_n[1][100] = 2.48e-8;
I_g_on_n[1][0] = 4.51e-10;//A/micron
I_g_on_n[1][10] = 4.51e-10;
I_g_on_n[1][20] = 4.51e-10;
I_g_on_n[1][30] = 4.51e-10;
I_g_on_n[1][40] = 4.51e-10;
I_g_on_n[1][50] = 4.51e-10;
I_g_on_n[1][60] = 4.51e-10;
I_g_on_n[1][70] = 4.51e-10;
I_g_on_n[1][80] = 4.51e-10;
I_g_on_n[1][90] = 4.51e-10;
I_g_on_n[1][100] = 4.51e-10;
//22 nm LOP
vdd[2] = 0.6;
Lphy[2] = 0.011;
Lelec[2] = 0.00604;//Lelec is the electrical gate-length.
t_ox[2] = 0.8e-3;//micron
v_th[2] = 0.2315;//V
c_ox[2] = 2.87e-14;//F/micron2
mobility_eff[2] = 698.37 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
Vdsat[2] = 1.81e-2; //V/micron
c_g_ideal[2] = 3.16e-16;//F/micron
c_fringe[2] = 0.08e-15;
c_junc[2] = 0;//F/micron2 This is Cj0 not Cjunc in MASTAR results->Dynamic Tab
I_on_n[2] = 916.1e-6;//A/micron
I_on_p[2] = I_on_n[2] / 2;
nmos_effective_resistance_multiplier = 1.73;
n_to_p_eff_curr_drv_ratio[2] = 2;
gmp_to_gmn_multiplier[2] = 1.11;
Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];//ohm-micron
Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];//ohm-micron
long_channel_leakage_reduction[2] = 1 / 2.38;
I_off_n[2][0] = 1.31e-8;
I_off_n[2][10] = 2.60e-8;
I_off_n[2][20] = 5.14e-8;
I_off_n[2][30] = 1.02e-7;
I_off_n[2][40] = 2.02e-7;
I_off_n[2][50] = 3.99e-7;
I_off_n[2][60] = 7.91e-7;
I_off_n[2][70] = 1.09e-6;
I_off_n[2][80] = 2.09e-6;
I_off_n[2][90] = 4.04e-6;
I_off_n[2][100] = 4.48e-6;
I_g_on_n[2][0] = 2.74e-9;//A/micron
I_g_on_n[2][10] = 2.74e-9;
I_g_on_n[2][20] = 2.74e-9;
I_g_on_n[2][30] = 2.74e-9;
I_g_on_n[2][40] = 2.74e-9;
I_g_on_n[2][50] = 2.74e-9;
I_g_on_n[2][60] = 2.74e-9;
I_g_on_n[2][70] = 2.74e-9;
I_g_on_n[2][80] = 2.74e-9;
I_g_on_n[2][90] = 2.74e-9;
I_g_on_n[2][100] = 2.74e-9;
if (ram_cell_tech_type == 3) {} else if (ram_cell_tech_type == 4) {
//22 nm commodity DRAM cell access transistor technology parameters.
//parameters
curr_vdd_dram_cell = 0.9;//0.45;//This value has reduced greatly in 2007 ITRS for all technology nodes. In
//2005 ITRS, the value was about twice the value in 2007 ITRS
Lphy[3] = 0.022;//micron
Lelec[3] = 0.0181;//micron.
curr_v_th_dram_access_transistor = 1;//V
width_dram_access_transistor = 0.022;//micron
curr_I_on_dram_cell = 20e-6; //This is a typical value that I have always
//kept constant. In reality this could perhaps be lower
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;//A
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = 6 * 0.022 * 0.022;//micron2.
curr_asp_ratio_cell_dram = 0.667;
curr_c_dram_cell = 30e-15;//This is a typical value that I have alwaus
//kept constant.
//22 nm commodity DRAM wordline transistor parameters obtained using MASTAR.
curr_vpp = 2.3;//vpp. V
t_ox[3] = 3.5e-3;//micron
v_th[3] = 1.0;//V
c_ox[3] = 9.06e-15;//F/micron2
mobility_eff[3] = 367.29 * (1e-2 * 1e6 * 1e-2 * 1e6);//micron2 / Vs
Vdsat[3] = 0.0972; //V/micron
c_g_ideal[3] = 1.99e-16;//F/micron
c_fringe[3] = 0.053e-15;//F/micron
c_junc[3] = 1e-15;//F/micron2
I_on_n[3] = 910.5e-6;//A/micron
I_on_p[3] = I_on_n[3] / 2;//This value for I_on_p is not really used.
nmos_effective_resistance_multiplier = 1.69;//Using the value from 32nm.
//
n_to_p_eff_curr_drv_ratio[3] = 1.95;//Using the value from 32nm
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];//ohm-micron
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];//ohm-micron
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 1.1e-13; //A/micron
I_off_n[3][10] = 2.11e-13;
I_off_n[3][20] = 3.88e-13;
I_off_n[3][30] = 6.9e-13;
I_off_n[3][40] = 1.19e-12;
I_off_n[3][50] = 1.98e-12;
I_off_n[3][60] = 3.22e-12;
I_off_n[3][70] = 5.09e-12;
I_off_n[3][80] = 7.85e-12;
I_off_n[3][90] = 1.18e-11;
I_off_n[3][100] = 1.72e-11;
} else {
//some error handler
}
//SRAM cell properties
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_sram = 1.46;
//CAM cell properties //TODO: data need to be revisited
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_cam = 2.92;
//Empirical undifferetiated core/FU coefficient
curr_logic_scaling_co_eff = 0.7 * 0.7 * 0.7 * 0.7;
curr_core_tx_density = 1.25 / 0.7 / 0.7;
curr_sckt_co_eff = 1.1296;
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
}
if (tech == 16) {
//For 2019, MPU/ASIC stagger-contacted M1 half-pitch is 16 nm (so this is 16 nm
//technology i.e. FEATURESIZE = 0.016). Using the DG process numbers for HP.
//16 nm HP
vdd[0] = 0.7;
Lphy[0] = 0.006;//Lphy is the physical gate-length.
Lelec[0] = 0.00315;//Lelec is the electrical gate-length.
t_ox[0] = 0.5e-3;//micron
v_th[0] = 0.1489;//V
c_ox[0] = 3.83e-14;//F/micron2 Cox_elec in MASTAR
mobility_eff[0] = 476.15 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
Vdsat[0] = 1.42e-2; //V/micron calculated in spreadsheet
c_g_ideal[0] = 2.30e-16;//F/micron
c_fringe[0] = 0.06e-15;//F/micron MASTAR inputdynamic/3
c_junc[0] = 0;//F/micron2 MASTAR result dynamic
I_on_n[0] = 2768.4e-6;//A/micron
I_on_p[0] = I_on_n[0] / 2;//A/micron //This value for I_on_p is not really used.
nmos_effective_resistance_multiplier = 1.48;//nmos_effective_resistance_multiplier is the ratio of Ieff to Idsat where Ieff is the effective NMOS current and Idsat is the saturation current.
n_to_p_eff_curr_drv_ratio[0] = 2; //Wpmos/Wnmos = 2 in 2007 MASTAR. Look in
//"Dynamic" tab of Device workspace.
gmp_to_gmn_multiplier[0] = 1.38; //Just using the 32nm SOI value.
Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
long_channel_leakage_reduction[0] = 1 / 2.655;
I_off_n[0][0] = 1.52e-7 / 1.5 * 1.2 * 1.07;
I_off_n[0][10] = 1.55e-7 / 1.5 * 1.2 * 1.07;
I_off_n[0][20] = 1.59e-7 / 1.5 * 1.2 * 1.07;
I_off_n[0][30] = 1.68e-7 / 1.5 * 1.2 * 1.07;
I_off_n[0][40] = 1.90e-7 / 1.5 * 1.2 * 1.07;
I_off_n[0][50] = 2.69e-7 / 1.5 * 1.2 * 1.07;
I_off_n[0][60] = 5.32e-7 / 1.5 * 1.2 * 1.07;
I_off_n[0][70] = 1.02e-6 / 1.5 * 1.2 * 1.07;
I_off_n[0][80] = 1.62e-6 / 1.5 * 1.2 * 1.07;
I_off_n[0][90] = 2.73e-6 / 1.5 * 1.2 * 1.07;
I_off_n[0][100] = 6.1e-6 / 1.5 * 1.2 * 1.07;
//for 16nm DG HP
I_g_on_n[0][0] = 1.07e-9;//A/micron
I_g_on_n[0][10] = 1.07e-9;
I_g_on_n[0][20] = 1.07e-9;
I_g_on_n[0][30] = 1.07e-9;
I_g_on_n[0][40] = 1.07e-9;
I_g_on_n[0][50] = 1.07e-9;
I_g_on_n[0][60] = 1.07e-9;
I_g_on_n[0][70] = 1.07e-9;
I_g_on_n[0][80] = 1.07e-9;
I_g_on_n[0][90] = 1.07e-9;
I_g_on_n[0][100] = 1.07e-9;
if (ram_cell_tech_type == 3) {} else if (ram_cell_tech_type == 4) {
//22 nm commodity DRAM cell access transistor technology parameters.
//parameters
curr_vdd_dram_cell = 0.9;//0.45;//This value has reduced greatly in 2007 ITRS for all technology nodes. In
//2005 ITRS, the value was about twice the value in 2007 ITRS
Lphy[3] = 0.022;//micron
Lelec[3] = 0.0181;//micron.
curr_v_th_dram_access_transistor = 1;//V
width_dram_access_transistor = 0.022;//micron
curr_I_on_dram_cell = 20e-6; //This is a typical value that I have always
//kept constant. In reality this could perhaps be lower
curr_I_off_dram_cell_worst_case_length_temp = 1e-15;//A
curr_Wmemcella_dram = width_dram_access_transistor;
curr_Wmemcellpmos_dram = 0;
curr_Wmemcellnmos_dram = 0;
curr_area_cell_dram = 6 * 0.022 * 0.022;//micron2.
curr_asp_ratio_cell_dram = 0.667;
curr_c_dram_cell = 30e-15;//This is a typical value that I have alwaus
//kept constant.
//22 nm commodity DRAM wordline transistor parameters obtained using MASTAR.
curr_vpp = 2.3;//vpp. V
t_ox[3] = 3.5e-3;//micron
v_th[3] = 1.0;//V
c_ox[3] = 9.06e-15;//F/micron2
mobility_eff[3] = 367.29 * (1e-2 * 1e6 * 1e-2 * 1e6);//micron2 / Vs
Vdsat[3] = 0.0972; //V/micron
c_g_ideal[3] = 1.99e-16;//F/micron
c_fringe[3] = 0.053e-15;//F/micron
c_junc[3] = 1e-15;//F/micron2
I_on_n[3] = 910.5e-6;//A/micron
I_on_p[3] = I_on_n[3] / 2;//This value for I_on_p is not really used.
nmos_effective_resistance_multiplier = 1.69;//Using the value from 32nm.
//
n_to_p_eff_curr_drv_ratio[3] = 1.95;//Using the value from 32nm
gmp_to_gmn_multiplier[3] = 0.90;
Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];//ohm-micron
Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];//ohm-micron
long_channel_leakage_reduction[3] = 1;
I_off_n[3][0] = 1.1e-13; //A/micron
I_off_n[3][10] = 2.11e-13;
I_off_n[3][20] = 3.88e-13;
I_off_n[3][30] = 6.9e-13;
I_off_n[3][40] = 1.19e-12;
I_off_n[3][50] = 1.98e-12;
I_off_n[3][60] = 3.22e-12;
I_off_n[3][70] = 5.09e-12;
I_off_n[3][80] = 7.85e-12;
I_off_n[3][90] = 1.18e-11;
I_off_n[3][100] = 1.72e-11;
} else {
//some error handler
}
//SRAM cell properties
curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_sram = 1.46;
//CAM cell properties //TODO: data need to be revisited
curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
curr_asp_ratio_cell_cam = 2.92;
//Empirical undifferetiated core/FU coefficient
curr_logic_scaling_co_eff = 0.7 * 0.7 * 0.7 * 0.7 * 0.7;
curr_core_tx_density = 1.25 / 0.7 / 0.7 / 0.7;
curr_sckt_co_eff = 1.1296;
curr_chip_layout_overhead = 1.2;//die measurement results based on Niagara 1 and 2
curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
}
g_tp.peri_global.Vdd += curr_alpha * vdd[peri_global_tech_type];
g_tp.peri_global.t_ox += curr_alpha * t_ox[peri_global_tech_type];
g_tp.peri_global.Vth += curr_alpha * v_th[peri_global_tech_type];
g_tp.peri_global.C_ox += curr_alpha * c_ox[peri_global_tech_type];
g_tp.peri_global.C_g_ideal += curr_alpha * c_g_ideal[peri_global_tech_type];
g_tp.peri_global.C_fringe += curr_alpha * c_fringe[peri_global_tech_type];
g_tp.peri_global.C_junc += curr_alpha * c_junc[peri_global_tech_type];
g_tp.peri_global.C_junc_sidewall = 0.25e-15; // F/micron
g_tp.peri_global.l_phy += curr_alpha * Lphy[peri_global_tech_type];
g_tp.peri_global.l_elec += curr_alpha * Lelec[peri_global_tech_type];
g_tp.peri_global.I_on_n += curr_alpha * I_on_n[peri_global_tech_type];
g_tp.peri_global.R_nch_on += curr_alpha * Rnchannelon[peri_global_tech_type];
g_tp.peri_global.R_pch_on += curr_alpha * Rpchannelon[peri_global_tech_type];
g_tp.peri_global.n_to_p_eff_curr_drv_ratio
+= curr_alpha * n_to_p_eff_curr_drv_ratio[peri_global_tech_type];
g_tp.peri_global.long_channel_leakage_reduction
+= curr_alpha * long_channel_leakage_reduction[peri_global_tech_type];
g_tp.peri_global.I_off_n += curr_alpha * I_off_n[peri_global_tech_type][g_ip->temp - 300];
g_tp.peri_global.I_off_p += curr_alpha * I_off_n[peri_global_tech_type][g_ip->temp - 300];
g_tp.peri_global.I_g_on_n += curr_alpha * I_g_on_n[peri_global_tech_type][g_ip->temp - 300];
g_tp.peri_global.I_g_on_p += curr_alpha * I_g_on_n[peri_global_tech_type][g_ip->temp - 300];
gmp_to_gmn_multiplier_periph_global += curr_alpha * gmp_to_gmn_multiplier[peri_global_tech_type];
g_tp.sram_cell.Vdd += curr_alpha * vdd[ram_cell_tech_type];
g_tp.sram_cell.l_phy += curr_alpha * Lphy[ram_cell_tech_type];
g_tp.sram_cell.l_elec += curr_alpha * Lelec[ram_cell_tech_type];
g_tp.sram_cell.t_ox += curr_alpha * t_ox[ram_cell_tech_type];
g_tp.sram_cell.Vth += curr_alpha * v_th[ram_cell_tech_type];
g_tp.sram_cell.C_g_ideal += curr_alpha * c_g_ideal[ram_cell_tech_type];
g_tp.sram_cell.C_fringe += curr_alpha * c_fringe[ram_cell_tech_type];
g_tp.sram_cell.C_junc += curr_alpha * c_junc[ram_cell_tech_type];
g_tp.sram_cell.C_junc_sidewall = 0.25e-15; // F/micron
g_tp.sram_cell.I_on_n += curr_alpha * I_on_n[ram_cell_tech_type];
g_tp.sram_cell.R_nch_on += curr_alpha * Rnchannelon[ram_cell_tech_type];
g_tp.sram_cell.R_pch_on += curr_alpha * Rpchannelon[ram_cell_tech_type];
g_tp.sram_cell.n_to_p_eff_curr_drv_ratio += curr_alpha * n_to_p_eff_curr_drv_ratio[ram_cell_tech_type];
g_tp.sram_cell.long_channel_leakage_reduction += curr_alpha * long_channel_leakage_reduction[ram_cell_tech_type];
g_tp.sram_cell.I_off_n += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
g_tp.sram_cell.I_off_p += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
g_tp.sram_cell.I_g_on_n += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
g_tp.sram_cell.I_g_on_p += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
g_tp.dram_cell_Vdd += curr_alpha * curr_vdd_dram_cell;
g_tp.dram_acc.Vth += curr_alpha * curr_v_th_dram_access_transistor;
g_tp.dram_acc.l_phy += curr_alpha * Lphy[dram_cell_tech_flavor];
g_tp.dram_acc.l_elec += curr_alpha * Lelec[dram_cell_tech_flavor];
g_tp.dram_acc.C_g_ideal += curr_alpha * c_g_ideal[dram_cell_tech_flavor];
g_tp.dram_acc.C_fringe += curr_alpha * c_fringe[dram_cell_tech_flavor];
g_tp.dram_acc.C_junc += curr_alpha * c_junc[dram_cell_tech_flavor];
g_tp.dram_acc.C_junc_sidewall = 0.25e-15; // F/micron
g_tp.dram_cell_I_on += curr_alpha * curr_I_on_dram_cell;
g_tp.dram_cell_I_off_worst_case_len_temp += curr_alpha * curr_I_off_dram_cell_worst_case_length_temp;
g_tp.dram_acc.I_on_n += curr_alpha * I_on_n[dram_cell_tech_flavor];
g_tp.dram_cell_C += curr_alpha * curr_c_dram_cell;
g_tp.vpp += curr_alpha * curr_vpp;
g_tp.dram_wl.l_phy += curr_alpha * Lphy[dram_cell_tech_flavor];
g_tp.dram_wl.l_elec += curr_alpha * Lelec[dram_cell_tech_flavor];
g_tp.dram_wl.C_g_ideal += curr_alpha * c_g_ideal[dram_cell_tech_flavor];
g_tp.dram_wl.C_fringe += curr_alpha * c_fringe[dram_cell_tech_flavor];
g_tp.dram_wl.C_junc += curr_alpha * c_junc[dram_cell_tech_flavor];
g_tp.dram_wl.C_junc_sidewall = 0.25e-15; // F/micron
g_tp.dram_wl.I_on_n += curr_alpha * I_on_n[dram_cell_tech_flavor];
g_tp.dram_wl.R_nch_on += curr_alpha * Rnchannelon[dram_cell_tech_flavor];
g_tp.dram_wl.R_pch_on += curr_alpha * Rpchannelon[dram_cell_tech_flavor];
g_tp.dram_wl.n_to_p_eff_curr_drv_ratio += curr_alpha * n_to_p_eff_curr_drv_ratio[dram_cell_tech_flavor];
g_tp.dram_wl.long_channel_leakage_reduction += curr_alpha * long_channel_leakage_reduction[dram_cell_tech_flavor];
g_tp.dram_wl.I_off_n += curr_alpha * I_off_n[dram_cell_tech_flavor][g_ip->temp - 300];
g_tp.dram_wl.I_off_p += curr_alpha * I_off_n[dram_cell_tech_flavor][g_ip->temp - 300];
g_tp.cam_cell.Vdd += curr_alpha * vdd[ram_cell_tech_type];
g_tp.cam_cell.l_phy += curr_alpha * Lphy[ram_cell_tech_type];
g_tp.cam_cell.l_elec += curr_alpha * Lelec[ram_cell_tech_type];
g_tp.cam_cell.t_ox += curr_alpha * t_ox[ram_cell_tech_type];
g_tp.cam_cell.Vth += curr_alpha * v_th[ram_cell_tech_type];
g_tp.cam_cell.C_g_ideal += curr_alpha * c_g_ideal[ram_cell_tech_type];
g_tp.cam_cell.C_fringe += curr_alpha * c_fringe[ram_cell_tech_type];
g_tp.cam_cell.C_junc += curr_alpha * c_junc[ram_cell_tech_type];
g_tp.cam_cell.C_junc_sidewall = 0.25e-15; // F/micron
g_tp.cam_cell.I_on_n += curr_alpha * I_on_n[ram_cell_tech_type];
g_tp.cam_cell.R_nch_on += curr_alpha * Rnchannelon[ram_cell_tech_type];
g_tp.cam_cell.R_pch_on += curr_alpha * Rpchannelon[ram_cell_tech_type];
g_tp.cam_cell.n_to_p_eff_curr_drv_ratio += curr_alpha * n_to_p_eff_curr_drv_ratio[ram_cell_tech_type];
g_tp.cam_cell.long_channel_leakage_reduction += curr_alpha * long_channel_leakage_reduction[ram_cell_tech_type];
g_tp.cam_cell.I_off_n += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
g_tp.cam_cell.I_off_p += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
g_tp.cam_cell.I_g_on_n += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
g_tp.cam_cell.I_g_on_p += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
g_tp.dram.cell_a_w += curr_alpha * curr_Wmemcella_dram;
g_tp.dram.cell_pmos_w += curr_alpha * curr_Wmemcellpmos_dram;
g_tp.dram.cell_nmos_w += curr_alpha * curr_Wmemcellnmos_dram;
area_cell_dram += curr_alpha * curr_area_cell_dram;
asp_ratio_cell_dram += curr_alpha * curr_asp_ratio_cell_dram;
g_tp.sram.cell_a_w += curr_alpha * curr_Wmemcella_sram;
g_tp.sram.cell_pmos_w += curr_alpha * curr_Wmemcellpmos_sram;
g_tp.sram.cell_nmos_w += curr_alpha * curr_Wmemcellnmos_sram;
area_cell_sram += curr_alpha * curr_area_cell_sram;
asp_ratio_cell_sram += curr_alpha * curr_asp_ratio_cell_sram;
g_tp.cam.cell_a_w += curr_alpha * curr_Wmemcella_cam;//sheng
g_tp.cam.cell_pmos_w += curr_alpha * curr_Wmemcellpmos_cam;
g_tp.cam.cell_nmos_w += curr_alpha * curr_Wmemcellnmos_cam;
area_cell_cam += curr_alpha * curr_area_cell_cam;
asp_ratio_cell_cam += curr_alpha * curr_asp_ratio_cell_cam;
//Sense amplifier latch Gm calculation
mobility_eff_periph_global += curr_alpha * mobility_eff[peri_global_tech_type];
Vdsat_periph_global += curr_alpha * Vdsat[peri_global_tech_type];
//Empirical undifferetiated core/FU coefficient
g_tp.scaling_factor.logic_scaling_co_eff += curr_alpha * curr_logic_scaling_co_eff;
g_tp.scaling_factor.core_tx_density += curr_alpha * curr_core_tx_density;
g_tp.chip_layout_overhead += curr_alpha * curr_chip_layout_overhead;
g_tp.macro_layout_overhead += curr_alpha * curr_macro_layout_overhead;
g_tp.sckt_co_eff += curr_alpha * curr_sckt_co_eff;
}
//Currently we are not modeling the resistance/capacitance of poly anywhere.
//Continuous function (or date have been processed) does not need linear interpolation
g_tp.w_comp_inv_p1 = 12.5 * g_ip->F_sz_um;//this was 10 micron for the 0.8 micron process
g_tp.w_comp_inv_n1 = 7.5 * g_ip->F_sz_um;//this was 6 micron for the 0.8 micron process
g_tp.w_comp_inv_p2 = 25 * g_ip->F_sz_um;//this was 20 micron for the 0.8 micron process
g_tp.w_comp_inv_n2 = 15 * g_ip->F_sz_um;//this was 12 micron for the 0.8 micron process
g_tp.w_comp_inv_p3 = 50 * g_ip->F_sz_um;//this was 40 micron for the 0.8 micron process
g_tp.w_comp_inv_n3 = 30 * g_ip->F_sz_um;//this was 24 micron for the 0.8 micron process
g_tp.w_eval_inv_p = 100 * g_ip->F_sz_um;//this was 80 micron for the 0.8 micron process
g_tp.w_eval_inv_n = 50 * g_ip->F_sz_um;//this was 40 micron for the 0.8 micron process
g_tp.w_comp_n = 12.5 * g_ip->F_sz_um;//this was 10 micron for the 0.8 micron process
g_tp.w_comp_p = 37.5 * g_ip->F_sz_um;//this was 30 micron for the 0.8 micron process
g_tp.MIN_GAP_BET_P_AND_N_DIFFS = 5 * g_ip->F_sz_um;
g_tp.MIN_GAP_BET_SAME_TYPE_DIFFS = 1.5 * g_ip->F_sz_um;
g_tp.HPOWERRAIL = 2 * g_ip->F_sz_um;
g_tp.cell_h_def = 50 * g_ip->F_sz_um;
g_tp.w_poly_contact = g_ip->F_sz_um;
g_tp.spacing_poly_to_contact = g_ip->F_sz_um;
g_tp.spacing_poly_to_poly = 1.5 * g_ip->F_sz_um;
g_tp.ram_wl_stitching_overhead_ = 7.5 * g_ip->F_sz_um;
g_tp.min_w_nmos_ = 3 * g_ip->F_sz_um / 2;
g_tp.max_w_nmos_ = 100 * g_ip->F_sz_um;
//was 10 micron for the 0.8 micron process
g_tp.w_iso = 12.5 * g_ip->F_sz_um;
// sense amplifier N-trans; was 3 micron for the 0.8 micron process
g_tp.w_sense_n = 3.75 * g_ip->F_sz_um;
// sense amplifier P-trans; was 6 micron for the 0.8 micron process
g_tp.w_sense_p = 7.5 * g_ip->F_sz_um;
// Sense enable transistor of the sense amplifier; was 4 micron for the
//0.8 micron process
g_tp.w_sense_en = 5 * g_ip->F_sz_um;
g_tp.w_nmos_b_mux = 6 * g_tp.min_w_nmos_;
g_tp.w_nmos_sa_mux= 6 * g_tp.min_w_nmos_;
if (ram_cell_tech_type == comm_dram) {
g_tp.max_w_nmos_dec = 8 * g_ip->F_sz_um;
g_tp.h_dec = 8; // in the unit of memory cell height
} else {
g_tp.max_w_nmos_dec = g_tp.max_w_nmos_;
g_tp.h_dec = 4; // in the unit of memory cell height
}
g_tp.peri_global.C_overlap = 0.2 * g_tp.peri_global.C_g_ideal;
g_tp.sram_cell.C_overlap = 0.2 * g_tp.sram_cell.C_g_ideal;
g_tp.cam_cell.C_overlap = 0.2 * g_tp.cam_cell.C_g_ideal;
g_tp.dram_acc.C_overlap = 0.2 * g_tp.dram_acc.C_g_ideal;
g_tp.dram_acc.R_nch_on = g_tp.dram_cell_Vdd / g_tp.dram_acc.I_on_n;
//g_tp.dram_acc.R_pch_on = g_tp.dram_cell_Vdd / g_tp.dram_acc.I_on_p;
g_tp.dram_wl.C_overlap = 0.2 * g_tp.dram_wl.C_g_ideal;
double gmn_sense_amp_latch = (mobility_eff_periph_global / 2) * g_tp.peri_global.C_ox * (g_tp.w_sense_n / g_tp.peri_global.l_elec) * Vdsat_periph_global;
double gmp_sense_amp_latch = gmp_to_gmn_multiplier_periph_global * gmn_sense_amp_latch;
g_tp.gm_sense_amp_latch = gmn_sense_amp_latch + gmp_sense_amp_latch;
g_tp.dram.b_w = sqrt(area_cell_dram / (asp_ratio_cell_dram));
g_tp.dram.b_h = asp_ratio_cell_dram * g_tp.dram.b_w;
g_tp.sram.b_w = sqrt(area_cell_sram / (asp_ratio_cell_sram));
g_tp.sram.b_h = asp_ratio_cell_sram * g_tp.sram.b_w;
g_tp.cam.b_w = sqrt(area_cell_cam / (asp_ratio_cell_cam));//Sheng
g_tp.cam.b_h = asp_ratio_cell_cam * g_tp.cam.b_w;
g_tp.dram.Vbitpre = g_tp.dram_cell_Vdd;
g_tp.sram.Vbitpre = vdd[ram_cell_tech_type];
g_tp.cam.Vbitpre = vdd[ram_cell_tech_type];//Sheng
pmos_to_nmos_sizing_r = pmos_to_nmos_sz_ratio();
g_tp.w_pmos_bl_precharge = 6 * pmos_to_nmos_sizing_r * g_tp.min_w_nmos_;
g_tp.w_pmos_bl_eq = pmos_to_nmos_sizing_r * g_tp.min_w_nmos_;
double wire_pitch [NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
wire_r_per_micron[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
wire_c_per_micron[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
horiz_dielectric_constant[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
vert_dielectric_constant[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
aspect_ratio[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
miller_value[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
ild_thickness[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES];
for (iter = 0; iter <= 1; ++iter) {
// linear interpolation
if (iter == 0) {
tech = tech_lo;
if (tech_lo == tech_hi) {
curr_alpha = 1;
} else {
curr_alpha = (technology - tech_hi) / (tech_lo - tech_hi);
}
} else {
tech = tech_hi;
if (tech_lo == tech_hi) {
break;
} else {
curr_alpha = (tech_lo - technology) / (tech_lo - tech_hi);
}
}
if (tech == 180) {
//Aggressive projections
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//micron
aspect_ratio[0][0] = 2.0;
wire_width = wire_pitch[0][0] / 2; //micron
wire_thickness = aspect_ratio[0][0] * wire_width;//micron
wire_spacing = wire_pitch[0][0] - wire_width;//micron
barrier_thickness = 0.017;//micron
dishing_thickness = 0;//micron
alpha_scatter = 1;
wire_r_per_micron[0][0] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);//ohm/micron
ild_thickness[0][0] = 0.75;//micron
miller_value[0][0] = 1.5;
horiz_dielectric_constant[0][0] = 2.709;
vert_dielectric_constant[0][0] = 3.9;
fringe_cap = 0.115e-15; //F/micron
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0],
vert_dielectric_constant[0][0],
fringe_cap);//F/micron.
wire_pitch[0][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[0][1] / 2;
aspect_ratio[0][1] = 2.4;
wire_thickness = aspect_ratio[0][1] * wire_width;
wire_spacing = wire_pitch[0][1] - wire_width;
wire_r_per_micron[0][1] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][1] = 0.75;//micron
miller_value[0][1] = 1.5;
horiz_dielectric_constant[0][1] = 2.709;
vert_dielectric_constant[0][1] = 3.9;
fringe_cap = 0.115e-15; //F/micron
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1],
vert_dielectric_constant[0][1],
fringe_cap);
wire_pitch[0][2] = 8 * g_ip->F_sz_um;
aspect_ratio[0][2] = 2.2;
wire_width = wire_pitch[0][2] / 2;
wire_thickness = aspect_ratio[0][2] * wire_width;
wire_spacing = wire_pitch[0][2] - wire_width;
wire_r_per_micron[0][2] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][2] = 1.5;
miller_value[0][2] = 1.5;
horiz_dielectric_constant[0][2] = 2.709;
vert_dielectric_constant[0][2] = 3.9;
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
fringe_cap);
//Conservative projections
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[1][0] = 2.0;
wire_width = wire_pitch[1][0] / 2;
wire_thickness = aspect_ratio[1][0] * wire_width;
wire_spacing = wire_pitch[1][0] - wire_width;
barrier_thickness = 0.017;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][0] = 0.75;
miller_value[1][0] = 1.5;
horiz_dielectric_constant[1][0] = 3.038;
vert_dielectric_constant[1][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0],
vert_dielectric_constant[1][0],
fringe_cap);
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[1][1] / 2;
aspect_ratio[1][1] = 2.0;
wire_thickness = aspect_ratio[1][1] * wire_width;
wire_spacing = wire_pitch[1][1] - wire_width;
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][1] = 0.75;
miller_value[1][1] = 1.5;
horiz_dielectric_constant[1][1] = 3.038;
vert_dielectric_constant[1][1] = 3.9;
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1],
vert_dielectric_constant[1][1],
fringe_cap);
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
aspect_ratio[1][2] = 2.2;
wire_width = wire_pitch[1][2] / 2;
wire_thickness = aspect_ratio[1][2] * wire_width;
wire_spacing = wire_pitch[1][2] - wire_width;
dishing_thickness = 0.1 * wire_thickness;
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][2] = 1.98;
miller_value[1][2] = 1.5;
horiz_dielectric_constant[1][2] = 3.038;
vert_dielectric_constant[1][2] = 3.9;
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][2] , miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
fringe_cap);
//Nominal projections for commodity DRAM wordline/bitline
wire_pitch[1][3] = 2 * 0.18;
wire_c_per_micron[1][3] = 60e-15 / (256 * 2 * 0.18);
wire_r_per_micron[1][3] = 12 / 0.18;
} else if (tech == 90) {
//Aggressive projections
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//micron
aspect_ratio[0][0] = 2.4;
wire_width = wire_pitch[0][0] / 2; //micron
wire_thickness = aspect_ratio[0][0] * wire_width;//micron
wire_spacing = wire_pitch[0][0] - wire_width;//micron
barrier_thickness = 0.01;//micron
dishing_thickness = 0;//micron
alpha_scatter = 1;
wire_r_per_micron[0][0] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);//ohm/micron
ild_thickness[0][0] = 0.48;//micron
miller_value[0][0] = 1.5;
horiz_dielectric_constant[0][0] = 2.709;
vert_dielectric_constant[0][0] = 3.9;
fringe_cap = 0.115e-15; //F/micron
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0],
vert_dielectric_constant[0][0],
fringe_cap);//F/micron.
wire_pitch[0][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[0][1] / 2;
aspect_ratio[0][1] = 2.4;
wire_thickness = aspect_ratio[0][1] * wire_width;
wire_spacing = wire_pitch[0][1] - wire_width;
wire_r_per_micron[0][1] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][1] = 0.48;//micron
miller_value[0][1] = 1.5;
horiz_dielectric_constant[0][1] = 2.709;
vert_dielectric_constant[0][1] = 3.9;
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1],
vert_dielectric_constant[0][1],
fringe_cap);
wire_pitch[0][2] = 8 * g_ip->F_sz_um;
aspect_ratio[0][2] = 2.7;
wire_width = wire_pitch[0][2] / 2;
wire_thickness = aspect_ratio[0][2] * wire_width;
wire_spacing = wire_pitch[0][2] - wire_width;
wire_r_per_micron[0][2] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][2] = 0.96;
miller_value[0][2] = 1.5;
horiz_dielectric_constant[0][2] = 2.709;
vert_dielectric_constant[0][2] = 3.9;
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
fringe_cap);
//Conservative projections
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[1][0] = 2.0;
wire_width = wire_pitch[1][0] / 2;
wire_thickness = aspect_ratio[1][0] * wire_width;
wire_spacing = wire_pitch[1][0] - wire_width;
barrier_thickness = 0.008;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][0] = 0.48;
miller_value[1][0] = 1.5;
horiz_dielectric_constant[1][0] = 3.038;
vert_dielectric_constant[1][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0],
vert_dielectric_constant[1][0],
fringe_cap);
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[1][1] / 2;
aspect_ratio[1][1] = 2.0;
wire_thickness = aspect_ratio[1][1] * wire_width;
wire_spacing = wire_pitch[1][1] - wire_width;
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][1] = 0.48;
miller_value[1][1] = 1.5;
horiz_dielectric_constant[1][1] = 3.038;
vert_dielectric_constant[1][1] = 3.9;
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1],
vert_dielectric_constant[1][1],
fringe_cap);
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
aspect_ratio[1][2] = 2.2;
wire_width = wire_pitch[1][2] / 2;
wire_thickness = aspect_ratio[1][2] * wire_width;
wire_spacing = wire_pitch[1][2] - wire_width;
dishing_thickness = 0.1 * wire_thickness;
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][2] = 1.1;
miller_value[1][2] = 1.5;
horiz_dielectric_constant[1][2] = 3.038;
vert_dielectric_constant[1][2] = 3.9;
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][2] , miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
fringe_cap);
//Nominal projections for commodity DRAM wordline/bitline
wire_pitch[1][3] = 2 * 0.09;
wire_c_per_micron[1][3] = 60e-15 / (256 * 2 * 0.09);
wire_r_per_micron[1][3] = 12 / 0.09;
} else if (tech == 65) {
//Aggressive projections
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[0][0] = 2.7;
wire_width = wire_pitch[0][0] / 2;
wire_thickness = aspect_ratio[0][0] * wire_width;
wire_spacing = wire_pitch[0][0] - wire_width;
barrier_thickness = 0;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][0] = 0.405;
miller_value[0][0] = 1.5;
horiz_dielectric_constant[0][0] = 2.303;
vert_dielectric_constant[0][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][0] , miller_value[0][0] , horiz_dielectric_constant[0][0] , vert_dielectric_constant[0][0] ,
fringe_cap);
wire_pitch[0][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[0][1] / 2;
aspect_ratio[0][1] = 2.7;
wire_thickness = aspect_ratio[0][1] * wire_width;
wire_spacing = wire_pitch[0][1] - wire_width;
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][1] = 0.405;
miller_value[0][1] = 1.5;
horiz_dielectric_constant[0][1] = 2.303;
vert_dielectric_constant[0][1] = 3.9;
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1],
vert_dielectric_constant[0][1],
fringe_cap);
wire_pitch[0][2] = 8 * g_ip->F_sz_um;
aspect_ratio[0][2] = 2.8;
wire_width = wire_pitch[0][2] / 2;
wire_thickness = aspect_ratio[0][2] * wire_width;
wire_spacing = wire_pitch[0][2] - wire_width;
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][2] = 0.81;
miller_value[0][2] = 1.5;
horiz_dielectric_constant[0][2] = 2.303;
vert_dielectric_constant[0][2] = 3.9;
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
fringe_cap);
//Conservative projections
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[1][0] = 2.0;
wire_width = wire_pitch[1][0] / 2;
wire_thickness = aspect_ratio[1][0] * wire_width;
wire_spacing = wire_pitch[1][0] - wire_width;
barrier_thickness = 0.006;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][0] = 0.405;
miller_value[1][0] = 1.5;
horiz_dielectric_constant[1][0] = 2.734;
vert_dielectric_constant[1][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
fringe_cap);
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[1][1] / 2;
aspect_ratio[1][1] = 2.0;
wire_thickness = aspect_ratio[1][1] * wire_width;
wire_spacing = wire_pitch[1][1] - wire_width;
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][1] = 0.405;
miller_value[1][1] = 1.5;
horiz_dielectric_constant[1][1] = 2.734;
vert_dielectric_constant[1][1] = 3.9;
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
fringe_cap);
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
aspect_ratio[1][2] = 2.2;
wire_width = wire_pitch[1][2] / 2;
wire_thickness = aspect_ratio[1][2] * wire_width;
wire_spacing = wire_pitch[1][2] - wire_width;
dishing_thickness = 0.1 * wire_thickness;
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][2] = 0.77;
miller_value[1][2] = 1.5;
horiz_dielectric_constant[1][2] = 2.734;
vert_dielectric_constant[1][2] = 3.9;
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
fringe_cap);
//Nominal projections for commodity DRAM wordline/bitline
wire_pitch[1][3] = 2 * 0.065;
wire_c_per_micron[1][3] = 52.5e-15 / (256 * 2 * 0.065);
wire_r_per_micron[1][3] = 12 / 0.065;
} else if (tech == 45) {
//Aggressive projections.
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[0][0] = 3.0;
wire_width = wire_pitch[0][0] / 2;
wire_thickness = aspect_ratio[0][0] * wire_width;
wire_spacing = wire_pitch[0][0] - wire_width;
barrier_thickness = 0;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][0] = 0.315;
miller_value[0][0] = 1.5;
horiz_dielectric_constant[0][0] = 1.958;
vert_dielectric_constant[0][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][0] , miller_value[0][0] , horiz_dielectric_constant[0][0] , vert_dielectric_constant[0][0] ,
fringe_cap);
wire_pitch[0][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[0][1] / 2;
aspect_ratio[0][1] = 3.0;
wire_thickness = aspect_ratio[0][1] * wire_width;
wire_spacing = wire_pitch[0][1] - wire_width;
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][1] = 0.315;
miller_value[0][1] = 1.5;
horiz_dielectric_constant[0][1] = 1.958;
vert_dielectric_constant[0][1] = 3.9;
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
fringe_cap);
wire_pitch[0][2] = 8 * g_ip->F_sz_um;
aspect_ratio[0][2] = 3.0;
wire_width = wire_pitch[0][2] / 2;
wire_thickness = aspect_ratio[0][2] * wire_width;
wire_spacing = wire_pitch[0][2] - wire_width;
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][2] = 0.63;
miller_value[0][2] = 1.5;
horiz_dielectric_constant[0][2] = 1.958;
vert_dielectric_constant[0][2] = 3.9;
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
fringe_cap);
//Conservative projections
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[1][0] = 2.0;
wire_width = wire_pitch[1][0] / 2;
wire_thickness = aspect_ratio[1][0] * wire_width;
wire_spacing = wire_pitch[1][0] - wire_width;
barrier_thickness = 0.004;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][0] = 0.315;
miller_value[1][0] = 1.5;
horiz_dielectric_constant[1][0] = 2.46;
vert_dielectric_constant[1][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
fringe_cap);
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[1][1] / 2;
aspect_ratio[1][1] = 2.0;
wire_thickness = aspect_ratio[1][1] * wire_width;
wire_spacing = wire_pitch[1][1] - wire_width;
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][1] = 0.315;
miller_value[1][1] = 1.5;
horiz_dielectric_constant[1][1] = 2.46;
vert_dielectric_constant[1][1] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
fringe_cap);
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
aspect_ratio[1][2] = 2.2;
wire_width = wire_pitch[1][2] / 2;
wire_thickness = aspect_ratio[1][2] * wire_width;
wire_spacing = wire_pitch[1][2] - wire_width;
dishing_thickness = 0.1 * wire_thickness;
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][2] = 0.55;
miller_value[1][2] = 1.5;
horiz_dielectric_constant[1][2] = 2.46;
vert_dielectric_constant[1][2] = 3.9;
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
fringe_cap);
//Nominal projections for commodity DRAM wordline/bitline
wire_pitch[1][3] = 2 * 0.045;
wire_c_per_micron[1][3] = 37.5e-15 / (256 * 2 * 0.045);
wire_r_per_micron[1][3] = 12 / 0.045;
} else if (tech == 32) {
//Aggressive projections.
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[0][0] = 3.0;
wire_width = wire_pitch[0][0] / 2;
wire_thickness = aspect_ratio[0][0] * wire_width;
wire_spacing = wire_pitch[0][0] - wire_width;
barrier_thickness = 0;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][0] = 0.21;
miller_value[0][0] = 1.5;
horiz_dielectric_constant[0][0] = 1.664;
vert_dielectric_constant[0][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0], vert_dielectric_constant[0][0],
fringe_cap);
wire_pitch[0][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[0][1] / 2;
aspect_ratio[0][1] = 3.0;
wire_thickness = aspect_ratio[0][1] * wire_width;
wire_spacing = wire_pitch[0][1] - wire_width;
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][1] = 0.21;
miller_value[0][1] = 1.5;
horiz_dielectric_constant[0][1] = 1.664;
vert_dielectric_constant[0][1] = 3.9;
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
fringe_cap);
wire_pitch[0][2] = 8 * g_ip->F_sz_um;
aspect_ratio[0][2] = 3.0;
wire_width = wire_pitch[0][2] / 2;
wire_thickness = aspect_ratio[0][2] * wire_width;
wire_spacing = wire_pitch[0][2] - wire_width;
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][2] = 0.42;
miller_value[0][2] = 1.5;
horiz_dielectric_constant[0][2] = 1.664;
vert_dielectric_constant[0][2] = 3.9;
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
fringe_cap);
//Conservative projections
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[1][0] = 2.0;
wire_width = wire_pitch[1][0] / 2;
wire_thickness = aspect_ratio[1][0] * wire_width;
wire_spacing = wire_pitch[1][0] - wire_width;
barrier_thickness = 0.003;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][0] = 0.21;
miller_value[1][0] = 1.5;
horiz_dielectric_constant[1][0] = 2.214;
vert_dielectric_constant[1][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
fringe_cap);
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
aspect_ratio[1][1] = 2.0;
wire_width = wire_pitch[1][1] / 2;
wire_thickness = aspect_ratio[1][1] * wire_width;
wire_spacing = wire_pitch[1][1] - wire_width;
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][1] = 0.21;
miller_value[1][1] = 1.5;
horiz_dielectric_constant[1][1] = 2.214;
vert_dielectric_constant[1][1] = 3.9;
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
fringe_cap);
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
aspect_ratio[1][2] = 2.2;
wire_width = wire_pitch[1][2] / 2;
wire_thickness = aspect_ratio[1][2] * wire_width;
wire_spacing = wire_pitch[1][2] - wire_width;
dishing_thickness = 0.1 * wire_thickness;
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][2] = 0.385;
miller_value[1][2] = 1.5;
horiz_dielectric_constant[1][2] = 2.214;
vert_dielectric_constant[1][2] = 3.9;
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
fringe_cap);
//Nominal projections for commodity DRAM wordline/bitline
wire_pitch[1][3] = 2 * 0.032;//micron
wire_c_per_micron[1][3] = 31e-15 / (256 * 2 * 0.032);//F/micron
wire_r_per_micron[1][3] = 12 / 0.032;//ohm/micron
} else if (tech == 22) {
//Aggressive projections.
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//local
aspect_ratio[0][0] = 3.0;
wire_width = wire_pitch[0][0] / 2;
wire_thickness = aspect_ratio[0][0] * wire_width;
wire_spacing = wire_pitch[0][0] - wire_width;
barrier_thickness = 0;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][0] = 0.15;
miller_value[0][0] = 1.5;
horiz_dielectric_constant[0][0] = 1.414;
vert_dielectric_constant[0][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0], vert_dielectric_constant[0][0],
fringe_cap);
wire_pitch[0][1] = 4 * g_ip->F_sz_um;//semi-global
wire_width = wire_pitch[0][1] / 2;
aspect_ratio[0][1] = 3.0;
wire_thickness = aspect_ratio[0][1] * wire_width;
wire_spacing = wire_pitch[0][1] - wire_width;
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][1] = 0.15;
miller_value[0][1] = 1.5;
horiz_dielectric_constant[0][1] = 1.414;
vert_dielectric_constant[0][1] = 3.9;
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
fringe_cap);
wire_pitch[0][2] = 8 * g_ip->F_sz_um;//global
aspect_ratio[0][2] = 3.0;
wire_width = wire_pitch[0][2] / 2;
wire_thickness = aspect_ratio[0][2] * wire_width;
wire_spacing = wire_pitch[0][2] - wire_width;
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][2] = 0.3;
miller_value[0][2] = 1.5;
horiz_dielectric_constant[0][2] = 1.414;
vert_dielectric_constant[0][2] = 3.9;
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
fringe_cap);
//Conservative projections
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[1][0] = 2.0;
wire_width = wire_pitch[1][0] / 2;
wire_thickness = aspect_ratio[1][0] * wire_width;
wire_spacing = wire_pitch[1][0] - wire_width;
barrier_thickness = 0.003;
dishing_thickness = 0;
alpha_scatter = 1.05;
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][0] = 0.15;
miller_value[1][0] = 1.5;
horiz_dielectric_constant[1][0] = 2.104;
vert_dielectric_constant[1][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
fringe_cap);
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[1][1] / 2;
aspect_ratio[1][1] = 2.0;
wire_thickness = aspect_ratio[1][1] * wire_width;
wire_spacing = wire_pitch[1][1] - wire_width;
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][1] = 0.15;
miller_value[1][1] = 1.5;
horiz_dielectric_constant[1][1] = 2.104;
vert_dielectric_constant[1][1] = 3.9;
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
fringe_cap);
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
aspect_ratio[1][2] = 2.2;
wire_width = wire_pitch[1][2] / 2;
wire_thickness = aspect_ratio[1][2] * wire_width;
wire_spacing = wire_pitch[1][2] - wire_width;
dishing_thickness = 0.1 * wire_thickness;
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][2] = 0.275;
miller_value[1][2] = 1.5;
horiz_dielectric_constant[1][2] = 2.104;
vert_dielectric_constant[1][2] = 3.9;
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
fringe_cap);
//Nominal projections for commodity DRAM wordline/bitline
wire_pitch[1][3] = 2 * 0.022;//micron
wire_c_per_micron[1][3] = 31e-15 / (256 * 2 * 0.022);//F/micron
wire_r_per_micron[1][3] = 12 / 0.022;//ohm/micron
}
else if (tech == 16) {
//Aggressive projections.
wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//local
aspect_ratio[0][0] = 3.0;
wire_width = wire_pitch[0][0] / 2;
wire_thickness = aspect_ratio[0][0] * wire_width;
wire_spacing = wire_pitch[0][0] - wire_width;
barrier_thickness = 0;
dishing_thickness = 0;
alpha_scatter = 1;
wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][0] = 0.108;
miller_value[0][0] = 1.5;
horiz_dielectric_constant[0][0] = 1.202;
vert_dielectric_constant[0][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0], vert_dielectric_constant[0][0],
fringe_cap);
wire_pitch[0][1] = 4 * g_ip->F_sz_um;//semi-global
aspect_ratio[0][1] = 3.0;
wire_width = wire_pitch[0][1] / 2;
wire_thickness = aspect_ratio[0][1] * wire_width;
wire_spacing = wire_pitch[0][1] - wire_width;
wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][1] = 0.108;
miller_value[0][1] = 1.5;
horiz_dielectric_constant[0][1] = 1.202;
vert_dielectric_constant[0][1] = 3.9;
wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
fringe_cap);
wire_pitch[0][2] = 8 * g_ip->F_sz_um;//global
aspect_ratio[0][2] = 3.0;
wire_width = wire_pitch[0][2] / 2;
wire_thickness = aspect_ratio[0][2] * wire_width;
wire_spacing = wire_pitch[0][2] - wire_width;
wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[0][2] = 0.216;
miller_value[0][2] = 1.5;
horiz_dielectric_constant[0][2] = 1.202;
vert_dielectric_constant[0][2] = 3.9;
wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
fringe_cap);
//Conservative projections
wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
aspect_ratio[1][0] = 2.0;
wire_width = wire_pitch[1][0] / 2;
wire_thickness = aspect_ratio[1][0] * wire_width;
wire_spacing = wire_pitch[1][0] - wire_width;
barrier_thickness = 0.002;
dishing_thickness = 0;
alpha_scatter = 1.05;
wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][0] = 0.108;
miller_value[1][0] = 1.5;
horiz_dielectric_constant[1][0] = 1.998;
vert_dielectric_constant[1][0] = 3.9;
fringe_cap = 0.115e-15;
wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
fringe_cap);
wire_pitch[1][1] = 4 * g_ip->F_sz_um;
wire_width = wire_pitch[1][1] / 2;
aspect_ratio[1][1] = 2.0;
wire_thickness = aspect_ratio[1][1] * wire_width;
wire_spacing = wire_pitch[1][1] - wire_width;
wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][1] = 0.108;
miller_value[1][1] = 1.5;
horiz_dielectric_constant[1][1] = 1.998;
vert_dielectric_constant[1][1] = 3.9;
wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
fringe_cap);
wire_pitch[1][2] = 8 * g_ip->F_sz_um;
aspect_ratio[1][2] = 2.2;
wire_width = wire_pitch[1][2] / 2;
wire_thickness = aspect_ratio[1][2] * wire_width;
wire_spacing = wire_pitch[1][2] - wire_width;
dishing_thickness = 0.1 * wire_thickness;
wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
ild_thickness[1][2] = 0.198;
miller_value[1][2] = 1.5;
horiz_dielectric_constant[1][2] = 1.998;
vert_dielectric_constant[1][2] = 3.9;
wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
fringe_cap);
//Nominal projections for commodity DRAM wordline/bitline
wire_pitch[1][3] = 2 * 0.016;//micron
wire_c_per_micron[1][3] = 31e-15 / (256 * 2 * 0.016);//F/micron
wire_r_per_micron[1][3] = 12 / 0.016;//ohm/micron
}
g_tp.wire_local.pitch += curr_alpha *
wire_pitch[g_ip->ic_proj_type]
[(ram_cell_tech_type == comm_dram) ? 3 : 0];
g_tp.wire_local.R_per_um += curr_alpha *
wire_r_per_micron[g_ip->ic_proj_type]
[(ram_cell_tech_type == comm_dram) ? 3 : 0];
g_tp.wire_local.C_per_um += curr_alpha *
wire_c_per_micron[g_ip->ic_proj_type]
[(ram_cell_tech_type == comm_dram) ? 3 : 0];
g_tp.wire_local.aspect_ratio += curr_alpha *
aspect_ratio[g_ip->ic_proj_type]
[(ram_cell_tech_type == comm_dram) ? 3 : 0];
g_tp.wire_local.ild_thickness += curr_alpha *
ild_thickness[g_ip->ic_proj_type]
[(ram_cell_tech_type == comm_dram) ? 3 : 0];
g_tp.wire_local.miller_value += curr_alpha *
miller_value[g_ip->ic_proj_type]
[(ram_cell_tech_type == comm_dram) ? 3 : 0];
g_tp.wire_local.horiz_dielectric_constant += curr_alpha *
horiz_dielectric_constant[g_ip->ic_proj_type]
[(ram_cell_tech_type == comm_dram) ? 3 : 0];
g_tp.wire_local.vert_dielectric_constant += curr_alpha *
vert_dielectric_constant[g_ip->ic_proj_type]
[(ram_cell_tech_type == comm_dram) ? 3 : 0];
g_tp.wire_inside_mat.pitch += curr_alpha *
wire_pitch[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
g_tp.wire_inside_mat.R_per_um += curr_alpha *
wire_r_per_micron[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
g_tp.wire_inside_mat.C_per_um += curr_alpha *
wire_c_per_micron[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
g_tp.wire_inside_mat.aspect_ratio += curr_alpha *
aspect_ratio[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
g_tp.wire_inside_mat.ild_thickness += curr_alpha *
ild_thickness[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
g_tp.wire_inside_mat.miller_value += curr_alpha *
miller_value[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
g_tp.wire_inside_mat.horiz_dielectric_constant += curr_alpha *
horiz_dielectric_constant[g_ip->ic_proj_type]
[g_ip->wire_is_mat_type];
g_tp.wire_inside_mat.vert_dielectric_constant += curr_alpha *
vert_dielectric_constant [g_ip->ic_proj_type]
[g_ip->wire_is_mat_type];
g_tp.wire_outside_mat.pitch += curr_alpha *
wire_pitch[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
g_tp.wire_outside_mat.R_per_um += curr_alpha *
wire_r_per_micron[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
g_tp.wire_outside_mat.C_per_um += curr_alpha *
wire_c_per_micron[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
g_tp.wire_outside_mat.aspect_ratio += curr_alpha *
aspect_ratio[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
g_tp.wire_outside_mat.ild_thickness += curr_alpha *
ild_thickness[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
g_tp.wire_outside_mat.miller_value += curr_alpha *
miller_value[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
g_tp.wire_outside_mat.horiz_dielectric_constant += curr_alpha *
horiz_dielectric_constant[g_ip->ic_proj_type]
[g_ip->wire_os_mat_type];
g_tp.wire_outside_mat.vert_dielectric_constant += curr_alpha *
vert_dielectric_constant [g_ip->ic_proj_type]
[g_ip->wire_os_mat_type];
g_tp.unit_len_wire_del = g_tp.wire_inside_mat.R_per_um *
g_tp.wire_inside_mat.C_per_um / 2;
g_tp.sense_delay += curr_alpha * SENSE_AMP_D;
g_tp.sense_dy_power += curr_alpha * SENSE_AMP_P;
}
g_tp.fringe_cap = fringe_cap;
double rd = tr_R_on(g_tp.min_w_nmos_, NCH, 1);
double p_to_n_sizing_r = pmos_to_nmos_sz_ratio();
double c_load = gate_C(g_tp.min_w_nmos_ * (1 + p_to_n_sizing_r), 0.0);
double tf = rd * c_load;
g_tp.kinv = horowitz(0, tf, 0.5, 0.5, RISE);
double KLOAD = 1;
c_load = KLOAD * (drain_C_(g_tp.min_w_nmos_, NCH, 1, 1, g_tp.cell_h_def) +
drain_C_(g_tp.min_w_nmos_ * p_to_n_sizing_r, PCH, 1, 1, g_tp.cell_h_def) +
gate_C(g_tp.min_w_nmos_ * 4 * (1 + p_to_n_sizing_r), 0.0));
tf = rd * c_load;
g_tp.FO4 = horowitz(0, tf, 0.5, 0.5, RISE);
}